JPS59219983A - Method of cleaning coated part of adhesive coating device for chip part - Google Patents
Method of cleaning coated part of adhesive coating device for chip partInfo
- Publication number
- JPS59219983A JPS59219983A JP9453483A JP9453483A JPS59219983A JP S59219983 A JPS59219983 A JP S59219983A JP 9453483 A JP9453483 A JP 9453483A JP 9453483 A JP9453483 A JP 9453483A JP S59219983 A JPS59219983 A JP S59219983A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- circuit board
- printed circuit
- nozzle
- chip components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明はチップ部品即ちチップ状の抵抗、コンデンサ等
のリードレスの電子部品をプリント基板に装着する際に
、仮固定用の接着剤を予め塗布する場合、該接着剤の塗
布に先立ち塗布部としてのノズルを高圧エアにてクリー
ニングするチップ部品用の接着剤塗布装置の塗布部クリ
ーニング方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention is a method for temporarily fixing adhesives when mounting chip components, that is, leadless electronic components such as chip-shaped resistors and capacitors, on a printed circuit board. The present invention relates to a method for cleaning an application section of an adhesive application device for chip components, in which a nozzle serving as an application section is cleaned with high-pressure air prior to application of the adhesive when the adhesive is applied in advance.
（ロ）従来例
一般にチップ部品をプリント基板に取付けるチンプマウ
ント装置と呼ばれる自動装着装置において、前記チップ
部品をプリント基板に仮固定するために接着剤をチップ
部品の取付測知塗布する主な方式として、ビン転写、ス
クリーン印刷又はディスペンサ方式のいずれがが採用さ
れている。(b) Conventional example In an automatic mounting device called a chimp mount device that generally mounts chip components to a printed circuit board, the main method is to apply adhesive to the chip component in order to temporarily fix the chip component to the printed circuit board. , bottle transfer, screen printing or dispenser methods are employed.
この中で特にディスペンサ方式においては、塗布部とし
て設けられたノズルから接着剤を吐出させて、プリント
基板に塗布する際に、該ノズル周辺が接着剤のはみ出し
により汚れてしまう。現在前述の様にノズル周辺が汚れ
てくると、作業者が前記ノズルを接着剤塗布装置から取
外して掃除（クリーニング）するか、あるいは取付けた
ままで、布などで掃除する必要があり、作業の手間を要
していた。Among these, especially in the dispenser method, when adhesive is discharged from a nozzle provided as an applicator and applied to a printed circuit board, the area around the nozzle becomes dirty due to adhesive extrusion. Currently, as mentioned above, when the area around the nozzle becomes dirty, the operator must either remove the nozzle from the adhesive applicator and clean it, or leave it attached and clean it with a cloth, which is a time-consuming process. It required
←Ｊ 発明の目的
本発明は前記欠点を除去した作業者による接着剤塗布装
置のノズルのクリーニングを不要にし、同塗布装置の連
続運転を可能にすることを目的とする。←J Object of the Invention The object of the present invention is to eliminate the above-mentioned drawbacks, eliminate the need for an operator to clean the nozzle of an adhesive coating device, and enable continuous operation of the coating device.
に）発明の構成
本発明は、プリント基板にチップ部品を仮固定する接着
剤塗布装置ａにおいて、接着剤を供給するディスペンサ
の塗布部を高圧エアーにてクリーニングするチップ部品
用の接着剤塗布装置の塗布部クリーニング方法を提案す
るものである。B) Structure of the Invention The present invention provides an adhesive applicator for chip components that cleans the application section of a dispenser that supplies adhesive with high-pressure air in an adhesive applicator a for temporarily fixing chip components to a printed circuit board. This paper proposes a method for cleaning the application section.
（ホ）実施例
図面はいずれもディスペンサ方式のチップ部品の仮固定
用接着剤の塗布に係り、第１図はチップ部品用の接着剤
塗布装置の斜視図、第２図は第１図におけるヘッド部分
の要部拡大側面図、第３図は第２図に示したディスペン
サ部分の要部拡大正面図、第４図はプリント基板にチッ
プ部品を接着剤にて仮固定した状態の斜視図、第５図は
プリント基板に所定個所にクリーム半田を塗布後接着剤
にてチップ部品を仮固定した状態の斜視図、第６図及び
第７図は本発明の塗布部クリーニング方法を用いた実施
例を示す接着剤塗布装置の側面図である。(e) All of the drawings relate to the application of adhesive for temporary fixing of chip components using a dispenser method, and FIG. 1 is a perspective view of an adhesive applicator for chip components, and FIG. 3 is an enlarged front view of the main parts of the dispenser shown in FIG. 2, FIG. 4 is a perspective view of the chip components temporarily fixed to the printed circuit board with adhesive, and FIG. Figure 5 is a perspective view of a printed circuit board in which cream solder is applied to predetermined locations and chip components are temporarily fixed with adhesive, and Figures 6 and 7 show examples using the applied part cleaning method of the present invention. It is a side view of the adhesive application device shown.
次に第１図について説明すると、プリント基板（１）は
コンベア（２）により、矢印入方向に送られ、ＸＹテー
ブル（３）上で図示の状態に固定される。Next, referring to FIG. 1, a printed circuit board (1) is conveyed by a conveyor (2) in the direction indicated by the arrow, and is fixed on an XY table (3) in the state shown in the figure.
一方接着剤はタンク（４）に貯蔵されており、塗布部と
してのヘッド（可の下限位置において、前記プリント基
板に前記接着剤を塗布する。On the other hand, the adhesive is stored in a tank (4), and the adhesive is applied to the printed circuit board at the lower limit position of the head (as an applicator).
そこで所定位置に接着剤の塗布されたプリント基板（１
）は、コンベア（２）に移され、矢印入方向に搬送され
て、次の工程即チ７プ部品の装着工程に送られる。図中
（６）はフレーム、（７）はガイドレールを示す。Then, the printed circuit board (1
) is transferred to the conveyor (2), conveyed in the direction of the arrow, and sent to the next process, that is, the chip component mounting process. In the figure, (6) indicates a frame, and (7) indicates a guide rail.
第２図はプリント基板（１）Ｋ対して接着剤を塗布して
いる状態で、ヘッド（句の先端のノズル（８）から接着
剤（９）が吐出され、このときプリント基板（１）に対
してギャップｄを保つためにヘッド（句に設けたストッ
パピン００）の先端がプリント基板（１）に当接してい
る。Figure 2 shows the adhesive being applied to the printed circuit board (1) K. At this time, the adhesive (9) is discharged from the nozzle (8) at the tip of the head, and at this time the adhesive is applied to the printed circuit board (1). On the other hand, in order to maintain the gap d, the tip of the head (stopper pin 00 provided in the figure) is in contact with the printed circuit board (1).
・ 第４図及び第５図は、第１図の接着剤塗布装置に
よってプリント基板（１）に接着剤を塗布後、チップ部
品（ｌυを前記プリント基板（１）の銅箔０２）上に載
置した状態の斜視図で、第４図はチップ部品ａυのプリ
ント基板（１）に対する仮固定用として接着剤（９）を
用い加熱等にて接着剤（９）を硬化させこの次の工程で
半田ディッピングを行う例、第５図はチップ部品ａυの
プリント基板（１１に対する仮固定用として接着剤（９
）を用い、予め前述と同様加熱等により接着剤（９）を
硬化させ更にクリーム半田（Ｉ３）を銅箔Ｑ２）（１２
１に塗布した上にチップ部品０１）を装着し、次の工程
で該クリーム半田（１３１（１３１を溶融して前記チッ
プ部品（ｌυの電極（１４）（１４）を前記銅箔（１２
）ｆ１２）に電気的かつ機械的に結合する例である。- Figures 4 and 5 show a process in which a chip component (lυ) is placed on the copper foil 02 of the printed circuit board (1) after applying adhesive to the printed circuit board (1) using the adhesive applicator shown in Figure 1. Fig. 4 is a perspective view of the chip component aυ placed on the printed circuit board (1) using an adhesive (9) for temporarily fixing the chip component aυ to the printed circuit board (1). An example of solder dipping is shown in Figure 5, in which adhesive (9
), cure the adhesive (9) by heating etc. in the same way as described above, and then apply the cream solder (I3) to the copper foil Q2) (12
In the next step, the cream solder (131) is melted and the electrodes (14) (14) of the chip component (lυ) are attached to the copper foil (12).
) f12) is an example of electrically and mechanically coupling.
第６図は本発明方法を用いた一実施例で、ＸＹテーブル
（３）に載置されたプリント基板（１）の所定個所にノ
ズル（８）から接着剤を供給、塗布する際にエアー吹出
しノズルＱ９から前記ノズル（８）に対して側面方向（
矢印方向Ｂ）にエアーを吹出させ、排気ダクト（１６）
によって不要な接着剤をノズル周面から取去る構成であ
る。第７図はノズル（８）の軸方向（矢印Ｃ方向）にエ
アーを吹出させる実施例で、エアガイド部切の下方間隙
α樟α樽からエアーを吹き出させる。前述の第６図又は
第７図において、前記エアーの吹出しは次のいずれかの
方式が使用できる。Figure 6 shows an example using the method of the present invention, in which adhesive is supplied from a nozzle (8) to a predetermined location of a printed circuit board (1) placed on an XY table (3), and air is blown when applying the adhesive. From the nozzle Q9 to the nozzle (8) in the lateral direction (
Blow out the air in the direction of the arrow B) and open the exhaust duct (16).
The structure is such that unnecessary adhesive is removed from the nozzle circumferential surface. FIG. 7 shows an embodiment in which air is blown out in the axial direction (direction of arrow C) of the nozzle (8), and the air is blown out from the lower gap α camphor α barrel of the air guide cut. In the above-mentioned FIG. 6 or FIG. 7, any of the following methods can be used for blowing out the air.
■ プリント基板（１）毎に前記ノズル（８）に対して
エアー吹出しを行う。(2) Air is blown from the nozzle (8) for each printed circuit board (1).
■ 前記ノズル（８）からの接着剤の吐出量に応じてエ
アー吹出しを行う。(2) Air is blown according to the amount of adhesive discharged from the nozzle (8).
■ チップ部品の取付個所への接着剤の塗布の所定回数
に応じて前記ノズル（８）に対してエアー吹出しを行う
。(2) Air is blown from the nozzle (8) in accordance with a predetermined number of times the adhesive is applied to the mounting location of the chip component.
これらのタイミング制御については、マイクロコンピュ
ータ（ＣＰｔＪ）等を用いて、予め設定したプログラム
に従って電磁弁（図示せず）を動作させることができる
。Regarding these timing controls, a solenoid valve (not shown) can be operated according to a preset program using a microcomputer (CPtJ) or the like.
（へ）発明の効果
本発明のチップ部品用の接着剤塗布装置の塗布部クリー
ニング方法によれば、塗布部に設けたノズル部分の不要
な接着剤を除去できるので、チップ部品が装着されるプ
リント基板上に所定個所以外の接着剤の塗布を未然に防
止でき、更に前記ノズル近傍に設けたストッパピンへの
不要な接着剤を除去できる利点が得られる。(F) Effects of the Invention According to the method for cleaning the application section of the adhesive applicator for chip components of the present invention, unnecessary adhesive can be removed from the nozzle portion provided in the application section, so that it is possible to remove unnecessary adhesive from the nozzle portion provided in the application section. Advantages are obtained in that it is possible to prevent adhesive from being applied to areas other than predetermined locations on the substrate, and that unnecessary adhesive can be removed from the stopper pin provided near the nozzle.
前記ノズルの側方からエアー吹出しを行えば、前述の第
２の効果が容易に得られ、ノズルの軸方向へのエアー吹
出しを行えば、全体の構成がコンパクトにまとめられる
副効果も得られる。If air is blown from the side of the nozzle, the second effect described above can be easily obtained, and if air is blown in the axial direction of the nozzle, a side effect of making the entire structure more compact can also be obtained.
第１図はチップ部品用の接着剤塗布装置の斜視図、第２
図は第１図におけるヘッド部分の要部拡大側面図、第３
図は第２図に示したディスペンサ部分の要部拡大正面図
、第４図及び第５図はプリント基板の所定個所にチップ
部品を仮固定した状態の斜視図、第６図及び第７図は本
発明の塗布部クリーニング方法を用いた実施例を示す接
着剤塗上な図番の説明
（１）・・・プリント基板 （３）・・・ＸＹテーブ
ル（５）・・・ヘッド （８）・・・ノズル （９
）・・・接着剤Ｑｌ）・・・チップ部品 αり・・・
銅箔 Ｑ４）・・・電極ａ９・・・エアー吹出ノズル
ｆｉＪ図
］４Figure 1 is a perspective view of an adhesive applicator for chip components;
The figure is an enlarged side view of the main part of the head part in Figure 1,
The figure is an enlarged front view of the main part of the dispenser shown in Figure 2, Figures 4 and 5 are perspective views of the chip components temporarily fixed to predetermined locations on the printed circuit board, and Figures 6 and 7 are Explanation of the drawing numbers for adhesive coating showing examples using the application part cleaning method of the present invention (1)...Printed circuit board (3)...XY table (5)...Head (8) ...Nozzle (9
)...Adhesive Ql)...Chip parts αri...
Copper foil Q4)... Electrode a9... Air blowing nozzle fiJ diagram] 4
Claims (3)
剤塗布装置において、接着剤を供給するディスペンサの
塗布部を高圧エアーにてクリーニングすることを特徴と
したチップ部品用の接着剤塗布装置の塗布部クリーニン
グ方法。(1) An adhesive applicator for chip components that temporarily fixes chip components on a printed circuit board, and the adhesive applicator for chip components is characterized in that the applicator section of a dispenser that supplies adhesive is cleaned with high-pressure air. Cleaning method.
し側方から吹付けることを特徴とする特許請求の範囲第
１項記載のチップ部品用の接着剤塗布装置の塗布部クリ
ーニング方法。(2) A method for cleaning an application section of an adhesive application device for chip components according to claim 1, characterized in that the high-pressure air is blown from the side to the application section of the dispenser.
に吹付けることを特徴とする特許請求の範囲第１項記載
のチップ部品用の接着剤塗布装置の塗布部クリーニング
方法。(3) A method for cleaning an application section of an adhesive application device for chip components according to claim 1, characterized in that the high-pressure air is blown in the direction of the application section of the dispenser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9453483A JPS59219983A (en) | 1983-05-27 | 1983-05-27 | Method of cleaning coated part of adhesive coating device for chip part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9453483A JPS59219983A (en) | 1983-05-27 | 1983-05-27 | Method of cleaning coated part of adhesive coating device for chip part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59219983A true JPS59219983A (en) | 1984-12-11 |
| JPS6366078B2 JPS6366078B2 (en) | 1988-12-19 |
Family
ID=14112992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9453483A Granted JPS59219983A (en) | 1983-05-27 | 1983-05-27 | Method of cleaning coated part of adhesive coating device for chip part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59219983A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS603200A (en) * | 1983-06-20 | 1985-01-09 | 松下電器産業株式会社 | Automatic part assembling machine |
| JPS61159073U (en) * | 1985-03-23 | 1986-10-02 | ||
| JPH01317567A (en) * | 1988-06-20 | 1989-12-22 | Miura Kogyo Kk | Hermetic sealant coating method and apparatus |
| JPH06254464A (en) * | 1993-03-04 | 1994-09-13 | Seikosha Co Ltd | Liquid material spraying apparatus |
-
1983
- 1983-05-27 JP JP9453483A patent/JPS59219983A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS603200A (en) * | 1983-06-20 | 1985-01-09 | 松下電器産業株式会社 | Automatic part assembling machine |
| JPS61159073U (en) * | 1985-03-23 | 1986-10-02 | ||
| JPH01317567A (en) * | 1988-06-20 | 1989-12-22 | Miura Kogyo Kk | Hermetic sealant coating method and apparatus |
| JPH0569591B2 (en) * | 1988-06-20 | 1993-10-01 | Miura Kogyo Kk | |
| JPH06254464A (en) * | 1993-03-04 | 1994-09-13 | Seikosha Co Ltd | Liquid material spraying apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6366078B2 (en) | 1988-12-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4934582A (en) | Method and apparatus for removing solder mounted electronic components | |
| JPS6156638B2 (en) | ||
| JPS59219983A (en) | Method of cleaning coated part of adhesive coating device for chip part | |
| US5074455A (en) | Solder flux dispenser suitable for use in automated manufacturing | |
| JP2003078242A (en) | Method of partially soldering printed board | |
| JP2002100858A (en) | Flux-applying method, flow soldering method, device for the same and electronic circuit board | |
| JP3334505B2 (en) | Mounting method of chip-shaped electronic components | |
| JPH06164190A (en) | Method for controlling printed board on electronic component mounting line | |
| JPH0864941A (en) | Mounting method and equipment of electronic component provided with leads | |
| JPH01161797A (en) | Mounting method for electronic part and storecase for electronic part | |
| JPH04258369A (en) | Solder removing method | |
| JPH04151893A (en) | Falling-off preventing method of electronic components | |
| JPS60239094A (en) | Method of soldering electronic part | |
| JPS59165444A (en) | Fabrication of hybrid integrated circuit | |
| JPH05211390A (en) | Mounting method of surface mounting part | |
| JPH04100569A (en) | Solder feeding method | |
| JPH07183649A (en) | Flux coating device | |
| JPS6297763A (en) | Soldering method and device | |
| JPH11186703A (en) | Apparatus for local application of flux | |
| JPS6174393A (en) | Soldering method | |
| JPH03262191A (en) | Solder coating of printed board | |
| JPH01146315A (en) | Chip parts | |
| JPH07249857A (en) | Part mounting method of printed wiring board | |
| JPS61212469A (en) | Soldering device | |
| JPH0572167U (en) | Electronic component mounting equipment |