JPH0461189A - Joint of electric parts - Google Patents
Joint of electric partsInfo
- Publication number
- JPH0461189A JPH0461189A JP2165131A JP16513190A JPH0461189A JP H0461189 A JPH0461189 A JP H0461189A JP 2165131 A JP2165131 A JP 2165131A JP 16513190 A JP16513190 A JP 16513190A JP H0461189 A JPH0461189 A JP H0461189A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lcd
- terminal
- electronic component
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000010408 film Substances 0.000 claims abstract description 12
- 239000013039 cover film Substances 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電子部品と基板とを電気的に接合し、かつ
、電子部品を基板に垂直になる形状を形成する電子部品
の継手に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] This invention relates to a joint for electronic components that electrically connects an electronic component and a board and forms the electronic component in a shape perpendicular to the board. It is.
第４図は従来の電子部品の接合を示す断面図であり、図
において、１は液晶表示装置の液晶側部品（を子部品（
以下ＬＣＤと言う））、２は電気信号を受けるＬＣＤの
端子、２ａは端子２に予備ハンダされたハンダ、３はベ
ースフィルム４とカバーフィルム５の間に電気信号の流
れる銅パターン６をはさんでいる基板、Ｔは電気信号を
出す基板の端子、７ａｔｉ端子７に予備ハンダされたハ
ンダである。FIG. 4 is a cross-sectional view showing the conventional bonding of electronic components.
(hereinafter referred to as LCD)), 2 is the terminal of the LCD that receives electrical signals, 2a is the solder pre-soldered to the terminal 2, 3 is the copper pattern 6 sandwiched between the base film 4 and the cover film 5, through which the electrical signal flows. T is the solder pre-soldered to the 7ati terminal 7, which is the terminal of the board that outputs the electric signal.
次に動作を説明する。従来ＬＣＤ １を基板３に垂直な
状態になる形状を形成するために、下記のように接合さ
れている。まず、ＬＣＤの端子２と基板の端子１に予備
ハンダが施され、 ＬＣＤの端子２と基板の端子１を垂
直にかつ前後の位置がずれないように正確に位置決めを
する。ここで、ハンダゴテでＬＣＤの端子２及び基板の
端子Ｉを加熱することによシ予備ハンダ２ ａ ＃ ７
ａが溶融されて、ＬＣＤの端子２と基板の端子７とが
隅肉のハンダ付けをし接合する。なお、基板の端子１は
、基板のカバ−フィルム５を除去した形状をしている。Next, the operation will be explained. Conventionally, in order to form a shape in which the LCD 1 is perpendicular to the substrate 3, the LCD 1 is bonded as described below. First, preliminary soldering is applied to the terminals 2 of the LCD and the terminals 1 of the board, and the terminals 2 of the LCD and the terminals 1 of the board are positioned vertically and accurately so that their front and rear positions do not shift. Now, heat the terminal 2 of the LCD and the terminal I of the board with a soldering iron to add preliminary solder 2a #7.
a is melted, and the terminals 2 of the LCD and the terminals 7 of the board are joined by soldering the fillets. Note that the terminal 1 of the board has a shape obtained by removing the cover film 5 of the board.
従来の電子部品の接合は以上のように構成されているの
で、端子部どうしをｎ密に位置決めしながら、隅肉のハ
ンダ付けをしなければならないので自動化が困難で、手
作業で、拡大鏡で見ながら行わなければならなく、非能
率的で、品質も安定しなかった。また基板の端子７は片
側を樹脂（ベースフィルム４）で固められているので、
使用中、ＬＣＤ １と基板３の熱膨張の差によりハンダ
部（ＬＣＤの端子２．基板の端子Ｔ）に大きな熱応力が
作用し、との熱応力の繰返しによシハンダ部が破断する
という品質上の課題があった。Conventional joining of electronic components is structured as described above, so the terminals must be closely positioned and soldered at the fillets, which is difficult to automate and requires manual work using a magnifying glass. This was inefficient and the quality was inconsistent as it had to be done while watching the process. Also, since the terminal 7 of the board is hardened with resin (base film 4) on one side,
During use, a large thermal stress is applied to the solder part (terminal 2 of the LCD and terminal T of the board) due to the difference in thermal expansion between the LCD 1 and the board 3, and the solder part breaks due to repeated thermal stress. There was an issue above.
この発明は上記のような課題を解消するためになされ九
もので、自動化が容易にでき、品質が安定するとともに
、使用中の熱応力に対しても充分な強度を持つことがで
きる電子部品の継手を得ることを目的とする。This invention was made to solve the above-mentioned problems, and it is an electronic component that can be easily automated, has stable quality, and has sufficient strength against thermal stress during use. The purpose is to obtain a fitting.
この発明に係る電子部品の継手は、基板の端部でベース
フィルムとカバーフィルムｅ除去ｔ、てパターンを上記
基板より突出させ、その突出させ九パターン部分の先端
部を、上記基板と同一平面上に配置された電子部品の端
子上に重ね合せて接合し、上記突出されたパターン部分
を屈曲することにより上記電子部品を上ｉ上基板に垂直
になる形状を形成する露出端子を備えたものである。In the joint for electronic components according to the present invention, the base film and the cover film are removed from the edge of the substrate, the pattern is made to protrude from the substrate, and the tip of the protruding pattern portion is placed on the same plane as the substrate. The exposed terminal is superimposed on and bonded to the terminal of the electronic component arranged on the upper substrate, and by bending the protruding pattern portion, the electronic component is formed into a shape perpendicular to the upper substrate. be.
この発明における電子部品の継手は、基板の端部でベー
スフィルムとカバーフィルムｌ−Ａしてパターンを基板
より突出させ、その突出させたパターン部分の先端を電
子部品の端子上に重ね合せて接合したので接合部での熱
応力が緩和される。In the joint for electronic components according to the present invention, a base film and a cover film L-A are formed at the edge of the board to make the pattern protrude from the board, and the tips of the protruding pattern portions are overlapped and joined onto the terminals of the electronic component. As a result, thermal stress at the joint is alleviated.
以下、この発明の一実施例を図について説明する。第１
図はこの発明の一実施例による電子部品の継手が屈曲さ
れる前の状態を示す断面図、第２図はこの発明の一実施
例による電子部品の継手が屈曲された状態を示す断面図
、第３図はこの発明の一実施例による電子部品の継手が
屈曲される前の状態を示す平面図であり、図において、
１〜６については従来のものと閾−であるので説明を省
略する。８＃″ｌ：ＬＣＤ１と基板３を接合する露出端
子、８ａはＬＣＤの端子２に接合される露出端子８の先
端部である。An embodiment of the present invention will be described below with reference to the drawings. 1st
FIG. 2 is a sectional view showing a state before a joint of an electronic component according to an embodiment of the present invention is bent; FIG. 2 is a sectional view showing a state where a joint of an electronic component according to an embodiment of the invention is bent; FIG. 3 is a plan view showing a state before the joint of an electronic component according to an embodiment of the present invention is bent;
1 to 6 are conventional ones and thresholds, so their explanations will be omitted. 8#''l: exposed terminal for joining the LCD 1 and the substrate 3; 8a is the tip of the exposed terminal 8 for joining to the terminal 2 of the LCD;
次に動作について説明する。ＬＣＤ １と基板３を垂直
な状態になる形状を形成するために、本発明の電子部品
の継手により、下記のように接合される。Next, the operation will be explained. In order to form a perpendicular shape, the LCD 1 and the substrate 3 are joined using the electronic component joint of the present invention as described below.
まず、第１図に示すように、ＬＣＤ １と基板３を同一
平面上で位置決めをし、ＬＣＤの端子２上に露出端子８
を重ね合せ、加熱することにより、予備ハンダ２ａが溶
融されて、ＬＣＤ１と基板３を接合する。ここで、露出
端子８は、基板３の端部でベースフィルム４とカバーフ
ィルム５を除去して銅パターン６を基板の外部へ２Ｍ以
上突出させたものである。次に、第３図に示すように、
露出端子８を折シ曲げてＬＣＤ １と基板３が垂直な状
態になるように形状を形成する。First, as shown in FIG. 1, the LCD 1 and the board 3 are positioned on the same plane, and the exposed terminal 8 is placed on the terminal 2 of the LCD.
By overlapping them and heating them, the preliminary solder 2a is melted and the LCD 1 and the substrate 3 are joined together. Here, the exposed terminal 8 is obtained by removing the base film 4 and the cover film 5 at the end of the substrate 3 and protruding the copper pattern 6 by 2M or more to the outside of the substrate. Next, as shown in Figure 3,
The exposed terminals 8 are bent to form a shape so that the LCD 1 and the substrate 3 are perpendicular to each other.
なお、上記実施例では、接合をハンダ付けとしたが、重
ね合せるＬＣＤの端子２と霧出端子８の間に異方性導電
膜をはさみ、熱圧着により接合してもよい。In the above embodiment, soldering was used for joining, but an anisotropic conductive film may be sandwiched between the terminals 2 and the spray terminals 8 of the overlapping LCDs, and they may be joined by thermocompression bonding.
以上のように、この発明によれば基板の端部でベースフ
ィルムとカバーフィルムを除去してパターンを基板よシ
突出させ、その突出させたパターン部分の先端を電子部
品の端子上に重ね合せて接合したことによシ、電子部品
と基板との熱膨張の差による熱応力を、上記突出させた
パターン部分である露出端子が緩和し、接合部での熱応
力を低く押えることができる。また、電子部品と基板を
同一平面で接合することができるので、自動化が容易と
なり、自動化による経済性と品質の安定化が得られる効
果がある。As described above, according to the present invention, the base film and the cover film are removed from the edge of the board, the pattern is made to protrude from the board, and the tip of the protruding pattern portion is superimposed on the terminal of the electronic component. Due to the bonding, the exposed terminals, which are the protruding pattern portions, relieve the thermal stress due to the difference in thermal expansion between the electronic component and the substrate, and the thermal stress at the bonded portion can be suppressed to a low level. Furthermore, since the electronic components and the board can be bonded on the same plane, automation is facilitated, and automation has the effect of achieving economic efficiency and stabilizing quality.
第１図はこの発明の一実施例による電子部品の継手が屈
曲される前の状態を示す断面図、第２図はこの発明の一
実施例による電子部品の継手が屈曲された状態を示す断
面図、第３図はこの発明の・一実施例による電子部品の
継手が屈曲さｈる前の状態を示を平面図、第４図は従来
の電ｆ一部品の接合を示す断面図であＺ）。
１はＬＣＤ （電子部品）、２はＬＣＤの端一１’、３
は基板、４ｉｉベースフイルム、５はカバーフィルム、
６＃よ銅パターン（パターン）、８はＬＣＤ １と厚板
３を接合Ｊる露出端子、８ａは露出端子８の先端部。
なお、図中、同一符号は同一・、又は相当部分を丁フ。
特朴出願人 三菱電機株式会社
、−、’３ ： 科反FIG. 1 is a cross-sectional view showing a state before a joint of an electronic component according to an embodiment of the present invention is bent, and FIG. 2 is a cross-sectional view showing a state of a joint of an electronic component according to an embodiment of the present invention in a bent state. 3 is a plan view showing a state before the joint of an electronic component according to an embodiment of the present invention is bent, and FIG. 4 is a sectional view showing the joining of a conventional electronic component. Z). 1 is the LCD (electronic component), 2 is the end 1' of the LCD, 3
is the substrate, 4ii is the base film, 5 is the cover film,
6 is a copper pattern (pattern), 8 is an exposed terminal that connects the LCD 1 and the thick plate 3, and 8a is the tip of the exposed terminal 8. In addition, in the figures, the same reference numerals refer to the same or corresponding parts. Special applicant: Mitsubishi Electric Corporation, -, '3: Petition
Claims (1)
ルムとカバーフィルムの間に上記電気信号が流れるパタ
ーンを挾持した構成の基板と、上記基板の端部で上記ベ
ースフィルムと上記カバーフィルムを除去して上記パタ
ーンを上記基板より突出させ、その突出させたパターン
部分の先端部を、上記基板と同一平面に配置された上記
電子部品の端子上に重ね合せて接合し、上記突出された
パターン部分を屈曲することにより上記電子部品を上記
基板に垂直になる形状を形成する露出端子とを備えた電
子部品の継手。An electronic component having a terminal for receiving an electric signal, a substrate having a pattern in which the electric signal flows is sandwiched between a base film and a cover film, and the base film and the cover film are removed at the ends of the substrate. The pattern is made to protrude from the substrate, the tip of the protruding pattern portion is overlapped and bonded onto the terminal of the electronic component arranged on the same plane as the substrate, and the protruding pattern portion is bent. and an exposed terminal that forms the electronic component into a shape perpendicular to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2165131A JPH0710026B2 (en) | 1990-06-22 | 1990-06-22 | Electronic component fittings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2165131A JPH0710026B2 (en) | 1990-06-22 | 1990-06-22 | Electronic component fittings |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0461189A true JPH0461189A (en) | 1992-02-27 |
| JPH0710026B2 JPH0710026B2 (en) | 1995-02-01 |
Family
ID=15806491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2165131A Expired - Fee Related JPH0710026B2 (en) | 1990-06-22 | 1990-06-22 | Electronic component fittings |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710026B2 (en) |
-
1990
- 1990-06-22 JP JP2165131A patent/JPH0710026B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0710026B2 (en) | 1995-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |