JPH045241Y2 - - Google Patents
Info
- Publication number
- JPH045241Y2 JPH045241Y2 JP12675889U JP12675889U JPH045241Y2 JP H045241 Y2 JPH045241 Y2 JP H045241Y2 JP 12675889 U JP12675889 U JP 12675889U JP 12675889 U JP12675889 U JP 12675889U JP H045241 Y2 JPH045241 Y2 JP H045241Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chamfering
- grinding
- grindstone
- corner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 description 48
- 238000000034 method Methods 0.000 description 12
- 230000002093 peripheral effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12675889U JPH045241Y2 (fr) | 1989-10-30 | 1989-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12675889U JPH045241Y2 (fr) | 1989-10-30 | 1989-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0266943U JPH0266943U (fr) | 1990-05-21 |
| JPH045241Y2 true JPH045241Y2 (fr) | 1992-02-14 |
Family
ID=31378564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12675889U Expired JPH045241Y2 (fr) | 1989-10-30 | 1989-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045241Y2 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2859389B2 (ja) * | 1990-07-09 | 1999-02-17 | 坂東機工 株式会社 | ガラス板の周辺エッジを研削加工する方法及びこの方法を実施するガラス板の数値制御研削機械 |
| JP2009142913A (ja) * | 2007-12-12 | 2009-07-02 | Sumitomo Metal Mining Co Ltd | ウェハーのベベル加工法とホイール型回転砥石 |
-
1989
- 1989-10-30 JP JP12675889U patent/JPH045241Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0266943U (fr) | 1990-05-21 |
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