JPH0451488Y2 - - Google Patents
Info
- Publication number
- JPH0451488Y2 JPH0451488Y2 JP1987056960U JP5696087U JPH0451488Y2 JP H0451488 Y2 JPH0451488 Y2 JP H0451488Y2 JP 1987056960 U JP1987056960 U JP 1987056960U JP 5696087 U JP5696087 U JP 5696087U JP H0451488 Y2 JPH0451488 Y2 JP H0451488Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- wiring conductor
- external
- lead
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 64
- 239000004065 semiconductor Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 241000587161 Gomphocarpus Species 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987056960U JPH0451488Y2 (US06277897-20010821-C00009.png) | 1987-04-15 | 1987-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987056960U JPH0451488Y2 (US06277897-20010821-C00009.png) | 1987-04-15 | 1987-04-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63164245U JPS63164245U (US06277897-20010821-C00009.png) | 1988-10-26 |
| JPH0451488Y2 true JPH0451488Y2 (US06277897-20010821-C00009.png) | 1992-12-03 |
Family
ID=30886237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987056960U Expired JPH0451488Y2 (US06277897-20010821-C00009.png) | 1987-04-15 | 1987-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451488Y2 (US06277897-20010821-C00009.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160154A (ja) * | 1984-01-30 | 1985-08-21 | Nec Kansai Ltd | Ｈｉｃ |
-
1987
- 1987-04-15 JP JP1987056960U patent/JPH0451488Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160154A (ja) * | 1984-01-30 | 1985-08-21 | Nec Kansai Ltd | Ｈｉｃ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63164245U (US06277897-20010821-C00009.png) | 1988-10-26 |
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