JPH0459958U - - Google Patents
Info
- Publication number
- JPH0459958U JPH0459958U JP1990102305U JP10230590U JPH0459958U JP H0459958 U JPH0459958 U JP H0459958U JP 1990102305 U JP1990102305 U JP 1990102305U JP 10230590 U JP10230590 U JP 10230590U JP H0459958 U JPH0459958 U JP H0459958U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- voltage
- output
- stabilization control
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Continuous-Control Power Sources That Use Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990102305U JPH0459958U (cg-RX-API-DMAC7.html) | 1990-09-29 | 1990-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990102305U JPH0459958U (cg-RX-API-DMAC7.html) | 1990-09-29 | 1990-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459958U true JPH0459958U (cg-RX-API-DMAC7.html) | 1992-05-22 |
Family
ID=31846433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990102305U Pending JPH0459958U (cg-RX-API-DMAC7.html) | 1990-09-29 | 1990-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459958U (cg-RX-API-DMAC7.html) |
-
1990
- 1990-09-29 JP JP1990102305U patent/JPH0459958U/ja active Pending