JPH0442058Y2 - - Google Patents

Info

Publication number
JPH0442058Y2
JPH0442058Y2 JP1985089573U JP8957385U JPH0442058Y2 JP H0442058 Y2 JPH0442058 Y2 JP H0442058Y2 JP 1985089573 U JP1985089573 U JP 1985089573U JP 8957385 U JP8957385 U JP 8957385U JP H0442058 Y2 JPH0442058 Y2 JP H0442058Y2
Authority
JP
Japan
Prior art keywords
molten solder
flow
solder
flow path
control plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985089573U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61205661U (enEXAMPLES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985089573U priority Critical patent/JPH0442058Y2/ja
Publication of JPS61205661U publication Critical patent/JPS61205661U/ja
Application granted granted Critical
Publication of JPH0442058Y2 publication Critical patent/JPH0442058Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1985089573U 1985-06-15 1985-06-15 Expired JPH0442058Y2 (enEXAMPLES)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985089573U JPH0442058Y2 (enEXAMPLES) 1985-06-15 1985-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985089573U JPH0442058Y2 (enEXAMPLES) 1985-06-15 1985-06-15

Publications (2)

Publication Number Publication Date
JPS61205661U JPS61205661U (enEXAMPLES) 1986-12-25
JPH0442058Y2 true JPH0442058Y2 (enEXAMPLES) 1992-10-02

Family

ID=30643775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985089573U Expired JPH0442058Y2 (enEXAMPLES) 1985-06-15 1985-06-15

Country Status (1)

Country Link
JP (1) JPH0442058Y2 (enEXAMPLES)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6593400B2 (ja) * 2017-08-04 2019-10-23 千住金属工業株式会社 噴流はんだ槽及び噴流はんだ付け装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS563101U (enEXAMPLES) * 1979-06-18 1981-01-12

Also Published As

Publication number Publication date
JPS61205661U (enEXAMPLES) 1986-12-25

Similar Documents

Publication Publication Date Title
EP0278166B1 (en) Soldering apparatus
US4465219A (en) Soldering apparatus
US4410126A (en) Mass soldering system
US4401253A (en) Mass soldering system
JP2001251047A (ja) プリント基板のはんだ付け方法および自動はんだ付け装置
US5772101A (en) Wave soldering machine
US6431431B2 (en) Apparatus and methods for wave soldering
EP0058766B1 (en) Soldering apparatus
JPH0442058Y2 (enEXAMPLES)
JPS6240967A (ja) はんだ付け方法
US6513702B2 (en) Automatic wave soldering apparatus and method
JPS63268563A (ja) 印刷配線回路板をはんだでマス結合する装置
JPS61289966A (ja) はんだ付け方法
JP3297258B2 (ja) はんだ付け装置における不活性ガス供給方法
CA1310547C (en) Soldering device
JPS61288491A (ja) はんだ付け方法
JPH08288634A (ja) はんだ付け装置
USRE32982E (en) Mass soldering system
JP2000022323A (ja) プリント基板のはんだ付け方法および噴流はんだ槽
JPS6182966A (ja) 噴流はんだ装置のノズル
JPH1093231A (ja) 噴流式自動半田付装置
JPH0373156B2 (enEXAMPLES)
JP3202870B2 (ja) はんだ付け装置
JPH1154902A (ja) はんだ付け装置
JP2001119134A (ja) はんだ付け装置