JPH11335184A - Joined structure of ceramic and metal - Google Patents
Joined structure of ceramic and metalInfo
- Publication number
- JPH11335184A JPH11335184A JP14091998A JP14091998A JPH11335184A JP H11335184 A JPH11335184 A JP H11335184A JP 14091998 A JP14091998 A JP 14091998A JP 14091998 A JP14091998 A JP 14091998A JP H11335184 A JPH11335184 A JP H11335184A
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- Prior art keywords
- metal
- ceramic
- joined
- brazing material
- powder
- Prior art date
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- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、酸化アルミニウム
質焼結体や窒化アルミニウム質焼結体等のセラミックス
に銅等の金属をＴｉ、Ｚｒ、Ｈｆ等の活性金属を含有す
るＡｇ−Ｃｕ合金から成るろう材で接合したセラミック
ス−金属接合構造に関するものである。BACKGROUND OF THE INVENTION The present invention relates to a ceramic such as an aluminum oxide sintered body or an aluminum nitride sintered body, in which a metal such as copper is converted from an Ag-Cu alloy containing an active metal such as Ti, Zr or Hf. The present invention relates to a ceramic-metal joint structure joined with a brazing material.
【０００２】[0002]
【従来の技術】セラミックスと金属とを接合したセラミ
ックス−金属接合構造として、セラミックスと金属とを
ＴｉやＺｒ、Ｈｆ等の活性金属を含有するＡｇ−Ｃｕ合
金から成るろう材を介して接合したものが知られてい
る。2. Description of the Related Art As a ceramic-metal bonding structure in which a ceramic and a metal are bonded, a ceramic and a metal are bonded via a brazing material made of an Ag-Cu alloy containing an active metal such as Ti, Zr, or Hf. It has been known.
【０００３】このようなセラミックス−金属接合構造
は、例えば酸化アルミニウム質焼結体や窒化アルミニウ
ム質焼結体等のセラミックスから成る絶縁基体に銅等の
金属から成る回路導体を接合させた回路基板において、
絶縁基体と回路導体とを接合するセラミックス−金属接
合構造として用いられている。[0003] Such a ceramic-metal bonding structure is used in a circuit board in which a circuit conductor made of a metal such as copper is joined to an insulating base made of a ceramic such as an aluminum oxide sintered body or an aluminum nitride sintered body. ,
It is used as a ceramic-metal bonding structure for bonding an insulating base and a circuit conductor.
【０００４】ところが、酸化アルミニウム質焼結体や窒
化アルミニウム質焼結体等のセラミックスと銅等の金属
とでは、その熱膨張係数がセラミックスでは約４〜７×
10-6／℃であるのに対して金属では約15〜20×10-6／℃
と大きく相違することから、このセラミックス−金属接
合構造が例えば−40〜125 ℃の熱サイクルに繰り返し曝
されると、セラミックスと金属との間に両者の熱膨張係
数の相違に起因して発生する熱応力の作用により金属が
セラミックスから剥離してしまったり、あるいはセラミ
ックスにクラックが発生して、金属をセラミックスに強
固に接合することができないという欠点を有していた。However, a ceramic such as an aluminum oxide sintered body or an aluminum nitride sintered body and a metal such as copper have a thermal expansion coefficient of about 4 to 7 ×.
10 -6 / about 15 to 20 × 10 -6 / ° C. is a is a metal whereas ° C.
When the ceramic-metal joint structure is repeatedly exposed to a thermal cycle of, for example, -40 to 125 ° C., the ceramic-metal joint is generated due to a difference in thermal expansion coefficient between the ceramic and the metal. There is a disadvantage that the metal is peeled off from the ceramic due to the action of thermal stress, or a crack is generated in the ceramic, so that the metal cannot be firmly joined to the ceramic.
【０００５】そこで、ＴｉやＺｒ、Ｈｆ等の活性金属を
含有するＡｇ−Ｃｕ合金からなるろう材中にＭｏやＷ等
の高融点金属粉末を含有させて成るろう材を介してセラ
ミックスと金属とを接合するセラミックス−金属接合構
造が提案されている。[0005] Therefore, ceramics and metal are interposed through a brazing filler metal comprising a high melting point metal powder such as Mo or W in a brazing filler metal comprising an Ag-Cu alloy containing an active metal such as Ti, Zr or Hf. Have been proposed for joining ceramics to metal.
【０００６】このようにＴｉやＺｒ、Ｈｆ等の活性金属
を含有するＡｇ−Ｃｕ合金からなるろう材中にＭｏやＷ
等の高融点金属粉末を含有させたろう材でセラミックス
と金属とを接合すると、セラミックスと金属との間に両
者の熱膨張係数の相違に起因して応力が発生したとして
も、この応力はＭｏやＷ等の高融点金属粉末を含有させ
た前記ろう材により良好に吸収され、金属がセラミック
スから剥離したり、セラミックスにクラックが発生する
のを有効に防止することができる。これは、ＴｉやＺ
ｒ、Ｈｆ等の活性金属を含有するＡｇ−Ｃｕ合金からな
るろう材中にＭｏやＷ等の高融点金属粉末を含有させる
ことにより、ろう材の応力吸収能力が高まるためである
と考えられる。[0006] As described above, Mo or W is contained in the brazing material made of an Ag-Cu alloy containing an active metal such as Ti, Zr or Hf.
When a ceramic and a metal are joined by a brazing filler metal containing a high melting point metal powder, even if stress is generated between the ceramic and the metal due to a difference in thermal expansion coefficient between the ceramic and the metal, the stress is reduced to Mo or It is well absorbed by the brazing material containing a high melting point metal powder such as W, and can effectively prevent the metal from peeling off the ceramics and cracking of the ceramics. This is Ti or Z
This is considered to be because the stress absorbing ability of the brazing material is increased by including a high melting point metal powder such as Mo or W in a brazing material made of an Ag-Cu alloy containing an active metal such as r or Hf.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、このよ
うにＴｉやＺｒ、Ｈｆ等の活性金属を含有するＡｇ−Ｃ
ｕ合金からなるろう材中にＭｏやＷ等の高融点金属粉末
を含有させたろう材を介してセラミックスと金属とを接
合させたセラミックス−金属接合構造によると、ろう材
の応力吸収能力が高まって、金属がセラミックスから剥
離したりセラミックスにクラックが発生したりするのを
有効に防止することができるものの、ＭｏやＷ等の高融
点金属粉末の影響でろう材表面に凹凸やボイドが発生し
易く、そのためろう材表面の凹凸やボイドに大気中の水
分が浸入してろう材に腐食を発生させてしまい易いとい
う問題点があった。However, Ag-C containing active metals such as Ti, Zr, Hf, etc.
According to the ceramic-metal bonding structure in which ceramics and metal are bonded via a brazing filler metal containing a high melting point metal powder such as Mo or W in a brazing filler metal made of a u alloy, the stress absorbing capability of the brazing filler metal increases. However, it is possible to effectively prevent the metal from peeling off from the ceramics and to prevent the ceramics from cracking. However, irregularities and voids are easily generated on the surface of the brazing material due to the effect of the high melting point metal powder such as Mo and W. Therefore, there has been a problem that moisture in the air enters the irregularities and voids on the surface of the brazing material, causing corrosion of the brazing material.
【０００８】本発明はかかる問題点を解決すべく案出さ
れたものであり、その目的は、セラミックスと金属とが
強固に接合されるとともにろう材の表面に凹凸やボイド
が形成されることがなくろう材に腐食が起こりにくいセ
ラミックス−金属接合構造を提供することにある。The present invention has been devised in order to solve such a problem. It is an object of the present invention to provide a method in which a ceramic and a metal are firmly joined and irregularities and voids are formed on the surface of a brazing material. Another object of the present invention is to provide a ceramic-metal joint structure in which corrosion does not easily occur in the brazing material.
【０００９】[0009]
【課題を解決するための手段】本発明のセラミックス−
金属接合構造は、セラミックスと金属との接合面をＴ
ｉ、Ｚｒ、Ｈｆの少なくとも一種を含有するＡｇ−Ｃｕ
合金から成るろう材で接合したセラミックス−金属接合
構造であって、前記ろう材は前記接合面の中央領域のみ
にＭｏまたはＷが含有されていることを特徴とするもの
である。Means for Solving the Problems Ceramics of the present invention
The metal joint structure uses T
Ag-Cu containing at least one of i, Zr and Hf
A ceramic-metal joint structure joined by a brazing material made of an alloy, wherein the brazing material contains Mo or W only in a central region of the joining surface.
【００１０】本発明のセラミックス−金属接合構造によ
れば、セラミックスと金属とを接合するＴｉ、Ｚｒ、Ｈ
ｆの少なくとも一種を含有するＡｇ−Ｃｕ合金からなる
ろう材は、セラミックスと金属との接合面の中央領域の
みにＭｏまたはＷが含有されていることから、この中央
領域に含有されたＭｏまたはＷの作用によりその応力吸
収能力が高く、かつ、外周領域で露出しているろう材表
面にはＭｏやＷがないので凹凸やボイドが形成されるこ
とがない。そのため、接合部位のろう材に腐食を発生さ
せてしまうことがなくなる。According to the ceramic-metal joining structure of the present invention, Ti, Zr, H for joining ceramic and metal are used.
Since the brazing material made of an Ag—Cu alloy containing at least one of f contains Mo or W only in the central region of the joint surface between the ceramic and the metal, Mo or W contained in this central region is contained. , The stress absorbing ability is high, and since there is no Mo or W on the surface of the brazing material exposed in the outer peripheral region, no irregularities or voids are formed. Therefore, corrosion does not occur in the brazing material at the joining portion.
【００１１】[0011]
【発明の実施の形態】次に、本発明のセラミックス−金
属接合構造を添付の図面に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a ceramic-metal bonding structure of the present invention will be described with reference to the accompanying drawings.
【００１２】図１は本発明のセラミックス−金属接合構
造の実施の形態の一例を示す断面図であり、１は酸化ア
ルミニウム質焼結体や窒化アルミニウム質焼結体等のセ
ラミックス、２は銅等の金属である。FIG. 1 is a sectional view showing an embodiment of a ceramic-metal bonding structure according to the present invention, wherein 1 is a ceramic such as an aluminum oxide sintered body or an aluminum nitride sintered body, and 2 is copper or the like. Metal.
【００１３】そして、セラミックス１と金属２とは、Ｔ
ｉ、Ｚｒ、Ｈｆの少なくとも一種を含有するＡｇ−Ｃｕ
合金からなるろう材３を介して接合されている。The ceramic 1 and the metal 2 are T
Ag-Cu containing at least one of i, Zr and Hf
It is joined via a brazing material 3 made of an alloy.
【００１４】Ｔｉ、Ｚｒ、Ｈｆの少なくとも一種を含有
するＡｇ−Ｃｕ合金からなるろう材３は、例えばＡｇが
28〜90重量％、Ｃｕが４〜57重量％、Ｔｉ、Ｚｒ、Ｈｆ
の少なくとも一種が５〜30重量％のろう材が適用され得
る。なお、ろう材３は、Ｔｉ、Ｚｒ、Ｈｆの少なくとも
一種が水素化物の形で含有されていてもよく、さらには
Ｉｎ、Ｓｎの少なくとも一種を１〜15重量％程度含有し
ていてもよい。The brazing material 3 made of an Ag—Cu alloy containing at least one of Ti, Zr and Hf is, for example, Ag
28-90% by weight, 4-57% by weight of Cu, Ti, Zr, Hf
Of at least one of 5 to 30% by weight can be applied. The brazing material 3 may contain at least one of Ti, Zr and Hf in the form of a hydride, and may further contain at least one of In and Sn at about 1 to 15% by weight.
【００１５】そして、ろう材３は、セラミックス１と金
属２との接合面の中央領域ＡにＭｏまたはＷの粉末を含
有している。The brazing material 3 contains Mo or W powder in the central region A of the joint surface between the ceramics 1 and the metal 2.
【００１６】ろう材３は、セラミックス１と金属２との
接合面の中央領域ＡにＭｏまたはＷの粉末を含有するこ
とにより、その応力吸収能力が高まっている。従って、
このセラミックス−金属接合構造が−40〜125 ℃の温度
サイクルに繰り返し曝されたとしても、金属２がセラミ
ックス１から剥離したり、セラミックス１にクラックが
発生したりすることを有効に防止することができる。Since the brazing material 3 contains Mo or W powder in the central region A of the joint surface between the ceramics 1 and the metal 2, the stress absorbing ability is increased. Therefore,
Even if this ceramic-metal joint structure is repeatedly exposed to a temperature cycle of -40 to 125 ° C., it is possible to effectively prevent the metal 2 from peeling off from the ceramic 1 and the occurrence of cracks in the ceramic 1. it can.
【００１７】この場合、セラミックス１と金属２との接
合面の中央領域Ａのろう材３に含有されるＭｏまたはＷ
は、粒径が5.0 μｍ以下が好適であり、セラミックス１
と金属２との接合面の中央領域Ａのろう材３中に0.5 〜
30重量％程度含有されることが好適である。In this case, Mo or W contained in the brazing material 3 in the central region A of the joining surface between the ceramics 1 and the metal 2 is used.
It is preferable that the particle size is 5.0 μm or less.
In the brazing material 3 in the central area A of the joining surface between the metal and the metal 2.
It is preferable to contain about 30% by weight.
【００１８】また、ろう材３は、セラミックス１と金属
２との接合面の中央領域ＡにのみＭｏまたはＷの粉末が
含有されており、セラミックス１と金属２との接合面の
外周領域ＢにはＭｏまたはＷの粉末が含有されていな
い。従って、ろう材３の表面にＭｏまたはＷの粉末の影
響による凹凸やボイドが発生することはなく、そのため
ろう材３が腐食しにくい。なお、ろう材３中にＭｏまた
はＷの粉末を含有しない外周領域Ｂの幅は0.5 〜1.0 ｍ
ｍ程度が好ましい。The brazing material 3 contains Mo or W powder only in the central region A of the joint surface between the ceramics 1 and the metal 2 and in the outer peripheral region B of the joint surface between the ceramics 1 and the metal 2. Does not contain Mo or W powder. Therefore, no irregularities or voids are generated on the surface of the brazing material 3 due to the influence of the Mo or W powder, and therefore, the brazing material 3 is hardly corroded. The width of the outer peripheral region B in which the Mo or W powder is not contained in the brazing material 3 is 0.5 to 1.0 m.
m is preferable.
【００１９】また、セラミックス１に金属２をろう材３
を介して接合するには、図２に断面図で示すように、セ
ラミックス１の上面であって、金属２との接合面の中央
領域に粒径が10μｍ以下のＡｇ−Ｃｕ合金粉末と粒径が
50μｍ以下のＴｉ、Ｚｒ、Ｈｆの少なくとも一種とから
なるろう材ペースト中に粒径が５μｍ以下のＭｏまたは
Ｗの粉末を含有させたろう材ペースト３ａを印刷塗布す
るとともに、金属２との接合面の外周領域に粒径が10μ
ｍ以下のＡｇ−Ｃｕ合金粉末と粒径が50μｍ以下のＴ
ｉ、Ｚｒ、Ｈｆの少なくとも一種から成るろう材ペース
ト中にＭｏまたはＷの粉末を含有しないろう材ペースト
３ｂを、ろう材ペースト３ａを取り囲むようにして印刷
塗布し、しかる後、このろう材ペースト３ａ・３ｂ上に
金属２を載置し、これを真空雰囲気中約700 〜900 ℃の
温度で焼成する方法が採用される。Also, a metal 2 is added to a ceramic 1 by a brazing material 3.
As shown in the cross-sectional view of FIG. 2, an Ag—Cu alloy powder having a particle size of 10 μm or less But
A brazing material paste 3a containing a powder of Mo or W having a particle size of 5 μm or less in a brazing material paste comprising at least one of Ti, Zr, and Hf of 50 μm or less is printed and applied. Particle size of 10μ in outer peripheral area
Ag-Cu alloy powder with a particle size of 50 μm or less
A brazing paste 3b containing no Mo or W powder in a brazing paste composed of at least one of i, Zr, and Hf is printed and applied so as to surround the brazing paste 3a, and then the brazing paste 3a is formed. A method is adopted in which the metal 2 is placed on 3b and fired at a temperature of about 700 to 900 ° C. in a vacuum atmosphere.
【００２０】[0020]
【実施例】まず、窒化アルミニウム質焼結体からなる幅
27ｍｍ、長さ60ｍｍ、厚さ0.6 ｍｍの平板状のセラミッ
クス板を多数個用意した。EXAMPLE First, the width of the aluminum nitride sintered body
A large number of flat ceramic plates having a size of 27 mm, a length of 60 mm and a thickness of 0.6 mm were prepared.
【００２１】そして、このセラミックス板の上面で外周
端から1.0 ｍｍ〜2.0 ｍｍの領域に表１に示す第１ろう
材を、および外周端から2.0 ｍｍを除く中央領域に表１
に示す第２ろう材をそれぞれペースト状にしてスクリー
ン印刷法により50μｍの厚さに印刷塗布した。Then, the first brazing material shown in Table 1 is placed on the upper surface of the ceramic plate in a range of 1.0 mm to 2.0 mm from the outer peripheral end, and the first brazing material is placed in the central region excluding 2.0 mm from the outer peripheral end.
The second brazing materials shown in Table 3 were each formed into a paste and printed and applied to a thickness of 50 μm by a screen printing method.
【００２２】次に、このセラミックス板上に幅25ｍｍ、
長さ58ｍｍ、厚さ0.2 ｍｍの銅板をろう材と重なるよう
にして載置し、これを真空雰囲気中で焼成することによ
り、セラミックス−金属接合体の試料をそれぞれ５個ず
つ得た。Next, a width of 25 mm was placed on the ceramic plate.
A copper plate having a length of 58 mm and a thickness of 0.2 mm was placed so as to overlap the brazing material, and was fired in a vacuum atmosphere to obtain five samples of the ceramic-metal joined body.
【００２３】そして、これら試料におけるろう材の露出
表面を10倍の顕微鏡で観察して凹凸やボイドの有無を調
べるとともに、これらの試料を−40〜125 ℃の温度サイ
クルに30サイクル曝した後、セラミックス板から銅板が
剥がれたりセラミックス板にクラックが発生していない
かを目視により調べた。その結果を表１に示す。Then, the exposed surface of the brazing material in each of these samples was observed under a microscope of 10 magnifications to check for any irregularities or voids, and after exposing these samples to a temperature cycle of -40 to 125 ° C. for 30 cycles, It was visually inspected whether the copper plate was peeled off from the ceramic plate or cracks did not occur in the ceramic plate. Table 1 shows the results.
【００２４】なお、表１において、試料番号９および10
は本発明の実施例と比較するための比較例であって、試
料番号９はセラミックス板と銅板との接合面の全面がＭ
ｏまたはＷの粉末を含まないろう材で接合されているも
のであり、試料番号10はセラミックス板と銅板との接合
面の全面がＭｏまたはＷの粉末を含むろう材で接合され
ているものである。In Table 1, sample numbers 9 and 10
Is a comparative example for comparison with the embodiment of the present invention, and the sample No. 9 has M
Sample No. 10 in which the entire surface of the joining surface between the ceramic plate and the copper plate is joined with a brazing material containing Mo or W powder is used. is there.
【００２５】[0025]
【表１】 [Table 1]
【００２６】[0026]
【発明の効果】表１に示した本発明の実施例である試料
番号１〜８の結果から分かるように、本発明のセラミッ
クス−金属接合構造によれば、−40〜125 ℃の温度サイ
クルに繰り返し曝されたとしても金属がセラミックスか
ら剥離したりセラミックスにクラックが発生したりする
ことはなく、セラミックスと金属とが強固に接合される
とともに、ろう材の表面に凹凸やボイドが形成されるこ
とがなくろう材に腐食が起こりにくいセラミックス−金
属接合構造を得ることができる。As can be seen from the results of Sample Nos. 1 to 8 of the embodiments of the present invention shown in Table 1, according to the ceramic-metal bonding structure of the present invention, the temperature cycle of -40 to 125 ° C. Even if repeatedly exposed, the metal does not peel off from the ceramic or cracks occur in the ceramic, and the ceramic and the metal are firmly joined and irregularities and voids are formed on the surface of the brazing material Thus, it is possible to obtain a ceramic-metal joint structure in which corrosion is less likely to occur in the brazing filler metal without the occurrence of any.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明のセラミックス−金属接合構造の実施の
形態の一例を示す断面図である。FIG. 1 is a sectional view showing an example of an embodiment of a ceramic-metal bonding structure according to the present invention.
【図２】本発明のセラミックス−金属接合構造における
セラミックスと金属との接合方法を説明するための断面
図である。FIG. 2 is a cross-sectional view for explaining a method of joining ceramics and metal in the ceramics-metal joining structure of the present invention.
１・・・セラミックス ２・・・金属 ３・・・ろう材 Ａ・・・中央領域 DESCRIPTION OF SYMBOLS 1 ... Ceramics 2 ... Metal 3 ... Brazing material A ... Central area
Claims (1)
Ｚｒ、Ｈｆの少なくとも一種を含有するＡｇ−Ｃｕ合金
から成るろう材で接合したセラミックス−金属接合構造
であって、前記ろう材は前記接合面の中央領域のみにＭ
ｏまたはＷが含有されていることを特徴とするセラミッ
クス−金属接合構造。1. The bonding surface between a ceramic and a metal is made of Ti,
A ceramic-metal joining structure joined by a brazing material made of an Ag-Cu alloy containing at least one of Zr and Hf, wherein the brazing material is formed only in a central region of the joining surface.
A ceramic-metal joint structure containing o or W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14091998A JP3694588B2 (en) | 1998-05-22 | 1998-05-22 | Method for producing ceramic-metal joined body and ceramic-metal joined body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14091998A JP3694588B2 (en) | 1998-05-22 | 1998-05-22 | Method for producing ceramic-metal joined body and ceramic-metal joined body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11335184A true JPH11335184A (en) | 1999-12-07 |
| JP3694588B2 JP3694588B2 (en) | 2005-09-14 |
Family
ID=15279877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14091998A Expired - Fee Related JP3694588B2 (en) | 1998-05-22 | 1998-05-22 | Method for producing ceramic-metal joined body and ceramic-metal joined body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3694588B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7067200B2 (en) * | 2002-07-23 | 2006-06-27 | Ngk Insulators, Ltd. | Joined bodies and a method of producing the same |
| JP2010215419A (en) * | 2009-03-13 | 2010-09-30 | Taiheiyo Cement Corp | SiC JOINED BODY |
| CN110524079A (en) * | 2019-07-31 | 2019-12-03 | 常熟市银洋陶瓷器件有限公司 | The silver-copper brazing alloy layer preparation method being brazed for metallized ceramic and metal parts |
-
1998
- 1998-05-22 JP JP14091998A patent/JP3694588B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7067200B2 (en) * | 2002-07-23 | 2006-06-27 | Ngk Insulators, Ltd. | Joined bodies and a method of producing the same |
| JP2010215419A (en) * | 2009-03-13 | 2010-09-30 | Taiheiyo Cement Corp | SiC JOINED BODY |
| CN110524079A (en) * | 2019-07-31 | 2019-12-03 | 常熟市银洋陶瓷器件有限公司 | The silver-copper brazing alloy layer preparation method being brazed for metallized ceramic and metal parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3694588B2 (en) | 2005-09-14 |
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