JPH0437751B2 - - Google Patents
Info
- Publication number
- JPH0437751B2 JPH0437751B2 JP59073307A JP7330784A JPH0437751B2 JP H0437751 B2 JPH0437751 B2 JP H0437751B2 JP 59073307 A JP59073307 A JP 59073307A JP 7330784 A JP7330784 A JP 7330784A JP H0437751 B2 JPH0437751 B2 JP H0437751B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzles
- pair
- adhesive
- chip
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011230 binding agent Substances 0.000 claims description 7
- 239000007767 bonding agent Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000006071 cream Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、チツプ型電子部品（以下チツプ部
品）の実装において、ノズルのピツチが可変であ
る電子部品実装用結合剤の塗布装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a bonding agent coating apparatus for electronic component mounting in which the pitch of a nozzle is variable in the mounting of chip-type electronic components (hereinafter referred to as chip components).
従来例の構成とその問題点
チツプ部品のプリント基板への実装工程を、第
１図に示す。ａは結合剤として接着剤を用いた装
着剤塗布工程で、プリント基板１にアクリル系の
接着剤２を塗布装置３で塗布する。ｂはチツプ部
品４の実装工程でチツプ装着機５で接着剤２の上
にチツプ部品４を装着する。ｃは硬化工程で、紫
外線６及びヒータ７で接着剤２を硬化する。Conventional configuration and its problems Figure 1 shows the process of mounting chip components onto a printed circuit board. In a mounting agent application step using an adhesive as a binding agent, an acrylic adhesive 2 is applied to the printed circuit board 1 using an application device 3. b is a mounting process for the chip component 4, in which the chip component 4 is mounted onto the adhesive 2 by the chip mounting machine 5. c is a curing step in which the adhesive 2 is cured using ultraviolet rays 6 and a heater 7.
第２図ａは接着剤２とチツプ部品４の位置関係
を示すものである。斜線部ははみ出し部８であり
ｃに示すように装着時にチツプ部品４の中心に接
着剤２を一点塗布する場合より回転方向のズレが
小さく、かつ紫外線６が直接接着剤２に当り、硬
化しやすく、ヒータ７による熱硬化の際に、接着
剤２に含まれるガスの膨張による位置ズレを防ぐ
効果があり、かつ接着強度が得やすい。第２図ｂ
はクリーム半田９をパターン１０に塗布し、チツ
プ部品４を装着しリフローするものである。 FIG. 2a shows the positional relationship between the adhesive 2 and the chip part 4. The shaded area is the protruding part 8, and as shown in c, the deviation in the rotational direction is smaller than when applying the adhesive 2 to the center of the chip part 4 at a single point during installation, and the ultraviolet rays 6 directly hit the adhesive 2, causing it to harden. This has the effect of preventing displacement due to expansion of the gas contained in the adhesive 2 during thermal curing by the heater 7, and it is easy to obtain adhesive strength. Figure 2b
In this example, cream solder 9 is applied to a pattern 10, a chip component 4 is attached, and reflow is performed.
第３図は、従来の塗布装置３である。接着剤２
又はクリーム半田９を入れたタンク１１に２本の
ノズル１２が一定ピツチに設けられ、圧縮空気Ｐ
で加圧することにより、ノズル１０の先端にでき
る結合剤のボール１３をＺ方向に動くことにより
プリント基板１に転写する。１４は穴を有した押
え板である。 FIG. 3 shows a conventional coating device 3. As shown in FIG. adhesive 2
Alternatively, two nozzles 12 are provided at a constant pitch in a tank 11 containing cream solder 9, and compressed air P is
By applying pressure, the ball 13 of the binder formed at the tip of the nozzle 10 is transferred to the printed circuit board 1 by moving in the Z direction. 14 is a presser plate with holes.
以上のような構成では、第２図ａ，ｂに示すチ
ツプ部品２の幅Ｗあるいは、長さＬがある寸法以
上に変化すると、はみ出し部８が得られなくなつ
たり、また、パターン１０の上に塗布することが
不可能になる。 In the above configuration, if the width W or length L of the chip component 2 shown in FIGS. becomes impossible to apply.
発明の目的
本発明は、上記従来の欠点を解消するものであ
り、ノズルのピツチを可変にすることにより寸法
の異るチツプ部品に対応するものである。OBJECTS OF THE INVENTION The present invention eliminates the above-mentioned drawbacks of the prior art and accommodates chip parts of different sizes by making the pitch of the nozzle variable.
発明の構成
本発明は、一対のノズルを可動の保持具で保持
すると共に、この一対のノズルと結合剤のタンク
とを、フレキシブルなチユーブで接続することに
より、結合剤の塗布ピツチをチツプ部品の寸法に
合せて変えられるようにし、はみ出し部を得た
り、パターン寸法に合せられるようにし、結合剤
硬化を確実にし、チツプ部品の位置ズレを防ぎ、
接着剤強度を大きくし、信頼性を高めるようにし
た電子部品実装用結合剤の塗布装置である。Structure of the Invention The present invention holds a pair of nozzles with a movable holder, and connects the pair of nozzles and a binder tank with a flexible tube, thereby controlling the application pitch of the binder to the chip parts. It can be changed according to the dimensions, it can obtain overhangs and match the pattern dimensions, it can ensure the hardening of the bonding agent, and it can prevent the chip parts from shifting.
This is a bonding agent coating device for mounting electronic components that increases adhesive strength and reliability.
実施例の説明
以下に本発明の一実施例について第４図に基づ
いて説明する。１５は保持具であり、ノズル１２
を備え、右ネジ、左ネジを切つた駆動軸１６によ
り、対称に動かされる。１７は回り止めのガイド
である。駆動軸１６の回転は、チツプ部品の幅Ｗ
やパターン寸法Ｌに合せるようNC命令で動くモ
ータ１８によりギヤ１９，２０により伝達され
る。ノズル１２′は、フレキシブルなチユーブ２
１により接着剤２のタンク９′に接続され、圧縮
空気Ｐの加圧により接着剤のボール１３がノズル
１２′の先端につくられ、Ｚ方向にタンク９′駆動
軸１６、ガイド１７、モータ１８を一体とするフ
レーム２２を動かすことにより、接着剤のボール
１３をプリント基板１を転写する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below based on FIG. 4. 15 is a holder, and the nozzle 12
It is moved symmetrically by a drive shaft 16 with a right-hand thread and a left-hand thread. 17 is a detent guide. The rotation of the drive shaft 16 is controlled by the width W of the chip part.
It is transmitted through gears 19 and 20 by a motor 18 that moves according to an NC command so as to match the pattern size L. The nozzle 12' has a flexible tube 2
1 is connected to the tank 9' of the adhesive 2, and by pressurizing the compressed air P, an adhesive ball 13 is created at the tip of the nozzle 12'. By moving the frame 22 that integrates the adhesive balls 13 onto the printed circuit board 1.
発明の効果
このように本発明は、結合剤を塗布するノズル
をチツプ部品の寸法に合せて可動することがで
き、アクリル系接着剤を紫外線硬化できるよう、
はみ出し部を得ることやクリーム半田をパターン
寸法に合せて塗布することが可能となつた。これ
により装着時あるいは接着剤の熱硬化の際に生じ
る位置ズレを防止し、かつ強い接着強度が得られ
る。またパターン部に確実にクリーム半田を塗布
できチツプ部品の実装の信頼性を高めることがで
きるという特徴を有している。Effects of the Invention As described above, the present invention enables the nozzle for applying the binder to be moved according to the dimensions of the chip component, and enables the acrylic adhesive to be cured by ultraviolet light.
It became possible to obtain protruding parts and apply cream solder according to the pattern dimensions. This prevents misalignment that occurs during installation or heat curing of the adhesive, and provides strong adhesive strength. It also has the feature of being able to reliably apply cream solder to the pattern portion, thereby increasing the reliability of chip component mounting.
第１図はチツプ部品実装の工程図、第２図ａ，
ｂ，ｃは結合剤とチツプ部品の位置関係図、第３
図は従来の塗布装置の断面図、第４図は本発明の
一実施例における塗布装置の断面図である。
２……接着剤、４……チツプ部品、８……はみ
出し部、１２……ノズル、１６……駆動軸、２１
……チユーブ。
Figure 1 is a process diagram of chip component mounting, Figure 2 a,
b, c are positional relationship diagrams of the binder and chip parts, 3rd
The figure is a cross-sectional view of a conventional coating device, and FIG. 4 is a cross-sectional view of a coating device in an embodiment of the present invention. 2... Adhesive, 4... Chip parts, 8... Protruding portion, 12... Nozzle, 16... Drive shaft, 21
...Tube.
Claims (1)
合剤を塗布する一対のノズルと、前記一対のノズ
ルを保持すると共に、ノズル間のピツチを変更可
能な保持具と、前記一対のノズル間のピツチを変
更するべく、前記一対のノズル間の中心点を固定
したまま、この一対のノズルを結ぶ直線上を各々
近接、離間するよう前記保持具を駆動する手段
と、結合剤のタンクと前記一対のノズルとを接続
する一対のフレキシブルなチユーブとを備えた電
子部品実装用結合剤の塗布装置。1 A pair of nozzles for applying a bonding agent for mounting electronic components on a printed circuit board, a holder that holds the pair of nozzles and can change the pitch between the nozzles, and a holder that can change the pitch between the pair of nozzles. means for driving the holder to approach and separate the pair of nozzles, respectively, on a straight line connecting the pair of nozzles while keeping the center point between the pair of nozzles fixed, and a binder tank and the pair of nozzles. An apparatus for applying a bonding agent for mounting electronic components, which is equipped with a pair of flexible tubes that connect the tubes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59073307A JPS60216863A (en) | 1984-04-12 | 1984-04-12 | Coating apparatus of binder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59073307A JPS60216863A (en) | 1984-04-12 | 1984-04-12 | Coating apparatus of binder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60216863A JPS60216863A (en) | 1985-10-30 |
| JPH0437751B2 true JPH0437751B2 (en) | 1992-06-22 |
Family
ID=13514373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59073307A Granted JPS60216863A (en) | 1984-04-12 | 1984-04-12 | Coating apparatus of binder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60216863A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5924172B2 (en) * | 1977-02-09 | 1984-06-07 | 株式会社東芝 | heat resistant bimetal |
| JPS59120269A (en) * | 1982-12-28 | 1984-07-11 | Kinugawa Rubber Ind Co Ltd | Coater for long size body |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5924172U (en) * | 1982-08-06 | 1984-02-15 | 関東自動車工業株式会社 | Adhesive automatic applicator |
-
1984
- 1984-04-12 JP JP59073307A patent/JPS60216863A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5924172B2 (en) * | 1977-02-09 | 1984-06-07 | 株式会社東芝 | heat resistant bimetal |
| JPS59120269A (en) * | 1982-12-28 | 1984-07-11 | Kinugawa Rubber Ind Co Ltd | Coater for long size body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60216863A (en) | 1985-10-30 |
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