JPH0439224B2 - - Google Patents

Info

Publication number
JPH0439224B2
JPH0439224B2 JP13003386A JP13003386A JPH0439224B2 JP H0439224 B2 JPH0439224 B2 JP H0439224B2 JP 13003386 A JP13003386 A JP 13003386A JP 13003386 A JP13003386 A JP 13003386A JP H0439224 B2 JPH0439224 B2 JP H0439224B2
Authority
JP
Japan
Prior art keywords
etching
pure water
tank
semiconductor element
work holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13003386A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62287624A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13003386A priority Critical patent/JPS62287624A/ja
Publication of JPS62287624A publication Critical patent/JPS62287624A/ja
Publication of JPH0439224B2 publication Critical patent/JPH0439224B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
JP13003386A 1986-06-06 1986-06-06 半導体素子のエッチング装置 Granted JPS62287624A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13003386A JPS62287624A (ja) 1986-06-06 1986-06-06 半導体素子のエッチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13003386A JPS62287624A (ja) 1986-06-06 1986-06-06 半導体素子のエッチング装置

Publications (2)

Publication Number Publication Date
JPS62287624A JPS62287624A (ja) 1987-12-14
JPH0439224B2 true JPH0439224B2 (enrdf_load_stackoverflow) 1992-06-26

Family

ID=15024485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13003386A Granted JPS62287624A (ja) 1986-06-06 1986-06-06 半導体素子のエッチング装置

Country Status (1)

Country Link
JP (1) JPS62287624A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021116206B3 (de) * 2021-06-23 2022-09-29 Infineon Technologies Bipolar Gmbh & Co. Kg Verfahren und Vorrichtung zur Herstellung einer Randstruktur eines Halbleiterbauelements

Also Published As

Publication number Publication date
JPS62287624A (ja) 1987-12-14

Similar Documents

Publication Publication Date Title
KR910007226B1 (ko) 레지스트패턴현상방법 및 그 방법에 사용되는 현상장치
US6854473B2 (en) Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station
KR100365078B1 (ko) 도포방법및도포장치
US7033465B1 (en) Clamshell apparatus with crystal shielding and in-situ rinse-dry
WO1999046064A1 (en) Selective treatment of the surface of a microelectronic workpiece
KR102775267B1 (ko) 기판 처리 방법 및 기판 처리 장치
JP3111300B2 (ja) 半導体素子のシール式スピンエッチング装置
JPH0439224B2 (enrdf_load_stackoverflow)
JPH0439225B2 (enrdf_load_stackoverflow)
JPH0781197B2 (ja) 半導体基板鍍金装置
US20020144707A1 (en) Method and apparatus for improving resist pattern developing
JPH11111673A (ja) エッチング方法および処理装置
JPH0770507B2 (ja) 半導体ウエハ用洗浄装置
JP2008019495A (ja) 多孔質体の洗浄方法および洗浄装置
US7596886B1 (en) Method and system to separate and recycle divergent chemistries
JP3289469B2 (ja) 基板の洗浄装置と洗浄方法
JP3339375B2 (ja) レジスト剥離装置及びレジスト剥離方法
JPH08255789A (ja) 処理装置及び処理方法
JP4036331B2 (ja) 処理液供給ノズル及び処理液供給装置、並びにノズルの洗浄方法
JP3627651B2 (ja) 半導体ウエハの表面処理方法及びその装置
JP2000124179A (ja) 基板処理方法
JP2005163085A (ja) めっき装置及びめっき方法
JP2809754B2 (ja) 現像装置
JP2619282B2 (ja) レジスト処理装置及びレジスト処理方法
JP3402181B2 (ja) 枚葉式表面加工装置