JPH0464781U - - Google Patents

Info

Publication number
JPH0464781U
JPH0464781U JP1990107734U JP10773490U JPH0464781U JP H0464781 U JPH0464781 U JP H0464781U JP 1990107734 U JP1990107734 U JP 1990107734U JP 10773490 U JP10773490 U JP 10773490U JP H0464781 U JPH0464781 U JP H0464781U
Authority
JP
Japan
Prior art keywords
under test
heater
hot plate
testing device
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990107734U
Other languages
English (en)
Japanese (ja)
Other versions
JP2544015Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990107734U priority Critical patent/JP2544015Y2/ja
Priority to KR1019910017602A priority patent/KR960007507B1/ko
Priority to US07/775,562 priority patent/US5172049A/en
Publication of JPH0464781U publication Critical patent/JPH0464781U/ja
Application granted granted Critical
Publication of JP2544015Y2 publication Critical patent/JP2544015Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1990107734U 1990-10-08 1990-10-15 Ｉｃ試験装置 Expired - Lifetime JP2544015Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1990107734U JP2544015Y2 (ja) 1990-10-15 1990-10-15 Ｉｃ試験装置
KR1019910017602A KR960007507B1 (ko) 1990-10-08 1991-10-08 Ic시험장치
US07/775,562 US5172049A (en) 1990-10-15 1991-10-15 IC test equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990107734U JP2544015Y2 (ja) 1990-10-15 1990-10-15 Ｉｃ試験装置

Publications (2)

Publication Number Publication Date
JPH0464781U true JPH0464781U (US07860544-20101228-C00003.png) 1992-06-03
JP2544015Y2 JP2544015Y2 (ja) 1997-08-13

Family

ID=14466597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990107734U Expired - Lifetime JP2544015Y2 (ja) 1990-10-08 1990-10-15 Ｉｃ試験装置

Country Status (2)

Country Link
US (1) US5172049A (US07860544-20101228-C00003.png)
JP (1) JP2544015Y2 (US07860544-20101228-C00003.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009008652A (ja) * 2007-05-25 2009-01-15 Ueno Seiki Kk 高低温化装置及び高低温化装置を備えたテストハンドラ

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420521A (en) * 1992-10-27 1995-05-30 Ej Systems, Inc. Burn-in module
JPH0750366A (ja) * 1993-08-06 1995-02-21 Texas Instr Japan Ltd ソケット
KR950033507A (ko) * 1994-02-08 1995-12-26 오가 노리오 Ic 측정시험장치 및 이것을 사용한 ic 측정시험방법
JP2929948B2 (ja) * 1994-09-20 1999-08-03 三菱電機株式会社 プローブ式テストハンドラー及びそれを用いたｉｃのテスト方法
US5557212A (en) * 1994-11-18 1996-09-17 Isaac; George L. Semiconductor test socket and contacts
US5609489A (en) * 1994-12-21 1997-03-11 Hewlett-Packard Company Socket for contacting an electronic circuit during testing
JPH08254567A (ja) * 1995-03-16 1996-10-01 Advantest Corp Ｉｃテスタ用ハンドラのリードプレス部機構
JPH0971322A (ja) * 1995-07-03 1997-03-18 Advantest Corp Ｉｃ搬送装置
US5872458A (en) * 1996-07-08 1999-02-16 Motorola, Inc. Method for electrically contacting semiconductor devices in trays and test contactor useful therefor
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6489793B2 (en) 1996-10-21 2002-12-03 Delta Design, Inc. Temperature control of electronic devices using power following feedback
US6392431B1 (en) 1996-10-23 2002-05-21 Aetrium, Inc. Flexibly suspended heat exchange head for a DUT
JP3494828B2 (ja) * 1996-11-18 2004-02-09 株式会社アドバンテスト 水平搬送テストハンドラ
DE19757273C2 (de) * 1996-12-25 2000-07-13 Advantest Corp Verfahren und Vorrichtung zum Testen von ICs
DE19756900A1 (de) * 1996-12-26 1998-07-02 Advantest Corp Testvorrichtung für Halbleiterbauelemente
US5864176A (en) * 1997-04-04 1999-01-26 Unisys Corporation Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces
DE19821194B4 (de) * 1997-05-12 2005-09-22 Advantest Corp. Halbleiterbauelement-Testgerät
US5990693A (en) * 1997-09-15 1999-11-23 Wells-Cti Test contactor
US6099597A (en) * 1997-12-17 2000-08-08 Advanced Micro Devices, Inc. Picker nest for holding an IC package with minimized stress on an IC component during testing
US6091062A (en) * 1998-01-27 2000-07-18 Kinetrix, Inc. Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly
TW440699B (en) * 1998-06-09 2001-06-16 Advantest Corp Test apparatus for electronic parts
AU4991899A (en) 1998-07-14 2000-02-07 Schlumberger Technologies, Inc. Apparatus, method and system of liquid-based, wide range, fast response temperature cycling control of electronic devices
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6121576A (en) 1998-09-02 2000-09-19 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array
SG98373A1 (en) * 1998-11-25 2003-09-19 Advantest Corp Device testing apparatus
DE19957792A1 (de) 1998-12-02 2000-06-08 Schlumberger Technologies Inc Transport und aktive Temperatursteuerung von zu prüfenden integrierten Schaltungen
US6468023B1 (en) 1998-12-02 2002-10-22 Delta Design, Inc. Apparatus and method for inverting an IC device
US6433564B1 (en) * 1999-06-14 2002-08-13 St Assemby Test Services Pte. Ltd BGA device positioner kit
NL1012420C2 (nl) * 1999-06-23 2000-12-28 Johannes Nicolaas Peperkamp Werkwijze voor het doormeten van elektronische componenten, in het bijzonder ge´ntegreerde schakelingen, en daarvoor bestemde inrichting.
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
DE10001117A1 (de) * 2000-01-13 2001-07-26 Infineon Technologies Ag Testvorrichtung für ein Halbleiterbauelement
US6518782B1 (en) 2000-08-29 2003-02-11 Delta Design, Inc. Active power monitoring using externally located current sensors
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
US6889841B2 (en) * 2001-07-03 2005-05-10 Johnstech International Corporation Interface apparatus for reception and delivery of an integrated circuit package from one location to another
US6628132B2 (en) 2001-08-10 2003-09-30 Teradyne, Inc. Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
JP2003344483A (ja) * 2002-05-31 2003-12-03 Fujitsu Ltd ハンドリング装置およびこれを使用した試験装置
US6971793B2 (en) * 2003-03-21 2005-12-06 Asm Assembly Automation Ltd. Test handler temperature monitoring system
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
WO2004106953A1 (ja) * 2003-05-30 2004-12-09 Advantest Corporation 電子部品試験装置
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
WO2005065258A2 (en) 2003-12-24 2005-07-21 Cascade Microtech, Inc. Active wafer probe
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US6965246B2 (en) * 2004-04-16 2005-11-15 Hon Hai Precision Ind. Co., Ltd. Burn-in socket assembly
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US20070132471A1 (en) * 2005-12-13 2007-06-14 Carlson Gregory F Method and apparatus for testing integrated circuits over a range of temperatures
DE102006005319B4 (de) * 2006-02-06 2010-12-30 Infineon Technologies Ag Heizvorrichtung zum Testen integrierter Bauelemente
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
JP2008170179A (ja) * 2007-01-09 2008-07-24 Elpida Memory Inc オートハンドラ
US7994808B2 (en) * 2007-02-02 2011-08-09 Johnstech International Corporation Contact insert for a microcircuit test socket
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
JP5074878B2 (ja) * 2007-10-15 2012-11-14 東京エレクトロン株式会社 検査装置
US7830164B2 (en) * 2008-04-22 2010-11-09 Honeywell International Inc. Ducted test socket
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
DE102009045291A1 (de) * 2009-10-02 2011-04-07 Ers Electronic Gmbh Vorrichtung zur Konditionierung von Halbleiterchips und Testverfahren unter Verwendung der Vorrichtung
CN102636739B (zh) * 2012-03-20 2014-08-13 杭州长川科技有限公司 集成电路测试多工位定位装置
DE102012009796A1 (de) 2012-05-18 2013-11-21 Micronas Gmbh Testsystem
US9791501B2 (en) * 2012-09-24 2017-10-17 Intel Corporation Compliant thermal contact device and method
US9201097B1 (en) 2012-10-12 2015-12-01 Altera Corporation Method and apparatus for testing integrated circuit die with a partially completed and validated module
US9870959B1 (en) 2012-10-12 2018-01-16 Altera Corporation Method and apparatus for testing a flip-chip assembly during manufacture
US9476936B1 (en) * 2013-03-15 2016-10-25 Johnstech International Corporation Thermal management for microcircuit testing system
KR20160044975A (ko) * 2014-10-16 2016-04-26 삼성전자주식회사 반도체 패키지 테스트 블레이드 및 이를 포함하는 반도체 패키지 테스트 장치
KR20180033223A (ko) 2015-07-21 2018-04-02 델타 디자인, 인코포레이티드 연속적인 유체 열계면 재료 공급
JP2021148653A (ja) * 2020-03-19 2021-09-27 キオクシア株式会社 半導体装置、検査用部品、および検査装置
US12092658B2 (en) * 2021-08-18 2024-09-17 Mpi Corporation Optical detection system and alignment method for a predetermined target object
CN115598504B (zh) * 2022-10-27 2023-05-09 深圳国芯人工智能有限公司 一种自动化存储芯片测试装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326577A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Semiconductor device pre-heating unit
JPH0184075U (US07860544-20101228-C00003.png) * 1987-11-24 1989-06-05
JPH01136470U (US07860544-20101228-C00003.png) * 1988-03-11 1989-09-19

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3710251A (en) * 1971-04-07 1973-01-09 Collins Radio Co Microelectric heat exchanger pedestal
US4212075A (en) * 1978-10-10 1980-07-08 Usm Corporation Electrical component testing system for component insertion machine
US5023544A (en) * 1987-04-03 1991-06-11 Universal Instruments Corporation Extended input and testing of electrical components for onsertion machines
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326577A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Semiconductor device pre-heating unit
JPH0184075U (US07860544-20101228-C00003.png) * 1987-11-24 1989-06-05
JPH01136470U (US07860544-20101228-C00003.png) * 1988-03-11 1989-09-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009008652A (ja) * 2007-05-25 2009-01-15 Ueno Seiki Kk 高低温化装置及び高低温化装置を備えたテストハンドラ

Also Published As

Publication number Publication date
JP2544015Y2 (ja) 1997-08-13
US5172049A (en) 1992-12-15

Similar Documents

Publication Publication Date Title
JPH0464781U (US07860544-20101228-C00003.png)
JPH0372376U (US07860544-20101228-C00003.png)
JPS63106138U (US07860544-20101228-C00003.png)
JPH01157428U (US07860544-20101228-C00003.png)
JPS61154576U (US07860544-20101228-C00003.png)
JPH0461007U (US07860544-20101228-C00003.png)
JPS61152980U (US07860544-20101228-C00003.png)
JPH01180675U (US07860544-20101228-C00003.png)
JPS622250U (US07860544-20101228-C00003.png)
JPS60125545U (ja) 温度測定装置
JPH0388174U (US07860544-20101228-C00003.png)
JPH02129857U (US07860544-20101228-C00003.png)
JPS62201079U (US07860544-20101228-C00003.png)
JPH03106474U (US07860544-20101228-C00003.png)
JPS62203475U (US07860544-20101228-C00003.png)
JPH0459147U (US07860544-20101228-C00003.png)
JPH0289363U (US07860544-20101228-C00003.png)
JPH0418374U (US07860544-20101228-C00003.png)
JPS6251515U (US07860544-20101228-C00003.png)
JPH0185658U (US07860544-20101228-C00003.png)
JPS6150275U (US07860544-20101228-C00003.png)
JPH0385586U (US07860544-20101228-C00003.png)
JPS6348164U (US07860544-20101228-C00003.png)
JPH01162618U (US07860544-20101228-C00003.png)
JPS61202083U (US07860544-20101228-C00003.png)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term