JPH046226Y2 - - Google Patents
Info
- Publication number
- JPH046226Y2 JPH046226Y2 JP1985055501U JP5550185U JPH046226Y2 JP H046226 Y2 JPH046226 Y2 JP H046226Y2 JP 1985055501 U JP1985055501 U JP 1985055501U JP 5550185 U JP5550185 U JP 5550185U JP H046226 Y2 JPH046226 Y2 JP H046226Y2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- cover plate
- lead wire
- annular boss
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 32
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 30
- 238000000605 extraction Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 230000010355 oscillation Effects 0.000 description 11
- 238000001514 detection method Methods 0.000 description 10
- 230000001771 impaired effect Effects 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- -1 moisture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985055501U JPH046226Y2 (US07345094-20080318-C00003.png) | 1985-04-16 | 1985-04-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985055501U JPH046226Y2 (US07345094-20080318-C00003.png) | 1985-04-16 | 1985-04-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61173185U JPS61173185U (US07345094-20080318-C00003.png) | 1986-10-28 |
JPH046226Y2 true JPH046226Y2 (US07345094-20080318-C00003.png) | 1992-02-20 |
Family
ID=30578235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985055501U Expired JPH046226Y2 (US07345094-20080318-C00003.png) | 1985-04-16 | 1985-04-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH046226Y2 (US07345094-20080318-C00003.png) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0821442B2 (ja) * | 1990-11-29 | 1996-03-04 | 三菱電機株式会社 | 回路基板収納装置 |
JP2579124Y2 (ja) * | 1991-07-11 | 1998-08-20 | エヌオーケー株式会社 | グロメット取付構造 |
JP2017092192A (ja) * | 2015-11-06 | 2017-05-25 | オムロン株式会社 | 電子機器の製造方法および電子機器 |
JP2017092354A (ja) * | 2015-11-13 | 2017-05-25 | オムロン株式会社 | 電子機器 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52166758U (US07345094-20080318-C00003.png) * | 1976-06-11 | 1977-12-17 | ||
JPS56129137U (US07345094-20080318-C00003.png) * | 1980-02-28 | 1981-10-01 |
-
1985
- 1985-04-16 JP JP1985055501U patent/JPH046226Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61173185U (US07345094-20080318-C00003.png) | 1986-10-28 |
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