JPH0458182B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a semiconductor opener device.

[Prior Art] Conventionally, when analyzing defects or checking the quality of semiconductors (I/C), methods have been used to expose the internal chips by applying a dissolving solution, such as heated hot sulfuric acid, to the semiconductor package. ing.

The semiconductor package is tightly set on the upper surface of the package having an opening, and the solution sprayed from the injection nozzle directly hits the package within the opening area.

[Problems to be Solved by the Invention] As mentioned above, the semiconductor package is sequentially melted by the solution sprayed from the spray nozzle, and the chip inside is exposed. is determined by the opening provided in the package. In other words, since the opening is a round or square-shaped through-hole provided almost in the center of the package, the dissolving solution directly hits only the area of the opening, resulting in a one-point opening condition. You will be able to do it.

For this reason, for example, if the mounting position of the chip is offset from the center of the package, or if the chip occupies a large area, a problem arises in that the chip cannot be completely exposed. Therefore, as a means to solve the above-mentioned problem, it may be possible to increase the diameter of the opening, for example, but in the case of 300 mil type semiconductors, the width of the package is as small as approximately 6 mm, so increasing the diameter of the opening will increase the opening area. As a result, not only the top surface of the package but also the sides were dissolved, and there was a risk that the solution solution would flow out.
If the dissolving solution flows out, the detection sensor is activated and the operation of the device is stopped, so the device must be reset, causing problems such as a significant delay in work.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a semiconductor opener device that can reliably expose a chip even if the mounting position of the chip is shifted or the chip occupies a large area with respect to the package using a simple device. It is said that

[Means for solving the problem] In order to achieve the above-mentioned object, in the present invention, a semiconductor package placed and set on the upper surface of a gasket having an opening is sprayed with molten liquid from a spray nozzle. In the opener device for exposing the chip by applying liquid, the opening of the packing is formed in the shape of a long hole, and the opening width of the portion corresponding to the injection nozzle is narrower than the opening width of the general portion.

[Function] In such a semiconductor opener device, the solution sprayed from the spray nozzle directly hits the packages in the area of the opening, sequentially melting the packages and exposing the chips. In this case, in the area where the solution comes into direct contact, the narrow opening width limits the amount of solution that comes in contact with the opening, making the opening speed slower than the opening in the general section, and the opening speed is balanced with the opening in the general section and the opening is shaped like a long hole. It will be opened. As a result, even if the chip is mounted at an off-center position or occupies a large area, the chip will be exposed reliably.

[Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings of FIGS. 1 to 5.

In the figure, 1 indicates the body of the opener device 3. In addition to the semiconductor opening 5, the fuselage 1 includes a storage tank section 7 for storing sulfuric acid, a preheating heater section 9 for heating the sulfuric acid sent from the tank section 7 to about 250°C, and a A waste liquid cooling section 11 that cools the heated sulfuric acid that has finished its work to about 100° C. using a cooling fan, and a waste liquid tank section 13 that temporarily stores the waste liquid are arranged.

The semiconductor opening 5 is formed by an etching block 15 and a casing 17 disposed below the block 15.
and a pump device 19 disposed within the casing 17.

The casing 17 is made of a material that is permeable to magnetic force and is heat-resistant and acid-resistant, and serves as a storage tank in which a predetermined amount of sulfuric acid is stored. The casing 17 is provided with an intake port 23 that connects to the storage tank section 7 via the preheating heater section 9 and an outlet port 25 that continues to the drain tank section 13 via the drain cooling section 11 .

The sulfuric acid in the casing 17 fed through the intake port 23 is heated to approximately
Raised to 290℃. Note that the power supply section of the heater is managed and controlled by a temperature sensor (not shown) so that the temperature of the sulfuric acid is approximately 290°C.

A drive motor 27 is located at the bottom of the casing 17.
A rotating magnet 31 is mounted and supported on the output shaft 29 of the motor. Further, an impeller 33 is disposed facing the magnet 31 and having a magnet 33a embedded within the casing 17.

The impeller 33 is rotated by the magnetic force of the rotating magnet 31 and is made of a heat-resistant and acid-resistant synthetic resin material.

The upper part of the main body of the impeller 33 is a conical part 37, and a vane plate 41 is provided below in a radial direction from a convex part 39 in the central part.

The vane plate 41 is shaped to send upward the sulfuric acid taken in from an intake port (not shown) provided at the bottom of the guide case 35 when it rotates. The guide case 35 is made of a material that allows magnetic force to pass through, and the impeller 3
3, and the injection nozzle 4 at the tip
3 is located below the through hole 45 of the etching block 15.

The through hole 45 through which the tip of the injection nozzle 43 is visible is provided at the center of the bottom of the assembly recess 47 into which the packing 49 is assembled.

The gasket 49 is made of heat-resistant and acid-resistant rubber and is shaped like a disk. The gasket 49 is provided with an opening 51 in the form of a long hole passing through it, and the injection nozzle 43
The opening width a of the unsealing opening 51 corresponding to the opening 51 is set to be narrower than the opening width b of the general portion.

Note that 53 indicates an operation lid that can be opened and closed using the hinge 55 as a fulcrum, 57 indicates an IC guide, and 59 indicates an IC holder that holds the semiconductor W.

In the opener device constructed in this way, the package p of the semiconductor W is set tightly on the upper surface of the packing 49, and the solution jetted from the injection nozzle 43 is applied to the package p to sequentially melt it and expose the chip T. In this case, the opening width a that is narrower limits the amount of the solution to which the solution directly hits the area, and the unsealing speed is slower than that of the opening in the general section. Therefore, the opening width b and the opening speed are balanced, and the bag is opened in the shape of a long hole. As a result, even if the mounting position of the chip is off-center as shown in FIG. 3, or if the chip occupies a large area, it will be exposed reliably.

In addition, in a 64k-bit D-RAM, the opening width b of the general part is approximately 2.5 mm, and the opening width a of the reduced part is approximately 1 mm.
In addition, in the case of a 256k-bit D-RAM, an experiment was conducted with the opening width b of the general part set to approximately 4 mm and the opening width a of the reduced part set to approximately 2 mm, and a good elongated hole-shaped opening state was obtained. was gotten.

[Effects of the Invention] As explained above, according to the opener device of the present invention, even if the chip is mounted at a position shifted from the center or the chip occupies a large area, it can be exposed reliably.

[Brief explanation of drawings]

FIG. 1 is a plan view of the gasket of the opener device of the present invention, FIG. 2 is a sectional view taken along the line -- in FIG. 1, and FIG. 3 is a perspective view of the semiconductor with the chip exposed.
FIG. 4 is a partially cutaway side view of the opener device, and FIG. 5 is a plan view of the same. Explanation of main drawing symbols 43...Injection nozzle,
49...Packkin, 51...Opening mouth, W...Semiconductor.

Claims (1)

[Claims] 1. In an opener device that exposes a chip by applying a solution sprayed from a spray nozzle to a semiconductor package placed on the upper surface of a packing having an opening, the opening of the packing is formed in the shape of a long hole. A semiconductor opener device characterized in that an opening width of a portion corresponding to the injection nozzle is narrower than an opening width of a general portion.