JPH0463543B2 - - Google Patents

Info

Publication number
JPH0463543B2
JPH0463543B2 JP57061477A JP6147782A JPH0463543B2 JP H0463543 B2 JPH0463543 B2 JP H0463543B2 JP 57061477 A JP57061477 A JP 57061477A JP 6147782 A JP6147782 A JP 6147782A JP H0463543 B2 JPH0463543 B2 JP H0463543B2
Authority
JP
Japan
Prior art keywords
external lead
lead frame
resin
lead
flexible insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57061477A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58178545A (ja
Inventor
Sekya Marutsuka
Ryosuke Hosobane
Eiichi Tsunashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP57061477A priority Critical patent/JPS58178545A/ja
Publication of JPS58178545A publication Critical patent/JPS58178545A/ja
Publication of JPH0463543B2 publication Critical patent/JPH0463543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57061477A 1982-04-12 1982-04-12 リ−ドフレ−ム Granted JPS58178545A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57061477A JPS58178545A (ja) 1982-04-12 1982-04-12 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57061477A JPS58178545A (ja) 1982-04-12 1982-04-12 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58178545A JPS58178545A (ja) 1983-10-19
JPH0463543B2 true JPH0463543B2 (OSRAM) 1992-10-12

Family

ID=13172179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57061477A Granted JPS58178545A (ja) 1982-04-12 1982-04-12 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58178545A (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
JPH01183837A (ja) * 1988-01-18 1989-07-21 Texas Instr Japan Ltd 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286365U (OSRAM) * 1975-12-24 1977-06-28

Also Published As

Publication number Publication date
JPS58178545A (ja) 1983-10-19

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