JPH0459153U - - Google Patents
Info
- Publication number
- JPH0459153U JPH0459153U JP10038290U JP10038290U JPH0459153U JP H0459153 U JPH0459153 U JP H0459153U JP 10038290 U JP10038290 U JP 10038290U JP 10038290 U JP10038290 U JP 10038290U JP H0459153 U JPH0459153 U JP H0459153U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- semiconductor wafer
- grooved
- carrier
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例に係るウエーハの立
替機構を示す正面図、第２図はその要部を一部破
断した拡大斜視図、第３図イ，ロは何れも本願考
案の立替機構の説明図であり、第１図Ａ−Ｂ−Ｃ
−Ｄ線に沿つた断面図、第４図は本願考案の他例
を示す正面図、第５図及び第６図は従来のウエー
ハの立替えの概略説明図である。
１……溝付ホルダ、２……溝付ローラ、６……
テーパ溝、６ａ……太溝部分、６ｂ……細溝部分
、１００……キヤリア、１００ａ……溝、Ｗ……
半導体ウエーハ。
FIG. 1 is a front view showing a wafer uplifting mechanism according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view with a part of the main part cut away, and FIGS. FIG. 1A-B-C is an explanatory diagram of the mechanism.
4 is a front view showing another example of the present invention, and FIGS. 5 and 6 are schematic explanatory views of conventional wafer stand-up. 1... Grooved holder, 2... Grooved roller, 6...
Tapered groove, 6a... Thick groove part, 6b... Thin groove part, 100... Carrier, 100a... Groove, W...
semiconductor wafer.
Claims (1)
ウエーハを他のキヤリアに立替えるウエーハの立
替機構であつて、 上記キヤリアから取り出された各半導体ウエー
ハを支持する溝付ホルダと、該溝付ホルダに近接
して配置され、上記溝付ホルダの溝幅と略一致す
る太溝部分と該太溝部分より幅の狭い細溝部分と
を外周面に連設したテーパ溝を有する回動自在の
溝付ローラよりなり、回動させた溝付ローラのテ
ーパ溝の溝幅が各半導体ウエーハの厚みと一致す
る部分で半導体ウエーハを挟持し、溝付ホルダの
各溝内の中央部分に半導体ウエーハを位置させて
立替えることを特徴とするウエーハの立替機構。[Scope of Claim for Utility Model Registration] A wafer transfer mechanism for transferring each semiconductor wafer supported in each groove of a carrier to another carrier, and a grooved holder for supporting each semiconductor wafer taken out from the carrier. and a tapered groove which is arranged close to the grooved holder and has a thick groove portion that substantially matches the groove width of the grooved holder and a narrow groove portion whose width is narrower than the wide groove portion in succession on the outer peripheral surface. The semiconductor wafer is held between the parts where the groove width of the tapered groove of the rotated grooved roller matches the thickness of each semiconductor wafer, and the center of each groove of the grooved holder is A wafer tipping mechanism characterized by placing a semiconductor wafer in a portion and tipping it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10038290U JPH0459153U (en) | 1990-09-25 | 1990-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10038290U JPH0459153U (en) | 1990-09-25 | 1990-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459153U true JPH0459153U (en) | 1992-05-21 |
Family
ID=31842990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10038290U Pending JPH0459153U (en) | 1990-09-25 | 1990-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459153U (en) |
-
1990
- 1990-09-25 JP JP10038290U patent/JPH0459153U/ja active Pending