JPS603200A - Automatic part assembling machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an automatic assembly machine for components such as chip-shaped components.

Conventional configuration and its problems Conventionally, adhesive applicators for automatic assembly machines for chip-shaped parts were
As shown in FIG. 1, it consists of a dispenser head 1, a cartridge tank 2, and a coating nozzle 3. First, a predetermined point on the electronic circuit board 5 is positioned using the X-Y table 4 in order to hold and temporarily fix the chip-shaped component on the electronic circuit board 5, and the cartridge tank 2 is lowered and adhesive is applied. Next, chip-shaped parts are mounted, the adhesive is cured in a curing oven, etc., and soldering is then performed. However, this adhesive has a certain degree of viscosity because it is necessary to hold the chip-like component temporarily in place after it hardens after mounting the chip-like component. Therefore, as shown in FIG. 2, when applying the adhesive 6 to the electronic circuit board 5, as the cartridge tank 2 rises, the nozzle 3 and the applied adhesive 6
Stringing of the adhesive occurs between the At this time, glue 6
is applied to the copper foil 7 and the resist 80 surface of the copper foil 7 in a direction perpendicular to the mounting direction of the chip-like component, but by pulling a thread as described above, the adhesive X portion is applied to the substrate 5 by the X-Y table 4. Because it falls freely in any direction due to the movement of the copper foil or the wind from an air conditioner, it may fall onto the copper foil 7 as shown in the plan view of FIG. Unfortunately, the adhesive 6a will waver to some extent until the next process of mounting the chip-shaped part 9. When the chip-shaped part 11 is mounted as shown in FIG.
The solder protrudes from the electrode part 12 during the soldering process after curing, and the solder does not stick to the electrode part 12, resulting in defective soldering and quality problems. It had various drawbacks in terms of workability and cost.

OBJECTS OF THE INVENTION The present invention has been made to eliminate the drawbacks of the above-mentioned conventional examples, and provides an automatic component assembly machine that can produce highly reliable electronic circuit boards.

Composition of the Invention The present invention installs air noise to the adhesive applicator of an automatic parts assembly machine, and blows air onto the adhesive applied to the electronic circuit board to improve the adhesive thread breakage and to reduce the amount of adhesive. This corrects the thread by forcing it to fall in a certain direction.

DESCRIPTION OF THE EMBODIMENT FIG. 5 is a perspective view showing an embodiment of the present invention. 13
is an air nozzle, which can be synchronized with the adhesive application direction of the cartridge tank 2 by means of a mounting stand 15. Warm air flows diagonally downward from the air nozzle 13 toward the tip of the nozzle 3 through an air filter, a pressure reducing valve, a solenoid valve, and a heater (not shown) to the air pipe 14. . Air is blown onto the adhesive immediately after it has been applied.

When the adhesive 6 is applied to a predetermined location on the electronic circuit board 6, strings of the adhesive 6 occur, which do not allow the cartridge tank 2 to rise. At this time, an air electromagnetic valve is opened in response to a coating end signal, and warm air flows diagonally downward through the nozzle 13 to facilitate thread breakage of the adhesive 6 and force the thread to fall in a certain direction. Since the air flows diagonally downward, the adhesive will not scatter. As shown in Figure 6 a and b, the adhesive application direction is perpendicular to the chip component mounting direction, and the air is also coaxial with the application direction, so it will not get on the copper foil 7. . In FIGS. 6a and 6b, arrows indicate the direction of air outflow.

As described in detail, according to the present invention, components can be mounted by using an air jet nozzle directed in a direction different from that of the present invention to suppress stringing of the adhesive. It can be pushed out of the copper foil, which eliminates adhesive protrusion when mounting chip-shaped components and eliminates soldering defects.
This improves the reliability of the electronic circuit board, eliminates the visual inspection process after the adhesive has hardened and after soldering, and has great effects in terms of workability and cost.

[Brief explanation of the drawing]

Figure 1 is a perspective view of a conventional adhesive applicator, Figure 2 is a sectional view immediately after applying the same adhesive, Figure 3 is a plan view after applying the same adhesive, and Figure 4 is a chip-like component mounted. Later plan, 5th
The figure is a perspective view showing the configuration of an automatic parts assembly machine according to an embodiment of the present invention, and FIGS. 6a and 6b are plan views after adhesive application according to the same embodiment. 3... Nozzle (for gluing adhesive), 4...
X-Y table, 5... Board, 6, 6a...
...Adhesive, 7...Copper foil, 13...
Nozzle (for air jetting), 14...Air piping.

Claims (1)

[Claims] It has an adhesive application means for applying an adhesive to the circuit board for attaching components, and a nozzle for ejecting air directed toward the tip of the nozzle for ejecting the adhesive provided in the adhesive application means. . The automatic parts assembly machine, wherein the air jet nozzle is oriented in a direction different from the direction in which the parts are attached.