JPH0445248Y2 - - Google Patents
Info
- Publication number
- JPH0445248Y2 JPH0445248Y2 JP19482886U JP19482886U JPH0445248Y2 JP H0445248 Y2 JPH0445248 Y2 JP H0445248Y2 JP 19482886 U JP19482886 U JP 19482886U JP 19482886 U JP19482886 U JP 19482886U JP H0445248 Y2 JPH0445248 Y2 JP H0445248Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- heat
- lsi
- cap
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 32
- 238000009423 ventilation Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 description 14
- 206010040844 Skin exfoliation Diseases 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19482886U JPH0445248Y2 (enrdf_load_html_response) | 1986-12-17 | 1986-12-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19482886U JPH0445248Y2 (enrdf_load_html_response) | 1986-12-17 | 1986-12-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6398644U JPS6398644U (enrdf_load_html_response) | 1988-06-25 |
JPH0445248Y2 true JPH0445248Y2 (enrdf_load_html_response) | 1992-10-23 |
Family
ID=31152163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19482886U Expired JPH0445248Y2 (enrdf_load_html_response) | 1986-12-17 | 1986-12-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0445248Y2 (enrdf_load_html_response) |
-
1986
- 1986-12-17 JP JP19482886U patent/JPH0445248Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6398644U (enrdf_load_html_response) | 1988-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5324773B2 (ja) | 回路モジュールとその製造方法 | |
US5272599A (en) | Microprocessor heat dissipation apparatus for a printed circuit board | |
JPH10125832A (ja) | 熱伝導方法および装置 | |
TWI467116B (zh) | 散熱模組結合構造 | |
US20040156174A1 (en) | System and method for dissipating heat from an electronic board | |
JPH0445248Y2 (enrdf_load_html_response) | ||
US5963428A (en) | Cooling cap method and apparatus for tab packaged integrated circuit | |
JPH0648863Y2 (ja) | 集積回路の冷却構造 | |
JPH0685120A (ja) | 電子部品の冷却装置 | |
JPH05160306A (ja) | 放熱構造 | |
JPH0322951Y2 (enrdf_load_html_response) | ||
JP2912268B2 (ja) | 電子部品の放熱方法および装置 | |
JPH0445249Y2 (enrdf_load_html_response) | ||
JPS6175137U (enrdf_load_html_response) | ||
JP2888192B2 (ja) | 表面実装部品の放熱構造 | |
JPH11251496A (ja) | Icの冷却構造 | |
JP2000223617A (ja) | 半導体装置の実装構造 | |
JPS6169838U (enrdf_load_html_response) | ||
JPH043503Y2 (enrdf_load_html_response) | ||
JPS62206867A (ja) | 液体冷却装置付半導体装置 | |
JPH1140742A (ja) | 電子回路パッケージ | |
JPS60103845U (ja) | 半導体の冷却装置 | |
JPS6439648U (enrdf_load_html_response) | ||
JPH0192140U (enrdf_load_html_response) | ||
JP2001210766A (ja) | ヒートシンク |