JPH0449511B2 - - Google Patents
Info
- Publication number
- JPH0449511B2 JPH0449511B2 JP307486A JP307486A JPH0449511B2 JP H0449511 B2 JPH0449511 B2 JP H0449511B2 JP 307486 A JP307486 A JP 307486A JP 307486 A JP307486 A JP 307486A JP H0449511 B2 JPH0449511 B2 JP H0449511B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic
- plating layer
- plating
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 25
- 239000000919 ceramic Substances 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 6
- 150000002736 metal compounds Chemical class 0.000 claims description 2
- 239000000463 material Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000005219 brazing Methods 0.000 description 9
- 150000002739 metals Chemical class 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- -1 sputtering Chemical class 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP307486A JPS62161466A (ja) | 1986-01-09 | 1986-01-09 | セラミツク接合用金属部材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP307486A JPS62161466A (ja) | 1986-01-09 | 1986-01-09 | セラミツク接合用金属部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62161466A JPS62161466A (ja) | 1987-07-17 |
| JPH0449511B2 true JPH0449511B2 (enrdf_load_stackoverflow) | 1992-08-11 |
Family
ID=11547191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP307486A Granted JPS62161466A (ja) | 1986-01-09 | 1986-01-09 | セラミツク接合用金属部材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62161466A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0260952A (ja) * | 1988-08-27 | 1990-03-01 | Japan Synthetic Rubber Co Ltd | 冷凍機のゴム部材用ゴム組成物 |
| US5340658A (en) * | 1991-08-21 | 1994-08-23 | Ishihara Chemical Co., Ltd. | Composites made of carbon-based and metallic materials |
-
1986
- 1986-01-09 JP JP307486A patent/JPS62161466A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62161466A (ja) | 1987-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0643903B1 (en) | Tin-bismuth solder connection having improved high temperature properties, and process for forming same | |
| CA1284898C (en) | Titanium-copper-nickel braze filler metal | |
| US6848610B2 (en) | Approaches for fluxless soldering | |
| JPH0217509B2 (enrdf_load_stackoverflow) | ||
| US5021300A (en) | Solder back contact | |
| US8691685B2 (en) | Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present | |
| JPH0449511B2 (enrdf_load_stackoverflow) | ||
| WO2002034458A1 (en) | Method of joining surfaces | |
| JPH05105563A (ja) | 金属−セラミツクジヨイント | |
| US3683488A (en) | Methods of bonding metals together | |
| JP3629578B2 (ja) | Ｔｉ系材料とＣｕ系の接合方法 | |
| JP2002292474A (ja) | チタン材又はチタン合金材の接合方法 | |
| JPS6132752A (ja) | セラミツクス回路板の製法 | |
| EP0084161B1 (en) | Lead frames for electronic and electric devices | |
| JPH0338943B2 (enrdf_load_stackoverflow) | ||
| JPH06302952A (ja) | スルーホール回路基板の製造法 | |
| JPS6334963A (ja) | 半導体装置用セラミツク基板の製造方法およびその方法に使用するクラツド材 | |
| JPS61269998A (ja) | Ｓｎ合金はんだ箔材の製造法 | |
| JPH05259632A (ja) | プリント配線板およびその製造方法 | |
| JPH0783172B2 (ja) | 配線基板 | |
| JPS5812117B2 (ja) | 金属ろう | |
| JP2001105131A (ja) | はんだコーティング材、電子部品のはんだ接合体およびはんだコーティング材の製造方法 | |
| JP4953112B2 (ja) | 導電性セラミックと電極端子の接合構造およびその製造方法 | |
| JPS6117394A (ja) | 接合材料の製造方法 | |
| JPS6333175A (ja) | 金属部材の接合方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |