JPH0442745U - - Google Patents
Info
- Publication number
- JPH0442745U JPH0442745U JP8313290U JP8313290U JPH0442745U JP H0442745 U JPH0442745 U JP H0442745U JP 8313290 U JP8313290 U JP 8313290U JP 8313290 U JP8313290 U JP 8313290U JP H0442745 U JPH0442745 U JP H0442745U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- sealed
- semiconductor
- semiconductor device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の実施例の断面図、第２図は従
来の半導体装置の断面図、第３図は第２図の樹脂
部を研摩した図、第４図はソリの状況説明図であ
る。
１……ＣＯＢ基板、２……枠体、３……半導体
素子、９……シリコーン樹脂。
Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a sectional view of a conventional semiconductor device, Fig. 3 is a view of the resin part in Fig. 2 polished, and Fig. 4 is an explanatory diagram of warping. be. DESCRIPTION OF SYMBOLS 1... COB board, 2... Frame, 3... Semiconductor element, 9... Silicone resin.
Claims (1)
半導体素子の電極と前記基板上のポスト電極とを
ワイヤボンデイングし且つ前記半導体素子のボン
デイング部分を熱硬化性樹脂で封止して成る半導
体装置において、半導体素子搭載部の該半導体素
子周辺にシリコーン樹脂層を設けたことを特徴と
する樹脂封止型半導体装置。 A semiconductor device comprising a semiconductor element mounted on a substrate, an electrode of the semiconductor element and a post electrode on the substrate wire-bonded, and a bonded portion of the semiconductor element sealed with a thermosetting resin. A resin-sealed semiconductor device characterized in that a silicone resin layer is provided around the semiconductor element in the element mounting section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8313290U JPH0442745U (en) | 1990-08-07 | 1990-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8313290U JPH0442745U (en) | 1990-08-07 | 1990-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442745U true JPH0442745U (en) | 1992-04-10 |
Family
ID=31630546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8313290U Pending JPH0442745U (en) | 1990-08-07 | 1990-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442745U (en) |
-
1990
- 1990-08-07 JP JP8313290U patent/JPH0442745U/ja active Pending
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