JPH09232744A - Printed circuit board manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method superior in mass productivity by improving the soldering work efficiency. SOLUTION: Electronic elements 1 housed in a housing 9 are coated with a resin material 10 having an ultraviolet hardening-thermosetting combined solder resist property and the resin material is hardened. The material 10 deposited on at least land-connecting faces of the terminals 3 of each element 10 is cleaned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technical field of a printed wiring board in which a large number of electronic components are mounted on a wiring circuit pattern of a printed circuit board, and particularly to mass productivity by improving efficiency of soldering work. The present invention relates to a method for manufacturing an excellent printed wiring board.

[0002]

2. Description of the Related Art In printed wiring boards, a large number of electronic components such as insertion components (discrete components) and flat package IC chips are mounted on the wiring circuit pattern.

These electronic components are mounted by soldering their terminals to the portions to be connected on the wiring circuit pattern. When only an electronic component such as a flat package IC chip is mounted as an electronic component, the terminal of the electronic component is brought into contact with a portion to be connected with a terminal of the electronic component in a wiring circuit pattern of a printed circuit board, a so-called land portion. Then, the electronic component is positioned with respect to the printed circuit board, solder such as cream solder is supplied to the connecting portion between the land portion and the terminal, and heating is performed by hot air or the like to perform soldering. Such a method is called reflow soldering.

When both an insert component and a flat package IC chip are mounted as electronic components, a through hole penetrating the printed board is provided in a land portion for connecting with the insert component in the wiring circuit pattern. The printed circuit board is formed by inserting the terminals of the insertion part into the through holes from the rear surface side of the wiring circuit pattern forming surface and contacting the terminals of the IC chip with the lands for connecting to the flat package IC chip on the wiring circuit pattern. The chip is positioned with respect to the printed circuit board, and molten solder is supplied to the side of the printed circuit board on which the wiring circuit pattern is formed to perform soldering between the terminals of the insertion component and the land portion and between the terminals of the IC chip and the land portion.

Such a technique is called flow soldering, and the molten solder is supplied by jetting the molten solder 101 in a direction as shown by an arrow P in the figure as schematically shown in FIG. The printed circuit board 10 on which each electronic component is mounted on the nozzle 102 (however, only the flat package IC chip 103 is shown in FIG. 13).
4 is moved and passed as indicated by an arrow M in the figure, and is temporarily immersed in the molten solder.

At this time, naturally, the printed board 104 is arranged so that the mounting surface of the flat package IC chip 103 faces the nozzle 102, but the flat package IC chip 103 is arranged so that the flat package IC chip 103 does not drop. 103 and printed circuit board 10
4 is temporarily fixed by an adhesive 105.

In such a printed circuit board, there is a demand for miniaturization, and accordingly, miniaturization of each electronic component is required. And, for example, it is a kind of flat package IC chip, and a quad flat package (QuadFl) in which a plurality of terminals are formed adjacent to each other on the four side surfaces of a flat rectangular electronic component.
at Package; hereinafter referred to as QFP. ) Or a flat rectangular electronic component having a plurality of terminals adjacent to each other on a pair of opposite side surfaces (Small Outline Pain).
CK), the pitch between a plurality of terminals has been narrowed to 1.27 mm or less.

However, when such an electronic component is soldered and mounted on a printed circuit board by the above-mentioned flow soldering, since the pitch between terminals is narrow, it is attached to a portion other than the connection portion with the land portion of the terminal. Due to soldering, at least two adjacent terminals are short-circuited, and solder short-circuit defects tend to occur frequently.

That is, as shown in FIG. 13, the terminals 106 of the flat package IC chip 103 are solder-plated, tin-plated, palladium-plated, or gold-plated over the entire surface in order to improve solderability. Plating processing such as plating is performed. The terminal 106 is
This gull wing shape, that is, the stepped shape having one step is used, and the base end side portion 106a forming the first step is used as an electrical lead line from the flat package IC chip 103 and a support portion. It is made to function, and the tip side portion 106b forming the second stage is made to function as a connection portion with the land portion 107 on the wiring circuit pattern. The flat package IC chip 103 is supported with a predetermined distance from the printed board 104.

And such a flat package I
When the molten solder 101 is supplied to the printed circuit board 104 on which the C chip 103 is mounted as described above, the molten solder 101 becomes the tip side which becomes the connection part between the land portion 107 on the wiring circuit pattern of the printed circuit board 104 and the terminal 106. Flat package IC not only between the part 106b
It also accumulates in the base end side portion 106a that serves as a support portion of the chip 103. When the molten solder 101 accumulates on the base end side portion 106a in this way, the molten solder 101 connects between the terminal 106 and a terminal (not shown) adjacent to the terminal 106, and the solder short-circuit failure as described above occurs. Occur.

Therefore, in order to avoid such a solder short-circuit defect, a printed wiring for soldering the terminals of an electronic component having a plurality of terminals formed adjacent to each other to a land portion of a wiring circuit pattern of a printed circuit board. In the method for manufacturing a board, a layer of a resin material having a solder resist property is formed by coating on the back surface side of the wiring circuit pattern facing surface other than at least the tip side of the terminal of the electronic component, and then the terminal is printed board. The electronic components are positioned on the printed circuit board by making contact with each of the land parts of the wiring circuit pattern of and the molten solder is supplied between the terminals and the land parts to solder the terminals to the land parts. A method for producing a characteristic printed wiring board is provided (Japanese Patent Application No. 7-333406).

According to this method of manufacturing a printed wiring board,
A layer of a resin material having a solder resist property is formed on the back surface side of the facing surface of the wiring circuit pattern other than the tip side for electrically connecting at least the wiring circuit pattern of the plurality of adjacently formed terminals. The terminals of this electronic component are respectively brought into contact with a plurality of lands of the printed circuit board wiring circuit pattern to position the electronic component with respect to the printed circuit board, and molten solder is supplied between the terminals and the lands. When soldering the terminal to the land, solder is prevented from adhering to the back side of the wiring circuit pattern facing surface other than the tip side that becomes the terminal connection part, and the terminal pitch is narrowed. Also, the occurrence of solder short defects can be suppressed.

[0013]

By the way, in the method of manufacturing a printed wiring board, when a layer of a resin material having a solder resist property is formed on an electronic component by coating, it is manually performed one by one.

That is, in the conventional method for manufacturing a printed wiring board, an ultraviolet curable solder resist ink is used as a resin material having a solder resist property. Then, for example, as shown in FIG. 14, with respect to the coating formation surface of each of the flat package IC chips 103,
The solder resist ink 111 is applied by the brush 109 in the direction of the arrow in the figure to form the resin material layer 108 as a coating.

Further, as shown in FIG.
03 corresponding to the gull wing-shaped terminal 106 of 03
0 is used to move the mold 110 in the direction of the arrow in the figure to apply the solder resist ink 111, that is, a so-called stamp method to form a resin material layer 108.

Further, as shown in FIG. 16, the squeegee 1
12 is moved vertically with respect to the paper surface, and the screen 113
From the opening 114 of the solder resist ink 111
In some cases, a so-called curved surface printing method, in which is applied, is applied.

However, in the method of coating and forming the layer 108 of the resin material having the solder resist property, it is necessary to perform the flat package IC chips 103 one by one, so that it takes time and costs, and the production efficiency is improved. I had the problem of not being able to do it.

Further, in such a manual coating process, it is difficult to accurately separate the portion where the resin material layer 108 is coated and the portion where the resin material layer 108 is not coated, and therefore soldering to terminals having a narrow pitch is required. The work becomes extremely difficult.

Therefore, according to the conventional method, the solder resist ink 111 cannot be accurately applied to the terminal surface connected to the land portion, and the adhesion of the resin material having good solder resist property is achieved. However, the quality of the finished product may vary.

Therefore, it is an object of the present invention to provide a method of manufacturing a printed wiring board which is excellent in mass productivity by improving the efficiency of soldering work.

[0021]

In order to solve the above-mentioned problems, a method for manufacturing a printed wiring board according to the present invention provides a method in which a plurality of electronic components are exposed to ultraviolet light in a state where these electronic components are stored in a storage member. A step of applying a resin material having a solder resist property of both curing and heat curing type, a step of curing the resin material, and a step of cleaning the resin material attached to at least the surface of the terminal of the electronic component connected to the land portion. And a step of forming a layer of a resin material having a solder resist property on the back surface side of the wiring circuit pattern facing surface of at least a portion other than the tip side of the terminal of the electronic component.

Therefore, in the method of manufacturing a printed wiring board, the terminals of an electronic component having a plurality of terminals formed adjacent to each other are soldered to the lands of the wiring circuit pattern of the printed board. For example, the resin material is applied to a plurality of electronic components at once.

Here, the step of applying the resin material is as follows.
This resin material can be sprayed and sprayed, the housing member can be immersed in a dipping container filled with the resin material, and the housing member can be moved in a substantially horizontal direction in the moving direction. On the other hand, it is preferable to flow the resin material from above.

Then, next, the terminals are brought into contact with a plurality of lands of the printed circuit pattern of the printed circuit board to position the electronic parts with respect to the printed circuit board, and molten solder is supplied between the terminals and the lands. Rather than soldering the terminals to the lands, the resin material having solder resisting properties can be adhered, and good solder heat resistance can be obtained.

Then, it is preferable to dispose a mask covering a predetermined portion on the back surface side of the wiring circuit pattern facing surface of the electronic component to cure the resin material.

By irradiating ultraviolet rays with such a mask arranged, it is possible to accurately separate a plurality of electronic parts from a portion where the resin material is coated and a portion where the resin material is not coated.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described in detail below with reference to the drawings.

First, the electronic parts to be soldered are shown in FIG.
As shown in FIG. 1, for example, it is a flat package IC chip, and a plurality of terminals (FIG.
Only one terminal 3 is shown inside. ) Are formed adjacent to each other, which is an example of so-called QFP. The pitch between multiple terminals of this QFP is 1.0 mm
Is about 0.65 mm.

The terminal 3 has a step-like so-called gull wing shape having one step, and one base end side portion 3a forming the first step is an electrical lead wire from the chip portion 2. And functions as a support part to form a second stage,
The other tip side portion 3b functions as a connecting portion to the land portion 6. It should be noted that due to this step, the chip portion 2 is supported with a predetermined distance from the printed circuit board 5.

Next, Examples 1 to 3 of a method of mounting the electronic component 1 on a printed circuit board will be described. Here, an example of mounting the electronic component 1 together with an insertion component and using flow soldering will be described.

Embodiment 1 Usually, an electronic component 1 which is a flat package IC chip
Are stored in a pallet having an outer size of 170 mm × 330 mm. Therefore, in the present embodiment, as shown in FIG. 2, the electronic components 1 stored in this pallet are transferred to a carrying jig 9 which is a storage member having a larger outer size than this pallet.

The carrying jig 9 is provided with a fixing member 9a to which the chip portion 2 of each electronic component 1 is fixed and a partitioning member 9b for partitioning each electronic component 1 from the electronic component 1. Then, the wiring member pattern side of the chip portion 2 of each electronic component 1 is fixed by the fixing member 9a.

A spray 11 movable in the direction of the arrow in FIG. 2 is arranged above the carrying jig 9. The spray 11 is filled with a resin material having a solder resist property of both ultraviolet curing and thermal curing.

Therefore, the electronic component 1 is mounted on the printed circuit board 5
For mounting, the resin material can be sprayed and applied to the plurality of electronic components 1 housed in the transfer jig 9 while the spray 11 moves. For this reason, it is possible to apply the resin material having the above-described solder resist property of both ultraviolet curing and thermal curing to a plurality of electronic components 1 at a time.

Here, as a resin material having both a UV-curing and a heat-curing type solder resist property, it has an insulating property of 10 ⁸ Ω or more even in a humid environment (eg, 60 ° C., 90% (RH)). It has high electrical insulation properties, high adhesion to the plating material on the surface of the terminal 3, and heat resistance capable of withstanding flow soldering at 260 ° C. for 10 seconds. It is preferable to satisfy the conditions that the terminal 3 can be processed in a short time and the cost is low.

Examples of such a material include a UV-curable and heat-curable solder resist ink.

That is, as the UV-curable and heat-curable combined solder resist ink 10, an epoxy resin-based alkaline developing type photosensitive solder resist is suitable. Specifically, P manufactured by Taiyo Ink Manufacturing Co., Ltd.
It is preferable that SR-400 Z902 (trade name) and CA-40 Z902 (trade name), which is a curing agent manufactured by the same company, are mixed at a weight ratio of 7: 3. In addition, you may use what is often used for manufacture of the printed wiring board which has a solder through hole.

In the solder resist ink 10 as described above, the adhesion of the terminal 3 to the plating material such as solder at the time of soldering is particularly ensured. Further, when such an ultraviolet curable solder resist ink 10 is used, the electronic component 1 to which the present invention is applied is sufficient not only for flow soldering but also for reflow soldering using a heating furnace combined with ultraviolet heat curing. It is possible.

Next, after the resin material is applied, preliminary heating and curing is performed by hot air or the like. This preheat curing is
This is performed in order to improve the adhesion between the material forming the resin material layer 4 and the terminals 3 of the electronic component 1. In the present embodiment, hot air at 60 ° C. to 100 ° C.
Sprayed for minutes to 30 minutes.

Next, as shown in FIG. 3, exposure is performed by irradiating ultraviolet rays. This exposure is an exposure amount of 350 to 600 m
Ultraviolet rays are irradiated in parallel from above the flat package IC chip at J / cm ² . It is necessary to prevent the irradiation of the ultraviolet rays from the rear surface side of the wiring circuit pattern forming surface so that the front end side portion 3b connected to the land portion 6 is not irradiated. Further, it is necessary not to arrange an object that reflects ultraviolet rays on the back surface of the wiring circuit pattern forming surface.

Next, as shown in FIG. 4, the developing solution 13 is used for cleaning. Here, the resin material attached to the tip side portion 3b connected to the land portion 6 is washed. As a result, the surface of the electronic component 1 which is not exposed by the irradiation of ultraviolet rays is exposed.

In the cleaning of the present embodiment, the developer 13 is an alkaline solution prepared by dissolving a base such as 1% Na ₂ CO ₃ at a liquid temperature of 30 ° C. and a developing time of 60 seconds to 90 seconds. And then washed with water for 45 to 60 seconds.

After that, the alkaline solution is washed with water. In this cleaning step, when using a water-soluble solder resist, only cleaning with water is possible. In addition, it goes without saying that in this cleaning, a portion other than the front end side portion 3b connected to the land portion 6 may be washed.

Next, as shown in FIG. 5, the main heat curing is performed. This main heat curing is performed by the solder resist ink 1 described above.
This is done to improve the adhesiveness of the coating of 0.

Here, hot air at 130 ° C. to 150 ° C. was blown for 30 minutes to cure. By such main heat curing, the thickness H of the resist coating film is 5 μm to 50 μm.
formed to m.

Next, on a plurality of lands (on the land 6 in FIG. 1) on the wiring circuit pattern of the printed circuit board 5.
Show only. ) Is contacted with a plurality of terminals (only the terminals 3 are shown in FIG. 1) of the electronic component 1, and the electronic component 1 is mounted on the printed circuit board 5.

Then, as shown in FIG. 13 above, the nozzle of the flow soldering apparatus for ejecting the molten solder is
The molten solder is supplied between the tip side portion 3b of the terminal 3 and the land portion 6 by flow soldering in which the printed circuit board 5 having the electronic component 1 mounted thereon is temporarily immersed in the molten solder. Solder with solder 7 as shown in FIG. At this time, it is preferable to temporarily fix the space between the printed board 5 and the chip portion 2 of the electronic component 1 with an adhesive or the like.

In the method of manufacturing a printed wiring board according to the present embodiment, the solder resist ink 10 for ultraviolet curing and thermosetting is applied by the spray 11 to apply a plurality of electronic components 1 at a time. A layer 4 of a resin material having a solder resist property can be formed by coating. Therefore, the efficiency of the soldering work can be improved.

Here, after performing the above-mentioned pre-heat curing,
As shown in FIG. 6, it is preferable to dispose a negative film 15 as a mask so as not to form the layer 4 of the resin material on the tip side portion 3b of the terminal 3 and expose it by ultraviolet irradiation. Although the mask is arranged on one electronic component 1 in FIG. 6, the mask may be widely arranged on the plurality of electronic components 1 housed in the carrying jig 9.

When the above-mentioned ultraviolet rays are radiated through the negative film 15 for cleaning in this manner, as shown in FIG. 7, the resin material layer 4 is formed on the tip side portion 3b of the terminal 3.
Will not be formed.

Therefore, according to the present embodiment, workability can be improved and accurate soldering can be performed as compared with the conventional method.

That is, (b) in FIG. 8 is a schematic view in the case of applying by a conventional method, but since the layer of the resin material is formed to cover the tip side portion 106 b of the terminal 106. , It is difficult to confirm whether or not soldering has been done.

On the other hand, according to the present embodiment, as shown in (a) of FIG. 8, since the layer 4 of the resin material does not cover the tip side portion 3b of the terminal 3, the solder is not formed. 7 is formed large so as to cover the tip side portion 3b. Therefore, the soldered state can be visually confirmed, and the soldering work can be improved.

As described above, in the present embodiment, the layer 4 of the resin material is formed on the portion other than the tip side portion 3b of the terminal 3.
As a coating is formed, when molten solder is supplied,
The molten solder does not adhere to the portion other than the tip side portion 3b of the terminal 3.

In the electronic component 1 of the printed wiring board manufactured as described above, solder short-circuiting is unlikely to occur during flow soldering for mounting on the printed board 5.

If the resin material layer 4 is made of a material having high electrical insulation, the terminal 3 of the flux applied to the entire surface of the printed circuit board before the flow soldering is performed.
It is possible to avoid ion migration caused by the flux remaining in the interim in a high temperature and high humidity environment, insulation failure caused in a dew condensation environment, and the like.

Further, according to the method for manufacturing a printed wiring board of the present invention, it is not necessary to arrange the electronic parts so that their side edges are oblique to the longitudinal direction of the printed circuit board, and the outer shape is rectangular. It is possible to arrange electronic components efficiently. Further, it is possible to perform high-density mounting on electronic components having terminals with a narrow pitch.

Further, after performing the above-mentioned preliminary heat curing,
As shown in FIG. 9, it is preferable to dispose a negative film 25 as a mask so that the layer 4 of the resin material having a solder resist property is not formed on the surface 2a of the chip portion 2 and to expose by exposure to ultraviolet rays. In FIG. 9, the mask is arranged on one electronic component 1, but the mask may be widely arranged on the plurality of electronic components 1 housed in the transfer jig 9.

By disposing such a negative film 25 and irradiating it with ultraviolet rays for cleaning, as shown in FIG. 10, not only on the tip side portion 3b of the terminal 3 but also on the surface 2b of the chip portion 2 as described above. The layer 4 of the resin material is not formed. Therefore, the smoothness of the surface 2b of the tip portion 2 can be ensured.

Therefore, when the electronic component 1 is mounted on the printed circuit board 5, an automatic mounting machine having a suction head for sucking the surface 2b of the chip portion 2 is used.
By this automatic mounting machine, the suction force of the suction head for sucking the surface 2b of the chip portion 2 is improved.

Embodiment 2 Next, as another example to which the present invention is applied, the following one can be cited. That is, for example, as shown in FIG. 11, an immersion container 17 in which the above-mentioned transport jig 9 is directly stored is prepared. The immersion container 17 is filled with the solder resist ink 10.

In this embodiment, the transfer jig 9 in which a plurality of electronic components 1 are stored can be immersed in the transfer jig 9 as a storage member by moving in the direction of the arrow in the figure. Further, it can be pulled out from the immersion container 17 to the outside.

Therefore, the resin material having the solder resist property is applied to a plurality of electronic components 1 at a time by immersing the transport jig 9 in the immersion container 17 filled with the solder resist ink 10.

The subsequent steps such as preliminary heating and curing are
This is similar to the case of the first embodiment.

Third Embodiment Still another example to which the present invention is applied includes the following. That is, for example, as shown in FIG. 12, the transfer jig 9 is moved in a substantially horizontal direction, and the solder resist ink 10 is flowed down from above in the moving direction.

In this embodiment, the UV-curable and heat-curable solder resist ink 10 is made to flow down from above (in the direction of the arrow in the figure) and flow like a curtain 18, so to speak.

Therefore, by passing the solder resist ink 10 like the curtain 18 through the transfer jig 9 (this is called "curtain coat").
It is sometimes said. ), The solder resist ink 10 can be applied from the vertical direction in order from the electronic component 1 on the right side of the drawing, and the solder resist ink 10 can be efficiently applied to a plurality of electronic components 1.

The subsequent steps such as preliminary heating and curing are
This is similar to the case of Example 1.

[0069]

According to the method of manufacturing a printed wiring board of the present invention, a plurality of electronic components have a UV-curable and heat-curable combined solder resist property in a state where these electronic components are accommodated in the accommodating member. By applying the resin material, it becomes possible to apply the resin material to a plurality of electronic components at one time. Therefore, according to the present invention, it is possible to provide a method for manufacturing a printed wiring board, which has improved production efficiency and is excellent in mass productivity, as compared with the conventional manual work.

After curing, a mask is arranged to cover a predetermined portion on the back surface side of the wiring circuit pattern facing surface of the electronic component, and the resin material is coated on a plurality of electronic components at one time by irradiating ultraviolet rays. The part to be formed and the part not to be coated can be accurately separated. Therefore, according to the present invention, accurate soldering is possible even for electronic components having terminals with a narrow pitch.

[Brief description of drawings]

FIG. 1 is a sectional view schematically showing a state in which an electronic component is soldered to a printed circuit board.

FIG. 2 shows an example of a method for manufacturing a printed wiring board to which the present invention is applied, and is a cross-sectional view schematically showing a state in which a resin material having a solder resist property is sprayed and applied.

FIG. 3 is a cross-sectional view schematically showing a step of heating and curing a resin material having a solder resist property by irradiation of ultraviolet rays in the above example.

FIG. 4 is a cross-sectional view schematically showing a step of cleaning a resin material having a solder resist property in the above example.

FIG. 5 is a cross-sectional view schematically showing the step of main heating and curing in the above example.

FIG. 6 is a cross-sectional view schematically showing a state in which a mask is arranged and ultraviolet rays are irradiated in the above example.

FIG. 7 is a cross-sectional view schematically showing a state in which the mask is arranged and a layer of the resin material is formed by coating.

8A and 8B are diagrams schematically showing the influence of the resin material layer on soldering, wherein FIG. 8A is obtained by the application of the above example, and FIG. 8B is obtained by the conventional application.

FIG. 9 is a cross-sectional view schematically showing a state in which a mask different from the above-mentioned mask is arranged and ultraviolet rays are irradiated.

FIG. 10 is a cross-sectional view schematically showing a state in which the mask is arranged and a layer of the resin material is formed by coating.

FIG. 11 shows another example of the method for manufacturing a printed wiring board to which the present invention is applied, and is a cross-sectional view schematically showing a state of dipping and applying in a dipping container filled with the resin material. .

FIG. 12 shows still another example of a method for manufacturing a printed wiring board to which the present invention is applied, and schematically shows a state in which the resin material is applied by flowing down from above in the moving direction of the storage member. FIG.

FIG. 13 is an enlarged cross-sectional view of a main part schematically showing an example of a method of flow soldering.

FIG. 14 is an enlarged sectional view of an essential part schematically showing an example of applying a conventional resin material having a solder resist property.

FIG. 15 is an enlarged cross-sectional view of a main part schematically showing another example of applying a conventional resin material having a solder resist property.

FIG. 16 is an enlarged cross-sectional view of a main part schematically showing still another example of applying a conventional resin material having a solder resist property.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 electronic component, 2 chip parts, 3 terminals, 3a base end side part, 3b front end side part, 4 resin material layer, 5 printed circuit board, 6 land part, 9 storage member, 11 spray, 15 mask (negative film), 17 Immersion container

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kiyoshi Satoshi 19-5 Udagawa-cho, Shibuya-ku, Tokyo Tokyo Process Service Co., Ltd.

Claims (5)

[Claims] 1. A method of manufacturing a printed wiring board, comprising: soldering the terminals of an electronic component having a plurality of terminals formed adjacent to each other to a land portion of a wiring circuit pattern of a printed circuit board. On the other hand, in the state where these electronic components are stored in the storage member, a step of applying a resin material having a solder resist property of both ultraviolet curing and thermal curing type, a step of curing the resin material, and a terminal of the electronic component A step of cleaning the resin material attached to at least the surface connected to the land portion, and having a solder resist property on the back surface side of the wiring circuit pattern facing surface of at least a portion other than the tip side of the terminal of the electronic component. A layer of a resin material is formed by coating, and then the terminals are brought into contact with a plurality of lands of a printed circuit pattern of the printed circuit board to be opposed to the printed circuit board. Method for manufacturing a printed wiring board, characterized in that soldering positioning the electronic component, the terminal supplies the molten solder between the terminal and the land portion the land portion Te. 2. The method of manufacturing a printed wiring board according to claim 1, wherein the step of applying the resin material is performed by spraying the resin material. 3. The method for producing a printed wiring board according to claim 1, wherein the step of applying the resin material is performed by immersing the housing member together with the storage member in an immersion container filled with the resin material. 4. The step of applying the resin material is performed by moving the housing member in a substantially horizontal direction and allowing the resin material to flow down from above in the moving direction. For manufacturing printed wiring boards. 5. The method for manufacturing a printed wiring board according to claim 1, wherein a mask covering a predetermined portion on the back surface side of the wiring circuit pattern facing surface of the electronic component is arranged to cure the resin material.