JPH0440287Y2 - - Google Patents
Info
- Publication number
- JPH0440287Y2 JPH0440287Y2 JP1984199101U JP19910184U JPH0440287Y2 JP H0440287 Y2 JPH0440287 Y2 JP H0440287Y2 JP 1984199101 U JP1984199101 U JP 1984199101U JP 19910184 U JP19910184 U JP 19910184U JP H0440287 Y2 JPH0440287 Y2 JP H0440287Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- filter
- resin case
- receiving
- semiconductor light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984199101U JPH0440287Y2 (zh) | 1984-12-27 | 1984-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984199101U JPH0440287Y2 (zh) | 1984-12-27 | 1984-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61112659U JPS61112659U (zh) | 1986-07-16 |
| JPH0440287Y2 true JPH0440287Y2 (zh) | 1992-09-21 |
Family
ID=30758715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984199101U Expired JPH0440287Y2 (zh) | 1984-12-27 | 1984-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440287Y2 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2573087Y2 (ja) * | 1989-12-28 | 1998-05-28 | 三菱マテリアル 株式会社 | サージ吸収素子 |
-
1984
- 1984-12-27 JP JP1984199101U patent/JPH0440287Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61112659U (zh) | 1986-07-16 |
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