JPH0447949Y2 - - Google Patents
Info
- Publication number
- JPH0447949Y2 JPH0447949Y2 JP1986006541U JP654186U JPH0447949Y2 JP H0447949 Y2 JPH0447949 Y2 JP H0447949Y2 JP 1986006541 U JP1986006541 U JP 1986006541U JP 654186 U JP654186 U JP 654186U JP H0447949 Y2 JPH0447949 Y2 JP H0447949Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- chip
- same
- electrodes
- lead electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003825 pressing Methods 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011104 metalized film Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986006541U JPH0447949Y2 (US06265458-20010724-C00056.png) | 1986-01-22 | 1986-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986006541U JPH0447949Y2 (US06265458-20010724-C00056.png) | 1986-01-22 | 1986-01-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62120334U JPS62120334U (US06265458-20010724-C00056.png) | 1987-07-30 |
| JPH0447949Y2 true JPH0447949Y2 (US06265458-20010724-C00056.png) | 1992-11-12 |
Family
ID=30789153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986006541U Expired JPH0447949Y2 (US06265458-20010724-C00056.png) | 1986-01-22 | 1986-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447949Y2 (US06265458-20010724-C00056.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0635459Y2 (ja) * | 1988-06-14 | 1994-09-14 | 株式会社指月電機製作所 | 金属化フイルムコンデンサ |
| CN112992547B (zh) * | 2016-10-04 | 2022-11-11 | 湖北工业株式会社 | 芯片型电解电容器的引线端子、芯片型电解电容器的制造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5028353Y2 (US06265458-20010724-C00056.png) * | 1971-03-05 | 1975-08-21 | ||
| JPS59151424U (ja) * | 1983-03-29 | 1984-10-11 | 富士通株式会社 | チツプ状電子部品のスタンドオフ構造 |
-
1986
- 1986-01-22 JP JP1986006541U patent/JPH0447949Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62120334U (US06265458-20010724-C00056.png) | 1987-07-30 |
