JPH0441558Y2 - - Google Patents
Info
- Publication number
- JPH0441558Y2 JPH0441558Y2 JP7751987U JP7751987U JPH0441558Y2 JP H0441558 Y2 JPH0441558 Y2 JP H0441558Y2 JP 7751987 U JP7751987 U JP 7751987U JP 7751987 U JP7751987 U JP 7751987U JP H0441558 Y2 JPH0441558 Y2 JP H0441558Y2
- Authority
- JP
- Japan
- Prior art keywords
- rod
- insulating substrate
- electrodes
- temperature fuse
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 10
- 229920001971 elastomer Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 3
- 230000008018 melting Effects 0.000 description 9
- 230000008646 thermal stress Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7751987U JPH0441558Y2 (US08197722-20120612-C00042.png) | 1987-05-22 | 1987-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7751987U JPH0441558Y2 (US08197722-20120612-C00042.png) | 1987-05-22 | 1987-05-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63186038U JPS63186038U (US08197722-20120612-C00042.png) | 1988-11-29 |
| JPH0441558Y2 true JPH0441558Y2 (US08197722-20120612-C00042.png) | 1992-09-30 |
Family
ID=30925599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7751987U Expired JPH0441558Y2 (US08197722-20120612-C00042.png) | 1987-05-22 | 1987-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0441558Y2 (US08197722-20120612-C00042.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6659239B2 (ja) * | 2015-05-28 | 2020-03-04 | デクセリアルズ株式会社 | 保護素子、ヒューズ素子 |
-
1987
- 1987-05-22 JP JP7751987U patent/JPH0441558Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63186038U (US08197722-20120612-C00042.png) | 1988-11-29 |
