JPH0463559B2 - - Google Patents

Info

Publication number
JPH0463559B2
JPH0463559B2 JP62166541A JP16654187A JPH0463559B2 JP H0463559 B2 JPH0463559 B2 JP H0463559B2 JP 62166541 A JP62166541 A JP 62166541A JP 16654187 A JP16654187 A JP 16654187A JP H0463559 B2 JPH0463559 B2 JP H0463559B2
Authority
JP
Japan
Prior art keywords
hole
thick film
substrate
film circuit
paint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62166541A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6410697A (en
Inventor
Osamu Itagaki
Katsuhiko Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Priority to JP16654187A priority Critical patent/JPS6410697A/ja
Publication of JPS6410697A publication Critical patent/JPS6410697A/ja
Publication of JPH0463559B2 publication Critical patent/JPH0463559B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP16654187A 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate Granted JPS6410697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16654187A JPS6410697A (en) 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16654187A JPS6410697A (en) 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate

Publications (2)

Publication Number Publication Date
JPS6410697A JPS6410697A (en) 1989-01-13
JPH0463559B2 true JPH0463559B2 (enExample) 1992-10-12

Family

ID=15833191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16654187A Granted JPS6410697A (en) 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate

Country Status (1)

Country Link
JP (1) JPS6410697A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0775272B2 (ja) * 1989-06-01 1995-08-09 ジューキ株式会社 厚膜回路製造方法
JP2576825B2 (ja) * 1994-01-27 1997-01-29 栄電子工業株式会社 スルホールの導通化装置
DE4439108C1 (de) * 1994-11-02 1996-04-11 Lpkf Cad Cam Systeme Gmbh Verfahren zum Durchkontaktieren von Bohrungen in mehrlagigen Leiterplatten

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119791A (ja) * 1982-12-25 1984-07-11 富士通株式会社 スル−ホ−ルの導体層形成方法
JPS59151493A (ja) * 1983-02-17 1984-08-29 日本電気アイシ−マイコンシステム株式会社 スル−ホ−ル加工方法

Also Published As

Publication number Publication date
JPS6410697A (en) 1989-01-13

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