JPH0444371U - - Google Patents

Info

Publication number
JPH0444371U
JPH0444371U JP8658090U JP8658090U JPH0444371U JP H0444371 U JPH0444371 U JP H0444371U JP 8658090 U JP8658090 U JP 8658090U JP 8658090 U JP8658090 U JP 8658090U JP H0444371 U JPH0444371 U JP H0444371U
Authority
JP
Japan
Prior art keywords
metal fitting
plating
wafer
semiconductor wafer
lid body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8658090U
Other languages
English (en)
Japanese (ja)
Other versions
JP2517023Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8658090U priority Critical patent/JP2517023Y2/ja
Publication of JPH0444371U publication Critical patent/JPH0444371U/ja
Application granted granted Critical
Publication of JP2517023Y2 publication Critical patent/JP2517023Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP8658090U 1990-08-18 1990-08-18 半導体ウェーハのめっき装置 Expired - Lifetime JP2517023Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8658090U JP2517023Y2 (ja) 1990-08-18 1990-08-18 半導体ウェーハのめっき装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8658090U JP2517023Y2 (ja) 1990-08-18 1990-08-18 半導体ウェーハのめっき装置

Publications (2)

Publication Number Publication Date
JPH0444371U true JPH0444371U (en, 2012) 1992-04-15
JP2517023Y2 JP2517023Y2 (ja) 1996-11-13

Family

ID=31818317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8658090U Expired - Lifetime JP2517023Y2 (ja) 1990-08-18 1990-08-18 半導体ウェーハのめっき装置

Country Status (1)

Country Link
JP (1) JP2517023Y2 (en, 2012)

Also Published As

Publication number Publication date
JP2517023Y2 (ja) 1996-11-13

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