JPH0458182B2 - - Google Patents
Info
- Publication number
- JPH0458182B2 JPH0458182B2 JP8891687A JP8891687A JPH0458182B2 JP H0458182 B2 JPH0458182 B2 JP H0458182B2 JP 8891687 A JP8891687 A JP 8891687A JP 8891687 A JP8891687 A JP 8891687A JP H0458182 B2 JPH0458182 B2 JP H0458182B2
- Authority
- JP
- Japan
- Prior art keywords
- opening
- chip
- semiconductor
- package
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 14
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000012856 packing Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 16
- 239000007788 liquid Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8891687A JPS63254740A (ja) | 1987-04-13 | 1987-04-13 | 半導体のオ−プナ−装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8891687A JPS63254740A (ja) | 1987-04-13 | 1987-04-13 | 半導体のオ−プナ−装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63254740A JPS63254740A (ja) | 1988-10-21 |
JPH0458182B2 true JPH0458182B2 (US07223432-20070529-C00017.png) | 1992-09-16 |
Family
ID=13956248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8891687A Granted JPS63254740A (ja) | 1987-04-13 | 1987-04-13 | 半導体のオ−プナ−装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63254740A (US07223432-20070529-C00017.png) |
-
1987
- 1987-04-13 JP JP8891687A patent/JPS63254740A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63254740A (ja) | 1988-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR900001231B1 (ko) | 기판의 회전 건조 장치 | |
JPH0541548Y2 (US07223432-20070529-C00017.png) | ||
US4886012A (en) | Spin coating apparatus | |
DE68906636D1 (de) | Ausgabeverschluss. | |
JPH0458182B2 (US07223432-20070529-C00017.png) | ||
KR920019664A (ko) | 팩 밀폐용 장치 및 방법 | |
US6635209B2 (en) | Method of encapsulating a substrate-based package assembly without causing mold flash | |
JPH0416428Y2 (US07223432-20070529-C00017.png) | ||
JPS63254739A (ja) | 半導体のオ−プナ−装置 | |
JPH0416435Y2 (US07223432-20070529-C00017.png) | ||
JPH0439225B2 (US07223432-20070529-C00017.png) | ||
JPH0416430Y2 (US07223432-20070529-C00017.png) | ||
JP3605852B2 (ja) | 基板の回転塗布装置 | |
JPH04311043A (ja) | 半導体集積回路素子の開封装置 | |
CN206266626U (zh) | 一种新型反应槽装置 | |
JP3533634B2 (ja) | 熱処理装置 | |
JPH06140523A (ja) | 半導体素子収納用パッケージ | |
JPH0632832Y2 (ja) | 動力散布機の薬剤供給調量装置 | |
JPS6144430Y2 (US07223432-20070529-C00017.png) | ||
JPS62275568A (ja) | 噴流式はんだ付け装置 | |
JPH05291461A (ja) | 樹脂封止型半導体装置 | |
JPH0416429Y2 (US07223432-20070529-C00017.png) | ||
JP3459115B2 (ja) | 基板の回転塗布装置 | |
JPS63247677A (ja) | 樹脂封止型半導体装置の開封方法 | |
JPS5982540U (ja) | ケミカルマニピユレ−タ |