JPH0454555B2 - - Google Patents

Info

Publication number
JPH0454555B2
JPH0454555B2 JP59058870A JP5887084A JPH0454555B2 JP H0454555 B2 JPH0454555 B2 JP H0454555B2 JP 59058870 A JP59058870 A JP 59058870A JP 5887084 A JP5887084 A JP 5887084A JP H0454555 B2 JPH0454555 B2 JP H0454555B2
Authority
JP
Japan
Prior art keywords
rosin
item
cream solder
thermoplastic resin
fine particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59058870A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60203386A (ja
Inventor
Toshiaki Ogura
Masatoshi Sado
Hideo Chaki
Koichi Hagio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON GENMA KK
Original Assignee
NIPPON GENMA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON GENMA KK filed Critical NIPPON GENMA KK
Priority to JP5887084A priority Critical patent/JPS60203386A/ja
Publication of JPS60203386A publication Critical patent/JPS60203386A/ja
Publication of JPH0454555B2 publication Critical patent/JPH0454555B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP5887084A 1984-03-26 1984-03-26 クリ−ムはんだおよびその製造法 Granted JPS60203386A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5887084A JPS60203386A (ja) 1984-03-26 1984-03-26 クリ−ムはんだおよびその製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5887084A JPS60203386A (ja) 1984-03-26 1984-03-26 クリ−ムはんだおよびその製造法

Publications (2)

Publication Number Publication Date
JPS60203386A JPS60203386A (ja) 1985-10-14
JPH0454555B2 true JPH0454555B2 (enExample) 1992-08-31

Family

ID=13096774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5887084A Granted JPS60203386A (ja) 1984-03-26 1984-03-26 クリ−ムはんだおよびその製造法

Country Status (1)

Country Link
JP (1) JPS60203386A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224888A (ja) * 1985-07-24 1987-02-02 Uchihashi Kinzoku Kogyo Kk クリ−ムはんだ
US5211764A (en) * 1992-11-10 1993-05-18 At&T Bell Laboratories Solder paste and method of using the same
JPH0929486A (ja) * 1995-07-24 1997-02-04 Matsushita Electric Ind Co Ltd クリームはんだ
JP2002263884A (ja) * 2001-03-09 2002-09-17 Showa Denko Kk ハンダ付け用フラックスおよびハンダペースト
GB2380964B (en) * 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
CN101894774B (zh) * 2005-03-17 2012-02-15 松下电器产业株式会社 电子部件安装方法和电子部件安装装置
JP6566248B2 (ja) * 2014-06-26 2019-08-28 荒川化学工業株式会社 クリアランスレジスト用鉛フリーはんだ向けフラックス及びクリアランスレジスト用鉛フリーはんだペースト
KR20220137866A (ko) * 2020-02-13 2022-10-12 도레이 카부시키가이샤 페이스트, 기판, 디스플레이, 및 기판의 제조 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES8104932A1 (es) * 1979-04-06 1981-05-16 Johnson Matthey Co Ltd Procedimiento para la obtencion de una composicion para sol-dar.
JPS5877791A (ja) * 1981-10-31 1983-05-11 Toppan Printing Co Ltd 半田付け用フラツクス組成物

Also Published As

Publication number Publication date
JPS60203386A (ja) 1985-10-14

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