JPH0448794A - Lead bonding apparatus using laser beam - Google Patents

Abstract

PURPOSE:To surely bond the lead of an IC component by a method wherein a hot-wind supply part is placed side by side with a mounting head and a lead bonding apparatus, by means of a laser beam, in which a hot wind from the hot-wind supply part is jetted toward the lead at a laser beam irradiation operation is formed. CONSTITUTION:An IC component 1 which has been sucked by using a mounting head 5 is mounted on a circuit board 7. In a state that a hot wind has been supplied from a hot-wind supply part 10, leads 4 are irradiated with a laser beam radiated from a laser-beam irradiation part 9. The laser beam is scanned at a scanning speed of, e.g. 10mm/sec; solder-plated parts 12 between the leads 14 of the IC component 1 and electrodes 11 are heated and melted; the leads 4 are bonded to the electrodes 11. Since the hot wind from the hot-wind supply part 10 is jetted onto the leads 4 when the leads 4 are bonded to the electrodes 11, the leads 4 are pressed to the face of the electrodes 11, the levitation of the leads is eliminated and a connection defect can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a lead bonding device for mounting an IC component on a circuit board and bonding the lead of the IC component to an electrode on the circuit board using a laser beam. .

2. Description of the Related Art In recent years, a laser soldering device has been used as a means of soldering IC component leads to electrodes on a circuit board using a laser beam as a heat source.

A conventional laser lead bonding device will be explained based on FIG. 4.

13 is a laser beam oscillator, which is a laser generating means. +
Reference numeral 4 denotes a laser light guide path for guiding the laser light generated from the laser light oscillator 13. 15 is a laser beam, 16 is a condensing lens for the laser beam, and 17 is a laser irradiation unit. 18 is an IC part.

19 is the lead of IC component +8, which is connected to electrode 2 of circuit board 2o.
1 is placed on cream solder 22 printed on top of the solder.

A lead bonding device using a laser beam configured as described above will be explained.

The laser beam oscillated from the laser beam oscillator 13 is.

The laser light passes through the light guide path 14, is focused by the condenser lens 16, and is irradiated onto the leads 19 of the IC component 18. For example, the laser beam 15 is scanned at a scanning speed of 10 μm/s,
IC parts! The lead 8 +9 and the electrode 21 can be joined by soldering.

Problems to be Solved by the Invention However, with the above configuration, when IC components are cut and separated from a film carrier on which IC components are integrally formed and mounted on a circuit board, generally speaking, tape or
When applied to so-called out-lead bonding in automated bonding, even slight lifting due to lead bending may cause bonding failure. Particularly in recent years, the lead pitch has become narrower, and for example, film carriers with a lead width of 300 μm, a lead pitch of 500 μm, and a lead thickness of 35 μm have been used. In this case, the lead thickness is 3
Since it is as thin as 5 μm, it has the problem of lead bending and poor connection.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide a lead bonding device using a laser beam that reliably bonds leads of IC components.

Means for Solving the Problems In order to achieve the above object, the present invention provides a mounting head for mounting an IC component at a predetermined position on a substrate, a laser generating means,
A laser beam generated from the laser generating means is transmitted to the IC.
In a lead bonding device using a laser beam, which has a laser irradiation unit for irradiating the leads of a component, a hot air supply unit is provided in parallel with the mounting head, and hot air from the hot air supply unit is jetted toward the leads during laser beam irradiation. This is a lead bonding device that uses a laser beam arranged so that the

Effect of the present invention With the above-described configuration, the hot air supply section is disposed toward the lead at the same time as the component is mounted by the mounting head,
It has the effect of pressing down the lead by jetting hot air at the same time as the laser beam is irradiated.

EXAMPLE Hereinafter, a lead bonding apparatus using a laser beam, which is an example of the present invention, will be described with reference to the drawings.

FIG. 1 shows an IC component cut from a film carrier. FIG. 2 is a cross-sectional view of the main part of the laser lead bonding apparatus for IC components of the present invention, and FIG. 3 is a partially enlarged cross-sectional view of FIG. 2.

In FIG. 1, 1 is an IC component, and 2 is an ICC component top body. Reference numeral 3 denotes a film carrier, on which IC parts 1 are integrally formed at appropriate intervals in the longitudinal direction, and are cut into individual pieces when being supplied. That is, film carrier 3
An inner lead and an outer lead are formed in advance on the film carrier 3, and the IC chip is mounted on the film carrier 3, and the bumps on the IC chip and the inner lead are joined, and the film carrier 3, the IC chip, and the inner lead are integrated. By sealing with resin, as shown in Fig. 1,
A main body 2 is formed on the ICC component, and leads (outer leads) 4 protruding from the main body 2 in all directions are formed. Note that the film carrier 3 is notched at the lead 4 portion.

In FIG. 2, reference numeral 5 denotes a mounting head which is capable of suctioning and suctioning the IC component 2 through the suction hole 6 and mounting it onto the circuit board 7.

8 is a recessed part of the mounting head, and the lower end of the mounting head 5 has an ICC.
The parts are formed to have the same planar shape, and the main body 2 of the IC part 1 is fitted therein. Reference numeral 9 denotes a laser beam irradiation unit which can irradiate the bonding portion on the electrode of the substrate with laser light. IO is a hot air supply unit that can spray hot air onto the joints on the electrodes of the substrate.

In addition, in FIG. 3, 11 is an electrode on the circuit board 7;
2 is a metal solder (eg, 30 μm thick).

The operation of mounting the IC component 1 in the laser beam lead bonding apparatus configured as described above will be described.

On the ICC component picked up by the mounting head 5, and on the 6th ICC component mounted on the circuit board 7, while the ICC component is fixed by the mounting head 5, an outlet velocity of 10rn/
Hot air of approximately 100° C. is injected and supplied toward the reed 4 at a wind speed of s. The opening area of hot air supply section lO is 2+yuoX
It is 15 mm long and is large enough to include all 4 bottles on one side. While hot air is being supplied from the hot air supply section (2) 0, the leads 4 are irradiated with laser light from the laser light irradiation section 9.

The laser beam is scanned at a scanning speed of 10 mm/s, for example,
ICC parts lead 4 and electrode 1! Soldering between] 2
is heated and melted to join the lead 4 and the electrode 11. When joining the lead 4 and the electrode 11, hot air is sprayed onto the lead 4 from the hot air supply unit 10, so the lead 4 is pressed against the surface of the electrode 11, which eliminates floating of the lead and eliminates poor connection. .

As described above, according to this embodiment, the lead 4 of the IC component 1
When bonding the electrodes 12 of the circuit board 7 and the circuit board 7 using the laser beam irradiation section 9, hot air is sprayed onto the leads 4 from the hot air supply section 10, so that the leads 4 are pressed onto the surface of the electrodes 11, thereby preventing the leads from floating. This problem can be resolved and connection failures can be eliminated.

In this embodiment, the case of an ICC component cut from the film carrier 3 has been described, but the present invention can also be applied to IC components other than the film carrier 3.

In addition to using solder plating as the bonding metal between the lead 4 and the electrode 11, it is also possible to apply a bonding metal such as cream solder and then reflow the bonding metal.

Furthermore, in this embodiment, the temperature of the hot air supplied from the hot air supply unit 10 may be lower than the heat resistance of the ICC components, and the exit speed of the hot air supplied from the hot air supply unit IO may be adjusted to eliminate floating of the lead. It is sufficient as long as the speed is the same.

Effects of the Invention As described above, the present invention provides a method of blowing hot air onto the leads in order to press the leads onto the electrode surface when joining the leads of an IC component and the electrodes of a circuit board by laser light irradiation from a laser light irradiation part. By providing a hot air supply unit for spraying and supplying hot air, floating of the leads can be eliminated, connection failures can be eliminated, and highly reliable IC components can be obtained.

[Brief explanation of the drawing]

Figure 1 is a perspective view of an IC component, Figure 2 is a cross-sectional view of the main parts of a lead bonding device using a laser beam, Figure 3 is an enlarged cross-sectional view of the main parts in Figure 2, and Figure 4 is a conventional laser beam-based lead bonding device. FIG. 1-I C component 4...Lead 5...Mounting head 7...Circuit board 9...Laser light irradiation section IO...Hot air supply section Fig. 1

Claims (1)

[Claims] A method using a laser beam having a mounting head for mounting an IC component at a predetermined position on a board, a laser generating means, and a laser irradiation section for irradiating the lead of the IC component with the laser beam generated from the laser generating means. A lead joining apparatus using a laser beam, characterized in that a hot air supply section is arranged in parallel with the mounting head, and the hot air supply section is disposed so that hot air from the hot air supply section is jetted toward the leads during laser beam irradiation.