JPH0446858Y2 - - Google Patents
Info
- Publication number
- JPH0446858Y2 JPH0446858Y2 JP1985195988U JP19598885U JPH0446858Y2 JP H0446858 Y2 JPH0446858 Y2 JP H0446858Y2 JP 1985195988 U JP1985195988 U JP 1985195988U JP 19598885 U JP19598885 U JP 19598885U JP H0446858 Y2 JPH0446858 Y2 JP H0446858Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holding
- main surface
- coating device
- holding part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 56
- 238000004528 spin coating Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、フオトマスクブランク、透明導電膜
付基板等の被エツチング層を有する多角形の基板
上にレジスト膜を形成する回転塗布装置に関する
ものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a spin coating device for forming a resist film on a polygonal substrate having a layer to be etched, such as a photomask blank or a substrate with a transparent conductive film. It is.
従来、この種の装置は第４図に示すものがあつ
た。なお、同図ａは平面図であり、同図ｂはX4
−X4線断面図である。この回転塗布装置は、主
表面が四角形のフオトマスクブランク等の基板１
を載置する環状突起部２５を固設した円板状の保
持部２と、この保持部２を回転させるための回転
軸（図示せず。）を嵌合・挿入させるための嵌合
部４が設けられた円筒状の回転軸受部５とを具備
していた。そして、この保持部２は、その直径
が、基板１の対角線の寸法よりも小さく、さらに
保持部２の環状突起部２５の内側には、基板１を
環状突起部２５に吸着させるための４個の真空吸
着用穴２６が設けられ、一方、回転軸受部５の内
部には真空吸着用穴２６と連結している穴７が設
けられている。
Conventionally, there has been a device of this type as shown in FIG. Note that figure a is a plan view, and figure b is an X 4
-X4 line sectional view. This rotary coating device is used to coat a substrate 1 such as a photomask blank whose main surface is square.
A disc-shaped holding part 2 with a fixed annular protrusion 25 on which the holding part 2 is placed, and a fitting part 4 into which a rotating shaft (not shown) for rotating the holding part 2 is fitted and inserted. A cylindrical rotary bearing portion 5 was provided. This holding part 2 has a diameter smaller than the diagonal dimension of the substrate 1, and furthermore, inside the annular protrusion 25 of the holding part 2, there are four holes for adsorbing the substrate 1 to the annular protrusion 25. A hole 26 for vacuum suction is provided, and a hole 7 connected to the hole 26 for vacuum suction is provided inside the rotary bearing portion 5.
この回転塗布装置によつて、基板１上にレジス
ト膜を形成する方法は、先ず保持部２の環状突起
部２５上に基板１を載置し、真空吸着用穴２２と
穴７とを介して真空ポンプ（図示せず。）によつ
て基板１を真空吸着する。次に、基板１の主表面
上にレジスト液を滴下し、所望する回転数及び回
転時間で、保持部２を回転、すなわち基板１を回
転してレジスト膜を、基板１の主表面上に形成す
る。 The method of forming a resist film on a substrate 1 using this spin coating device is to first place the substrate 1 on the annular protrusion 25 of the holding part 2, and apply the resist film through the vacuum suction hole 22 and the hole 7. The substrate 1 is vacuum-adsorbed using a vacuum pump (not shown). Next, the resist solution is dropped onto the main surface of the substrate 1, and the holding unit 2 is rotated at a desired rotation speed and rotation time, that is, the substrate 1 is rotated to form a resist film on the main surface of the substrate 1. do.
しかしながら、従来の回転塗布装置では、第５
図に示すように基板１の裏面１ａ（レジスト膜を
形成した面と相対向する主表面）の角の付近に
は、剥離してゴミとなる、レジストの糸状物３が
付着してしまう欠点があつた。すなわち、保持部
２に基板１を保持し、回転したとき、保持部２か
ら外側の、基板１の部分（図で示す一点鎖線より
も外側の部分）のみならず、一点鎖線の内側にも
糸状物３が付着してしまう欠点があつた。これ
は、基板１が回転すると、基板１の保持部２から
外に出ている角に対する空気抵抗が大きく、その
空気抵抗によつて、裏面１ａの角の付近に、回転
中に基板１から飛散したレジストの糸状物３が付
着することによる。
However, in conventional spin coating equipment, the fifth
As shown in the figure, there is a drawback that resist filaments 3, which peel off and become dust, adhere to the corners of the back surface 1a (the main surface facing the surface on which the resist film is formed) of the substrate 1. It was hot. In other words, when the substrate 1 is held in the holding part 2 and rotated, thread-like formation occurs not only in the part of the substrate 1 outside the holding part 2 (the part outside the dashed-dotted line shown in the figure) but also inside the dashed-dotted line. There was a drawback that object 3 would stick to it. This is because when the substrate 1 rotates, there is a large air resistance against the corners of the substrate 1 protruding from the holding part 2, and due to this air resistance, particles are scattered from the substrate 1 near the corners of the back surface 1a during rotation. This is due to the adhesion of resist filaments 3.
本考案は、前述した問題点を除去するためにな
されたもので、その特徴は主表面が多角形の基板
を保持し、回転させる保持部を具備し、前記基板
の一主表面にレジスト膜を形成する回転塗布装置
において、
前記保持部は、円形又は多角形状の保持面と、
前記基板の角の下方に位置する部分のみが切り欠
かれた切欠部とを具備し、かつ前記保持面の直径
又は対角線の長さが、前記基板の主表面の対角線
の長さ以上であることを特徴とする回転塗布装置
である。
The present invention was devised to eliminate the above-mentioned problems, and its features include a holder that holds and rotates a substrate whose main surface is polygonal, and a resist film is formed on one main surface of the substrate. In the spin coating device, the holding portion includes a circular or polygonal holding surface;
Only the portion located below the corner of the substrate is provided with a cutout portion, and the diameter or diagonal length of the holding surface is equal to or longer than the diagonal length of the main surface of the substrate. This is a rotary coating device characterized by:
本考案は、回転塗布装置の保持部の保持面の直
径又は対角線の長さが、基板の主表面の対角線の
長さ以上であることから、空気抵抗を抑えること
ができ、これによりレジストの糸状物が基板裏面
に付着することを減少させることができる。ま
た、基板の角に対するところが切り欠かれた切欠
部を有していることから、基板を保持部から外す
ことも効率よく行うことができる。
In the present invention, since the diameter or diagonal length of the holding surface of the holding part of the spin coating device is greater than or equal to the diagonal length of the main surface of the substrate, air resistance can be suppressed, thereby making it possible to prevent the resist from becoming filamentous. It is possible to reduce the adhesion of substances to the back surface of the substrate. Further, since the substrate has a cutout portion corresponding to the corner thereof, the substrate can be efficiently removed from the holding portion.
本考案の回転塗布装置の実施例を図に基づいて
以下に詳述する。
An embodiment of the spin coating device of the present invention will be described in detail below based on the drawings.
〔実施例 １〕
本例を第１図に基づき説明する。なお、同図ａ
は平面図、同図ｂはその部分拡大平面図、同図ｃ
は同図ａのX1−X1線断面図及び同図ｄはその部
分拡大断面図である。[Example 1] This example will be explained based on FIG. 1. In addition, the figure a
is a plan view, b is a partially enlarged plan view, and c is a partially enlarged plan view.
is a sectional view taken along the line X 1 -X 1 in figure a, and figure d is a partially enlarged sectional view thereof.
本例の回転塗布装置１０は、環状突起部１１ａ
（内径：120mm、幅：0.5mm、高さ：0.5mm）を設
け、この環状突起部１１ａ上に主表面が矩形（５
インチ×５インチで、対角線の寸法は177.8mmで
ある。）の例えば被エツチング層としてCr膜から
なる遮光性膜を有するフオトマスクブランク１を
載置して、真空吸着により保持する円板状の保持
部１１（保持面１１ｂの直径は183mmであり、厚
さは７mmである。）と、従来と同様の嵌合部４と
穴７とを有する回転軸受部５とを具備している。
なお、環状突起部１１ａは保持部１１に対して同
心円状に配置している。 The spin coating device 10 of this example has an annular protrusion 11a.
(inner diameter: 120 mm, width: 0.5 mm, height: 0.5 mm), and the main surface is rectangular (5 mm) on this annular protrusion 11a.
inches by 5 inches, with diagonal dimensions of 177.8 mm. ), on which a photomask blank 1 having a light-shielding film made of Cr film as a layer to be etched is placed and held by vacuum suction. 7 mm), and a rotary bearing part 5 having a fitting part 4 and a hole 7 similar to the conventional one.
Note that the annular projection portion 11a is arranged concentrically with respect to the holding portion 11.
本例の保持部１１には、４個の切欠部１２，１
３，１４，１５（奥行L1：7.2mm、幅L2：12.8mm、
傾斜角θ：20°）が、保持部１１の周縁に設けら
れており、さらに従来と同様に真空吸着用穴１１
ｃが４個設けられている。尚、上記切欠部１２〜
１５は、保持部１１の周縁部に向かつて下方に傾
斜している。 The holding part 11 of this example has four notches 12, 1
3, 14, 15 (depth L 1 : 7.2mm, width L 2 : 12.8mm,
An inclination angle θ: 20°) is provided on the periphery of the holding portion 11, and as in the conventional case, a vacuum suction hole 11 is provided.
Four c are provided. In addition, the above-mentioned notch 12~
15 is inclined downward toward the peripheral edge of the holding part 11.
この切欠部１２，１３，１４，１５は、それぞ
れフオトマスクブランク１を保持部１１に保持し
たとき、フオトマスクブランク１の四つの角１
ａ，１ｂ，１ｃ，１ｄが配置するような位置に設
けられている。さらに、第１図ｂに示すように、
例えば角１ａに対する切欠部１２は、第１図ａに
示す矢印方向に基板１が回転するとき、角１ａと
切欠部１２の一方の側面１２ａとの距離L21と、
角１ａと切欠部１２のもう一方の側面１２ｂとの
距離L22とは異なり、距離L21の方が距離L22より
も短く（例えば、L21は3.6mm、L22は9.2mmであ
る。）なるように設けられている。そして、角１
ａは切欠部１２上方において突出している（突出
距離L11：約４mm）。他の角１ｂ，１ｃ，１ｄに対
するそれぞれの切欠部１３，１４，１５も同様に
保持部１１に設けられている。また、これら切欠
部１２，１３，１４，１５は、平面的に見て、保
持部１１と同心円状のリングの一部となつてい
る。 These notches 12, 13, 14, and 15 are located at the four corners 1 of the photomask blank 1 when the photomask blank 1 is held in the holding portion 11, respectively.
They are provided at positions where a, 1b, 1c, and 1d are arranged. Furthermore, as shown in Figure 1b,
For example, when the notch 12 with respect to the corner 1a rotates in the direction of the arrow shown in FIG .
Unlike the distance L 22 between the corner 1a and the other side surface 12b of the notch 12, the distance L 21 is shorter than the distance L 22 (for example, L 21 is 3.6 mm and L 22 is 9.2 mm). ). And corner 1
a protrudes above the notch 12 (protrusion distance L 11 : approximately 4 mm). Respective notches 13, 14, and 15 for the other corners 1b, 1c, and 1d are similarly provided in the holding portion 11. Moreover, these notches 12, 13, 14, and 15 are part of a ring that is concentric with the holding portion 11 when viewed from above.
本例においてレジスト膜を形成する方法は、従
来と同様に、先ず基板（フオトマスクブランク）
１を環状突起部１１ａ上に、基板１の中心と保持
部１１との中心とをほぼ一致させて載置し、真空
吸着用穴１１ｃにより吸引して真空吸着する。次
に、基板１の主表面上にレジスト液（例えば、粘
度30cpのポジ型の電子線レジストであるポリブ
テン−１−スルホン）を滴下する。次に、所望す
る回転数、回転時間で基板１を回転してレジスト
膜を形成する。 In this example, the method of forming a resist film is as in the conventional method. First, a substrate (photomask blank) is formed.
1 is placed on the annular protrusion 11a so that the center of the substrate 1 and the center of the holding part 11 almost coincide with each other, and vacuum suction is performed by suction through the vacuum suction hole 11c. Next, a resist liquid (for example, polybutene-1-sulfone, which is a positive electron beam resist with a viscosity of 30 cp) is dropped onto the main surface of the substrate 1. Next, the substrate 1 is rotated at a desired rotation speed and rotation time to form a resist film.
本例によれば、先ず保持部１１の直径に対して
基板１の対角線の長さが小さいことから、基板１
の裏面の角の稜の付近にのみ、レジストの糸状物
が付着し、従来のように多くの糸状物は付着して
いなかつた。また、本例では、基板１の下方に位
置する保持部１１に切欠部１２〜１５が設けられ
ていることから、レジスト膜を形成した後、基板
１を保持部１１から容易に取り外すことができ
る。また、切欠部１２〜１５の設けられている位
置を、角１ａ〜１ｄから距離L21を距離L22に対し
て小となるように決定していることから、本例の
回転方向のときは、切欠部１２〜１５を設けるこ
とによつて回転時に生ずる空気抵抗も、抑えるこ
とができ、レジストの糸状物を付着させることは
ない。また、切欠部１２〜１５が、平面的にはリ
ング状の一部であることから、切欠部１２〜１５
による空気抵抗も抑えることができる。さらに、
基板１の下方に切欠部１２〜１５を設けている
が、角１ａ〜１ｄの下方に位置する保持部を完全
に切り欠いてはいないことから、空気抵抗を抑え
る効果がある。 According to this example, first, since the length of the diagonal line of the substrate 1 is smaller than the diameter of the holding part 11, the substrate 1
The filaments of the resist were attached only near the ridges of the corners on the back side, and there were not as many filaments attached as in the past. Further, in this example, since the notches 12 to 15 are provided in the holding part 11 located below the substrate 1, the substrate 1 can be easily removed from the holding part 11 after forming the resist film. . In addition, since the positions of the notches 12 to 15 are determined so that the distance L 21 from the corners 1a to 1d is smaller than the distance L 22 , in the rotation direction of this example, By providing the notches 12 to 15, air resistance that occurs during rotation can be suppressed, and resist filaments do not adhere. Moreover, since the notches 12 to 15 are part of a ring shape in plan view, the notches 12 to 15
It can also reduce air resistance. moreover,
Although notches 12 to 15 are provided below the substrate 1, the holding portions located below the corners 1a to 1d are not completely cut out, which has the effect of suppressing air resistance.
〔実施例 ２〕
本例を第２図に基づき説明する。同図ａは平面
図、同図ｂはその部分拡大平面図、同図ｃは同図
ａのX2−X2線断面図及び同図ｄはその部分拡大
断面図である。[Example 2] This example will be explained based on FIG. 2. Figure a is a plan view, figure b is a partially enlarged plan view, figure c is a cross-sectional view taken along line X2 - X2 of figure a, and figure d is a partially enlarged cross-sectional view.
本例の回転塗布装置１０′と前記実施例１の回
転塗布装置１０とは、保持部及び保持部に設けら
れた切欠部が異なり、他は同様であることから、
保持部及び切欠部について説明し、他の説明は省
略する。 The spin coating device 10' of this example and the spin coating device 10 of Example 1 differ in the holding part and the notch provided in the holding part, but are otherwise similar.
The holding part and the notch will be explained, and other explanations will be omitted.
先ず、保持部１６は、保持面１６ａが矩形
（140×140mm）である薄板（厚さ：７mm）からな
り、この保持部１６の４角には、三角錘状に切り
欠かれた切欠部１７，１８，１９，２０が設けら
れている。そして、この切欠部１７〜２０につい
てさらに詳述する。第２図ｂ及び同図ｄに示す切
欠部１７は、底面が直角三角形状であり、その直
角を挟む二辺の長さL3，L4は共に6.5mmであり、
底面の斜辺の長さL5は、約9.1mmである。また、
この切欠部１７は、傾斜角θ（例えば、約20°）に
切り欠かれる。これにより、切欠部１７は保持部
１６の周縁部に向かつて下方に傾斜している。他
の切欠部１８〜２０についても同様に形成されて
いる。また、この保持部１６に保持される基板１
は、基板１の主表面が５インチ×５インチである
こから、保持部１６の保持面１６ａ内に配置さ
れ、かつ、基板１の４角１ａ，１ｂ，１ｃ，１ｄ
はそれぞれ、切欠部１７，１８，１９，２０の上
方に、保持面１６ａの対角線と基板１の主表面の
対角線と一致して配置されている。なお、１６ｂ
及び１６ｃは、それぞれ環状突起部及び真空吸着
用穴を示す。 First, the holding part 16 is made of a thin plate (thickness: 7 mm) with a holding surface 16a having a rectangular shape (140 x 140 mm), and the four corners of this holding part 16 have notches 17 cut out in the shape of a triangular pyramid. , 18, 19, and 20 are provided. The notches 17 to 20 will now be described in further detail. The notch 17 shown in FIGS. 2b and 2d has a right triangular bottom, and the lengths L 3 and L 4 of the two sides sandwiching the right angle are both 6.5 mm.
The length L 5 of the oblique side of the bottom is approximately 9.1 mm. Also,
This notch 17 is cut out at an inclination angle θ (for example, about 20°). As a result, the cutout portion 17 is inclined downward toward the peripheral edge of the holding portion 16. The other notches 18 to 20 are formed in the same manner. In addition, the substrate 1 held by this holding part 16
Since the main surface of the substrate 1 is 5 inches x 5 inches, is arranged within the holding surface 16a of the holding part 16, and is located at the four corners 1a, 1b, 1c, 1d of the substrate 1.
are arranged above the notches 17, 18, 19, and 20, respectively, in alignment with the diagonal of the holding surface 16a and the diagonal of the main surface of the substrate 1. In addition, 16b
and 16c indicate an annular protrusion and a vacuum suction hole, respectively.
この保持部１６により、基板１の主表面にレジ
スト膜を形成する方法は、前記実施例１と同様で
ある。 The method of forming a resist film on the main surface of the substrate 1 using the holding portion 16 is the same as in the first embodiment.
以上、本考案は前記実施例１，２に限らず、下
記のものであつてもよい。 As mentioned above, the present invention is not limited to the first and second embodiments described above, but may be as follows.
先ず、切欠部の形状は、第３図に示すようなも
のであつてもよい。すなわち、切欠部２２は、保
持部２１が実施例１と同様に円板状であり、基板
１の角に対する保持部２１の周縁のところが切り
落とされた形状のものである。これは、実施例２
で示した主表面が矩形状の保持部に対しても同様
に切り落とされた形状にすることができる。 First, the shape of the notch may be as shown in FIG. That is, the notch 22 has a shape in which the holding part 21 is disk-shaped like in the first embodiment, and the peripheral edge of the holding part 21 relative to the corner of the substrate 1 is cut off. This is Example 2
The holding portion whose main surface is rectangular as shown in can be similarly cut off.
また、保持部は、前記実施例１，２のような円
板状、主表面が矩形の薄板に限らず、他の形状、
例えば、主表面が長方形等の多角形状の薄板であ
つてもよく、また環状突起部を設けていない保持
部であつてもよい。また、保持面に基板の位置決
め用ピンを設けた保持部でもよい。また、本考案
によれば、レジストは前述したポジ型の電子線レ
ジストに限らず、フオトレジスト等の他のレジス
トであつてもよいが、特に粘度の高いレジスト、
すなわち30cp以上の粘度のレジストに対して効
果がある。 In addition, the holding portion is not limited to a disk-shaped thin plate with a rectangular main surface as in the first and second embodiments, but may have other shapes,
For example, the main surface may be a thin plate having a polygonal shape such as a rectangle, or the holding portion may not have an annular protrusion. Also, the holding portion may have a positioning pin for the substrate on the holding surface. According to the present invention, the resist is not limited to the above-mentioned positive electron beam resist, and may be other resists such as photoresist, but particularly high viscosity resists,
In other words, it is effective for resists with a viscosity of 30 cp or more.
さらに、本考案によれば、基板は、前述した遮
光層を被エツチング層として有するフオトマスク
ブランクに限らず、他の基板、例えばインジウ
ム・テイン・オキサイド等からなる透明導電膜を
被エツチング層として有する基板にも適用するこ
とができ、基板の主表面が矩形に限らず、長方形
等の他の多角形の基板にも適用することができ
る。また、本考案によれば、保持部の基板の角の
下方に位置する部分のみに切欠部を有しているの
で、基板の裏面にレジストの糸状物が付着する面
積および付着箇所が最小限に押さえられる。な
お、切欠部は基板の角の下方に位置する部分の少
なくとも１ケ所以上に設ければよい。 Further, according to the present invention, the substrate is not limited to the photomask blank having the above-mentioned light shielding layer as the layer to be etched, but also other substrates, such as having a transparent conductive film made of indium tein oxide or the like as the layer to be etched. The present invention can also be applied to a substrate, and the main surface of the substrate is not limited to a rectangular shape, but can also be applied to a substrate having a rectangular or other polygonal shape. In addition, according to the present invention, since the holding part has a notch only in the portion located below the corner of the substrate, the area and the locations where resist filaments adhere to the back surface of the substrate are minimized. Being held down. Note that the cutout portion may be provided at at least one location below the corner of the substrate.
本考案は以上のような構造であることから、基
板の裏面にレジストの糸状物の付着を防止するこ
とができ、したがつて、糸状物が剥離してゴミを
生ずることもなくなる。
Since the present invention has the above-described structure, it is possible to prevent filaments of the resist from adhering to the back surface of the substrate, and therefore, the filaments do not peel off and generate dust.
第１図は本考案の回転塗布装置の一実施例を示
す図であり、同図ａは平面図、同図ｂはその部分
拡大平面図、同図ｃは同図ａのX1−X1線断面図
及び同図ｄはその部分拡大断面図である。第２図
は本考案の他の実施例を示す図であり、同図ａは
平面図、同図ｂはその部分拡大平面図、同図ｃは
同図ａのX2−X2線断面図及び同図ｄはその部分
拡大断面図であり、第３図はさらに他の実施例を
示す図であり、同図ａは部分拡大平面図及び同図
ｂは部分拡大断面図である。第４図は従来の回転
塗布装置を示す図であり、同図ａは平面図及び同
図ｂは同図ａのX4−X4線断面図であり、第５図
は基板の裏面に付着したレジストの糸状物を示す
平面図である。
１……基板、１０，１０′……回転塗布装置、
１１，１６，２１……保持部、１２〜１５，１７
〜２０，２２……切欠部。
FIG. 1 is a diagram showing an embodiment of the spin coating apparatus of the present invention, in which a is a plan view, b is a partially enlarged plan view, and c is a cross-sectional view of X 1 - X 1 of a of the present invention. A line sectional view and FIG. d are a partially enlarged sectional view thereof. Fig. 2 is a diagram showing another embodiment of the present invention, in which Fig. 2a is a plan view, Fig. 2b is a partially enlarged plan view thereof, and Fig. 2c is a sectional view taken along the line X 2 - X 2 of Fig. 2a . FIG. 3 is a diagram showing still another embodiment, FIG. 3A is a partially enlarged plan view, and FIG. 3B is a partially enlarged sectional view. Fig. 4 is a diagram showing a conventional spin coating device, Fig. 4a is a plan view, Fig. 4b is a sectional view taken along the line X 4 - FIG. 2 is a plan view showing filamentous resist. 1...Substrate, 10,10'...Rotary coating device,
11, 16, 21...Holding section, 12-15, 17
~20,22... Notch.
Claims (1)
る保持部１１，１６，２１を具備し、前記基板
１の一主表面にレジスト膜を形成する回転塗布
装置において、 前記保持部１１，１６，２１は、円形又は多
角形状の保持面１１ｂ，１６ａと、前記基板１
の角の下方に位置する部分のみが切り欠かれた
切欠部１２〜１５，１７〜２０，２２とを具備
し、かつ前記保持面１１ｂ，１６ａの直径又は
対角線の長さが、前記基板１の主表面の対角線
の長さ以上であることを特徴とする回転塗布装
置。 (2) 前記切欠部１２〜１５，１７〜２０，２２
は、保持部１１，１６，２１の周縁部に向かつ
て下方に傾斜して形成されていることを特徴と
する実用新案登録請求の範囲第１項記載の回転
塗布装置。[Claims for Utility Model Registration] (1) A rotation system comprising holding parts 11, 16, and 21 for holding and rotating a substrate 1 whose main surface is a polygon, and for forming a resist film on one main surface of the substrate 1. In the coating device, the holding parts 11, 16, 21 have circular or polygonal holding surfaces 11b, 16a, and the substrate 1.
It has notches 12 to 15, 17 to 20, and 22 in which only the portions located below the corners of the substrate 1 are cut out, and the diameter or diagonal length of the holding surfaces 11b and 16a is the same as that of the substrate 1. A rotary coating device characterized in that the length is longer than the diagonal of the main surface. (2) The cutout portions 12 to 15, 17 to 20, 22
The spin coating device according to claim 1, wherein is formed to be inclined downward toward the peripheral edge of the holding portions 11, 16, and 21.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985195988U JPH0446858Y2 (en) | 1985-12-19 | 1985-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985195988U JPH0446858Y2 (en) | 1985-12-19 | 1985-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62103478U JPS62103478U (en) | 1987-07-01 |
| JPH0446858Y2 true JPH0446858Y2 (en) | 1992-11-05 |
Family
ID=31154386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985195988U Expired JPH0446858Y2 (en) | 1985-12-19 | 1985-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446858Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59104650A (en) * | 1982-12-07 | 1984-06-16 | Toshiba Corp | Resist film forming device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57102135U (en) * | 1980-12-12 | 1982-06-23 |
-
1985
- 1985-12-19 JP JP1985195988U patent/JPH0446858Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59104650A (en) * | 1982-12-07 | 1984-06-16 | Toshiba Corp | Resist film forming device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62103478U (en) | 1987-07-01 |
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