JPH0529178U - Flexible printed circuit board - Google Patents
Flexible printed circuit boardInfo
- Publication number
- JPH0529178U JPH0529178U JP8547991U JP8547991U JPH0529178U JP H0529178 U JPH0529178 U JP H0529178U JP 8547991 U JP8547991 U JP 8547991U JP 8547991 U JP8547991 U JP 8547991U JP H0529178 U JPH0529178 U JP H0529178U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- circuit board
- flexible printed
- printed circuit
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】 熱圧着フレキシブルプリント基板と他の基板
との熱圧着による半田接合において、半田ブリッジの発
生を防止するとともに接合強度を向上させる。
【構成】 フレキシブルプリント基板１の非接合面２ａ
上にプリント配線３及び接続端子４を形成するととも
に、接合面２ｂ上にも接続端子５を形成し、これらの接
続端子４及び５をスルーホールメッキ７されたスルーホ
ール６で接続する。熱圧着による半田接合に際して、半
田２０がスルーホール６に吸収されるため、半田ブリッ
ジが発生しにくくなる。また、半田２０のフィレット部
２１に剪断力が働くため、接合強度が向上する。
(57) [Summary] [Object] To prevent the occurrence of solder bridges and improve the bonding strength in solder bonding by thermocompression bonding of a thermocompression-bonded flexible printed circuit board to another substrate. [Structure] Non-bonding surface 2a of flexible printed circuit board 1
The printed wiring 3 and the connection terminal 4 are formed on the upper side, and the connection terminal 5 is also formed on the joint surface 2b. At the time of solder joining by thermocompression bonding, the solder 20 is absorbed by the through holes 6, so that a solder bridge is less likely to occur. Further, since the shearing force acts on the fillet portion 21 of the solder 20, the joint strength is improved.
Description
【０００１】[0001]
本考案は、他の回路基板に熱圧着によって半田接合されるフレキシブルプリン ト基板に関し、特に接合品質の向上を図ることのできるフレキシブルプリント基 板に関する。 The present invention relates to a flexible printed board that is solder-bonded to another circuit board by thermocompression bonding, and more particularly to a flexible printed board that can improve the bonding quality.
【０００２】[0002]
従来のフレキシブルプリント基板と、他の回路基板との熱圧着による半田接合 は、図２（ａ）及び（ｂ）に示すようになっていた。すなわち、フレキシブルプ リント基板１の接合面２ｂ上に形成された接続端子５と、回路基板１０上に形成 された接続端子１２を、半田２０を介して接合する構造になっていた。 The conventional solder joint by thermocompression bonding between a flexible printed circuit board and another circuit board is as shown in FIGS. 2 (a) and 2 (b). That is, the structure is such that the connection terminal 5 formed on the bonding surface 2b of the flexible printed board 1 and the connection terminal 12 formed on the circuit board 10 are bonded via the solder 20.
【０００３】[0003]
しかしながら、上述した従来の接続構造にあっては、熱圧着前に供給する半田 の量が多い場合、フレキシブル基板の下で半田が押圧力によって広がり、半田ブ リッジを生じてしまう。この半田ブリッジを生じさせずに接合を行なうためには 、厳密に半田量の制御を行なうとともに、熱圧着時の押圧力，温度，加熱時間等 の極めて微妙な条件を最適に保つ必要があり、条件制御が難しいという問題があ る。 However, in the above-described conventional connection structure, when the amount of solder supplied before thermocompression bonding is large, the solder spreads under the flexible substrate due to the pressing force, and a solder bridge is generated. In order to carry out joining without causing this solder bridge, it is necessary to strictly control the amount of solder and to keep extremely delicate conditions such as pressing force, temperature and heating time during thermocompression bonding to be optimal. There is a problem that condition control is difficult.
【０００４】 また、半田接合強度は、パターンの引き剥がし力に対する半田と銅の界面の合 金部の強度に依存するため、接合強度が極めて弱く、他の接着剤等による補強処 理が必要である。したがって、接合面積を大きくして接合強度を確保する必要上 、接合部のパターンピッチを狭くすることができず、また補強処理のためのスペ ースも必要となるので、接合に要する面積が大きくなってしまうという問題があ った。Further, since the solder joint strength depends on the strength of the metal-bonded portion at the interface between the solder and the copper against the peeling force of the pattern, the joint strength is extremely weak and it is necessary to carry out a reinforcing treatment with another adhesive or the like. is there. Therefore, it is necessary to increase the bonding area to secure the bonding strength, it is not possible to narrow the pattern pitch of the bonding portion, and a space for reinforcement processing is also required, so the area required for bonding is large. There was a problem of becoming.
【０００５】 さらに、フレキシブル基板を介して熱圧着の熱を伝導するため効率が悪いとい う問題や、半田接合部がフレキシブル基板の下面に位置するため半田接合部の目 視検査がしにくいという問題があった。[0007] Furthermore, the problem is that efficiency is poor because heat of thermocompression bonding is conducted through the flexible board, and it is difficult to perform visual inspection of the solder joint because the solder joint is located on the lower surface of the flexible board. was there.
【０００６】 本考案は、上述した問題点にかんがみてなされたもので、半田量が多い場合で あっても半田ブリッジを生ずることがなく、難しい条件制御が不要であるととも に、小さな接合面積で大きな接合強度を有する熱圧着用フレキシブルプリント基 板の提供を目的とする。The present invention has been made in view of the above-mentioned problems. Even when the amount of solder is large, a solder bridge does not occur, difficult condition control is unnecessary, and a small joint area is required. The purpose of the present invention is to provide a flexible printed board for thermocompression bonding which has high bonding strength.
【０００７】[0007]
上記目的を達成するために、本考案のフレキシブルプリント基板は、他の回路 基板上に形成された接続端子に熱圧着によって半田接合されるフレキシブルプリ ント基板であって、フレキシブルプリント基板上に形成された半田接合される接 続端子に、スルーホールを設けた構成としてあり、好ましくは、他の回路基板上 に形成された接続端子に熱圧着によって半田接合されるフレキシブルプリント基 板であって、フレキシブルプリント基板の非接合面上にプリント配線及び接続端 子を形成するとともに、接合面上にも接続端子を形成し、これらの接続端子どう しをスルーホールメッキされたスルーホールで接続した構成としてある。 In order to achieve the above object, the flexible printed circuit board of the present invention is a flexible printed circuit board that is solder-bonded to a connection terminal formed on another circuit board by thermocompression bonding, and is formed on the flexible printed circuit board. A flexible printed circuit board, which has a structure in which through holes are provided in the connection terminals to be soldered, and which is preferably solder-bonded to the connection terminals formed on another circuit board by thermocompression bonding, is flexible. Printed wiring and connection terminals are formed on the non-bonded surface of the printed circuit board, connection terminals are also formed on the bonded surface, and these connection terminals are connected by through holes plated with through holes. .
【０００８】[0008]
以下、本考案の一実施例について図面を参照しながら説明する。 図１（ａ）は本考案の一実施例に係るフレキシブルプリント基板と他の基板と の接合状態を示す平面図、図１（ｂ）は図１（ａ）のＡ−Ａ線断面図である。 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1A is a plan view showing a state in which a flexible printed circuit board according to an embodiment of the present invention and another substrate are joined, and FIG. 1B is a sectional view taken along the line AA of FIG. 1A. .
【０００９】 図１に示すように、本考案のフレキシブルプリント基板１の非接合面２ａ上に は、プリント基板３及び接続端子４が形成してある。 また、フレキシブルプリント基板１の接合面２ｂ上であって、上記非接続面上 の接続端子４と対向する位置に、接続端子５が形成してある。 フレキシブルプリント基板の両面に形成された円形の接続端子４及び５の間に は、スルーホール６が形成してあり、このスルーホールの内周面に施されたスル ーホールメッキ７によって、接続端子４及び５が電気的に接続してある。スルー ホール６の形成によって、接続端子４及び５の形状（パターン）はスルーホール ランド（ｌａｎｄ）（孔のまわりに残された円環状の部分）となる。なお、プリ ント配線３、接続端子４及び５は銅箔等の熱伝導性の良い材料で形成する。８ａ ，８ｂはカバーレイを示す。As shown in FIG. 1, a printed board 3 and a connection terminal 4 are formed on the non-bonding surface 2a of the flexible printed board 1 of the present invention. A connection terminal 5 is formed on the joint surface 2b of the flexible printed board 1 at a position facing the connection terminal 4 on the non-connection surface. Through holes 6 are formed between the circular connecting terminals 4 and 5 formed on both sides of the flexible printed circuit board, and the connecting terminals 4 and 5 are formed by the through hole plating 7 applied to the inner peripheral surface of the through holes. 5 is electrically connected. By forming the through hole 6, the shape (pattern) of the connection terminals 4 and 5 becomes a through hole land (a circular ring portion left around the hole). The printed wiring 3 and the connection terminals 4 and 5 are formed of a material having good thermal conductivity such as copper foil. Reference numerals 8a and 8b denote coverlays.
【００１０】 次に、上記構成からなる本考案のフレキシブルプリント基板の作用について説 明する。 回路基板１０上の銅配線１１の端部に形成された熱圧着用の接続端子１２に、 フレキシブルプリント基板１の接続端子５を熱圧着によって半田結合する。 この際、接続端子５と接続端子１２との間に供給する半田２０の量が多い場合 であっても、半田２０がスルーホール６内に吸収されるため、半田ブリッジが発 生しにくくなる。Next, the operation of the flexible printed circuit board of the present invention having the above structure will be described. The connection terminal 5 for thermocompression bonding formed on the end of the copper wiring 11 on the circuit board 10 is soldered to the connection terminal 5 of the flexible printed board 1 by thermocompression bonding. At this time, even when the amount of the solder 20 supplied between the connection terminal 5 and the connection terminal 12 is large, the solder 20 is absorbed in the through hole 6, so that the solder bridge is less likely to occur.
【００１１】 また、図１（ｂ）に示すように、スルーホール６内に吸収された半田２０がフ レット（ｆｉｌｌｅｔ）部２１を形成する。そして、半田結合部に引き剥がし方 向の力が加わった場合、フィレット部２１に剪断力が働くため、従来に比べ接合 強度が向上する。 このように、接合強度が強いので、補強処理のためのスペースを必要とせず、 デッドゾーンの減少を図ることができる。Further, as shown in FIG. 1B, the solder 20 absorbed in the through hole 6 forms a fret portion 21. When a force in the peeling direction is applied to the solder joint portion, a shearing force acts on the fillet portion 21, so that the joint strength is improved as compared with the conventional case. In this way, since the joint strength is high, the dead zone can be reduced without requiring a space for reinforcement treatment.
【００１２】 さらに、接合部の検査において、上部からスルーホール内のフィレット部を目 視で検査することで、半田接合品質を容易に確認できる。Further, in the inspection of the joint portion, the solder joint quality can be easily confirmed by visually inspecting the fillet portion in the through hole from above.
【００１３】 また、熱圧着に際し、フレキシブルプリント基板の上面に圧接される加熱バー から、熱伝導性の良い銅箔で形成された接続端子４，スルーホール７及び接続端 子５を介して、直接熱が半田２０に伝わるため、加熱時間を短縮することができ るとともに、半田接合品質も向上する。During thermocompression bonding, directly from a heating bar pressed against the upper surface of the flexible printed circuit board, through the connection terminal 4, the through hole 7 and the connection terminal 5 which are formed of copper foil having good thermal conductivity. Since the heat is transferred to the solder 20, the heating time can be shortened and the solder joint quality is improved.
【００１４】 なお、本考案は上記実施例によって限定されるものではなく本考案の要旨の範 囲内で適宜変形して実施される。 例えば、フレキシブルプリント基板の接合面にだけプリント配線及び接合端子 を形成し、この接合端子にスルーホール（メッキはしない）を形成するだけの構 成としてもよい。It should be noted that the present invention is not limited to the above-described embodiment, and is appropriately modified and implemented within the scope of the gist of the present invention. For example, the printed wiring and the joining terminal may be formed only on the joining surface of the flexible printed circuit board, and the through hole (not plated) may be formed in the joining terminal.
【００１５】 また、フレキシブルプリント基板（ベース）１，プリント配線３，接続端子４ 及び５，スルーホール６及びスルーホールメッキ７の材質，形状（厚さを含む） 等は適宜選択または設計される。The material, shape (including thickness) and the like of the flexible printed board (base) 1, the printed wiring 3, the connection terminals 4 and 5, the through hole 6 and the through hole plating 7 are appropriately selected or designed.
【００１６】[0016]
以上説明したように本考案のフレキシブルプリント基板によれば、半田ブリッ ジが発生しにくく、半田接合条件の制御が容易である。 また、接合強度が強く、補強処理のためのスペースを必要としない。 さらに、半田接合を容易に行なうことができ、半田接合品質も高い。 As described above, according to the flexible printed circuit board of the present invention, solder bridging is unlikely to occur and the solder joining conditions can be easily controlled. Further, the joint strength is high, and no space is required for the reinforcing treatment. Further, solder joining can be easily performed, and the solder joining quality is high.
【図１】本考案の一実施例に係るフレキシブルプリント
基板と他の基板との接合状態を示す図であり、図１
（ａ）は平面図、図１（ｂ）は図１（ａ）のＡ−Ａ線断
面図である。FIG. 1 is a diagram showing a state in which a flexible printed circuit board and another substrate according to an embodiment of the present invention are bonded to each other.
1A is a plan view, and FIG. 1B is a sectional view taken along the line AA of FIG.
【図２】従来のフレキシブルプリント基板と他の基板と
の接合状態を示す図であり、図２（ａ）は平面図、図２
（ｂ）は図２（ａ）のＢ−Ｂ線断面図である。FIG. 2 is a diagram showing a joined state of a conventional flexible printed circuit board and another substrate, FIG. 2 (a) is a plan view, and FIG.
2B is a sectional view taken along the line BB of FIG.
１…フレキシブルプリント基板 ２ａ…非接合面 ２ｂ…接合面 ３…プリント配線 ４，５…接続端子 ６…スルーホール ７…スルーホールメッキ １０…回路基板 １２…接続端子 ２０…半田 ２１…フレット部 1 ... Flexible printed circuit board 2a ... Non-bonding surface 2b ... Bonding surface 3 ... Printed wiring 4, 5 ... Connection terminal 6 ... Through hole 7 ... Through hole plating 10 ... Circuit board 12 ... Connection terminal 20 ... Solder 21 ... Fret part
Claims (2)
熱圧着によって半田接合されるフレキシブルプリント基
板であって、フレキシブルプリント基板上に形成された
半田接合される接続端子に、スルーホールを設けたこと
を特徴とするフレキシブルプリント基板。1. A flexible printed circuit board which is solder-bonded to a connection terminal formed on another circuit board by thermocompression bonding, and a through hole is formed in the solder-bonded connection terminal formed on the flexible printed circuit board. A flexible printed circuit board characterized by being provided.
熱圧着によって半田接合されるフレキシブルプリント基
板であって、フレキシブルプリント基板の非接合面上に
プリント配線及び接続端子を形成するとともに、接合面
上にも接続端子を形成し、これらの接続端子どうしをス
ルーホールメッキされたスルーホールで接続したことを
特徴とするフレキシブルプリント基板。2. A flexible printed board which is solder-bonded to a connection terminal formed on another circuit board by thermocompression bonding, wherein a printed wiring and a connection terminal are formed on a non-bonded surface of the flexible printed board. A flexible printed circuit board characterized in that connection terminals are also formed on the joint surface, and these connection terminals are connected by through holes plated with through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8547991U JPH0529178U (en) | 1991-09-24 | 1991-09-24 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8547991U JPH0529178U (en) | 1991-09-24 | 1991-09-24 | Flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0529178U true JPH0529178U (en) | 1993-04-16 |
Family
ID=13860047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8547991U Pending JPH0529178U (en) | 1991-09-24 | 1991-09-24 | Flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0529178U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9888583B2 (en) | 2014-08-04 | 2018-02-06 | Minebea Co., Ltd. | Flexible printed circuit board |
| CN111712038A (en) * | 2020-07-22 | 2020-09-25 | 业成科技（成都）有限公司 | Circuit board and electronic equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0335590A (en) * | 1989-06-27 | 1991-02-15 | American Teleph & Telegr Co <Att> | Soldering of component and device therefor |
| JP4087673B2 (en) * | 2001-10-09 | 2008-05-21 | エファフレックス・トーア−ウント・ジッヒャーハイツジュステーメ・ゲーエムベーハー・ウント・シーオー・カーゲー | Gate device for corridor closure between several rooms with significantly different temperatures |
-
1991
- 1991-09-24 JP JP8547991U patent/JPH0529178U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0335590A (en) * | 1989-06-27 | 1991-02-15 | American Teleph & Telegr Co <Att> | Soldering of component and device therefor |
| JP4087673B2 (en) * | 2001-10-09 | 2008-05-21 | エファフレックス・トーア−ウント・ジッヒャーハイツジュステーメ・ゲーエムベーハー・ウント・シーオー・カーゲー | Gate device for corridor closure between several rooms with significantly different temperatures |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9888583B2 (en) | 2014-08-04 | 2018-02-06 | Minebea Co., Ltd. | Flexible printed circuit board |
| CN111712038A (en) * | 2020-07-22 | 2020-09-25 | 业成科技（成都）有限公司 | Circuit board and electronic equipment |
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