JPH0437019A - A solid electrolytic capacitor - Google Patents
A solid electrolytic capacitorInfo
- Publication number
- JPH0437019A JPH0437019A JP14136690A JP14136690A JPH0437019A JP H0437019 A JPH0437019 A JP H0437019A JP 14136690 A JP14136690 A JP 14136690A JP 14136690 A JP14136690 A JP 14136690A JP H0437019 A JPH0437019 A JP H0437019A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electrolytic capacitor
- solid electrolytic
- layer
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 23
- 239000007787 solid Substances 0.000 title claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 16
- 239000002904 solvent Substances 0.000 claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims abstract description 7
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- 229910015900 BF3 Inorganic materials 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003502 gasoline Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- -1 boron trifluoride amine Chemical class 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940113088 dimethylacetamide Drugs 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
し発明の目的］
（産業上の利用分野）
本発明は、樹脂を用いて外装した、電気特性の優れた固
体電解コンデンサに関する。DETAILED DESCRIPTION OF THE INVENTION OBJECTS OF THE INVENTION (Industrial Field of Application) The present invention relates to a solid electrolytic capacitor that is packaged with resin and has excellent electrical characteristics.
（従来の技術）
本発明か関連する固体電解コンデンサは、第１図に示し
たようにタンタル、アルミニウム、ニオブ等の弁作用を
有する金属からなる陽極体１を化成処理して誘電体層２
を形成した後、さらにその表面に半導体層３、陰極層４
を形成するとともに陰極層４を外部リードフレーム５に
導電性接着剤６を用いて接着固定し、陽極体１に通じて
いる陽極体リード７を陽極外部リード８に半田９で接合
させ、さらにその外周面を外装樹脂１０により外装して
構成されている。(Prior Art) As shown in FIG. 1, a solid electrolytic capacitor related to the present invention has a dielectric layer 2 formed by chemically treating an anode body 1 made of a metal with a valve action such as tantalum, aluminum, or niobium.
After forming, a semiconductor layer 3 and a cathode layer 4 are further formed on the surface.
At the same time, the cathode layer 4 is adhesively fixed to the external lead frame 5 using a conductive adhesive 6, and the anode body lead 7 leading to the anode body 1 is joined to the anode external lead 8 with solder 9. The outer peripheral surface is covered with a covering resin 10.
（発明が解決しようとする課題）
しかし、従来、陰極層は通常の導電性ペーストを使用し
て形成され、陰極層の導電性ペーストの性能により固体
電解コンデンサの耐湿後の電気特性か劣化する欠点があ
った。(Problem to be Solved by the Invention) However, conventionally, the cathode layer is formed using an ordinary conductive paste, and the electrical properties of the solid electrolytic capacitor after moisture resistance deteriorate due to the performance of the conductive paste of the cathode layer. was there.
本発明は、上記の欠点を解消するなめになされたもので
、樹脂で外装したものであるにもかかわらず耐湿後の電
気特性に優れた固体電解コンデンサを提供しようとする
ものである。The present invention has been made to eliminate the above-mentioned drawbacks, and aims to provide a solid electrolytic capacitor that has excellent electrical characteristics after being resistant to moisture despite being coated with resin.
［発明の梢成Ｊ
（課題を解決するための手段）
本発明者らは、上記の目的を達成しようと鋭意研究を重
ねた結果、後述する朝成の導電性ペーストを用いること
によって、接着性に優れた陰極層が形成でき、耐湿後の
電気特性の劣化しにくい固体電解コンデンサが得られる
ことを見いだし、本発明を完成したものである。[Means for Solving the Problems of the Invention] As a result of intensive research aimed at achieving the above object, the inventors of the present invention have developed adhesive properties by using Asasei's conductive paste, which will be described later. The inventors have completed the present invention by discovering that a solid electrolytic capacitor can be obtained in which a cathode layer with excellent properties can be formed and whose electrical characteristics are less susceptible to deterioration after being resistant to moisture.
すなわち、本発明は、
弁作用を有する金属からなる陽極体に、誘電体層、半導
体層、＃極層を順次形成し、ｍ脂を用いて外装する固体
電解コンデンサにおいて、陰極層が（Ａ）ポリパラヒド
ロキシスチレン樹脂とエポキシ樹脂からなる変性樹脂、
（Ｂ）導電性粉末およびａｉｍシリカ系粉末、（Ｃ）脂
肪族炭化水素系溶剤
を必須成分とする導電性ペーストで形成されてなること
を特徴とする固体電解コンデンサである。That is, the present invention provides a solid electrolytic capacitor in which a dielectric layer, a semiconductor layer, and a # electrode layer are sequentially formed on an anode body made of a metal having a valve action, and the cathode layer is (A) It is characterized by being formed of a modified resin consisting of polyparahydroxystyrene resin and epoxy resin, (B) conductive powder and aim silica powder, and (C) conductive paste whose essential components are an aliphatic hydrocarbon solvent. This is a solid electrolytic capacitor.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明に用いる（Ａ）ポリパラヒドロキシスチレン樹脂
とエポキシ樹脂からなる変性樹脂とじては、ポリパラヒ
ドロキシスチレン樹脂とエポキシ樹脂を単に溶解混合し
てもよいし、必要であれば加熱反応により相互に部分的
に結合させたものでもよい、 また、その反応に必要で
あれば硬化触媒を使用することもできる。 さらに、こ
れらの成分樹脂の共通の溶剤に溶解することにより作業
粘度を改善することができる。For the modified resin (A) consisting of polyparahydroxystyrene resin and epoxy resin used in the present invention, polyparahydroxystyrene resin and epoxy resin may be simply dissolved and mixed, or if necessary, they can be mutually mixed by heating reaction. They may be partially bonded, and a curing catalyst may be used if necessary for the reaction. Furthermore, the working viscosity can be improved by dissolving these component resins in a common solvent.
ここで使用するポリパラしドロキシスチレン樹脂は次式
で示される樹脂である。The polypara-droxystyrene resin used here is a resin represented by the following formula.
（但し、式中ｎは２５〜９０の整数を表す）このような
樹脂として、例えばマルカリン力−Ｍ（光害石油化学社
製、商品名）等があり、その分子量が３０００〜８００
０で水酸基当量が約１２０のものである。 また、変性
樹脂に用いるエポキシ樹脂としては、工業生産されてお
り、かつ本発明に効果的に使用し得るものとして、次の
ようなどスフエノール類のジエボキシドがある。 エピ
コート８２７，８２８，８３４，１００１，１００２゜
１００７．１００９ （シェル化学社製、商品名）、Ｄ
ＥＲ３３０，３３１，３３２，３３４，３３５゜３３６
．３３７，６６０ （タウケミカル社製商品名）、アラ
ルダイトＧＹ２５０，２６０，２８０６０７１．６０８
４，６０９７．６０９９ （チバ力゛イギー社製、商品
名）、ＥＰＩ−ＲＥＺ５１０゜５１０１（ＪＯＮＥ
ＤＡＢＮＥＹ社製、商品名）、エピクロン８１０，１０
００，１０１０゜３０１０（大日本インキ化学工業社製
、商品名）、ＥＰシリーズ（地竜化社製、商品名）があ
る。(However, in the formula, n represents an integer of 25 to 90.) Examples of such resins include Markarin Riki-M (manufactured by Kokushi Petrochemical Co., Ltd., trade name), which has a molecular weight of 3000 to 800.
0 and the hydroxyl equivalent is about 120. Epoxy resins used in the modified resin include dieboxides of suphenols such as those listed below, which are industrially produced and can be effectively used in the present invention. Epicote 827, 828, 834, 1001, 1002゜1007.1009 (manufactured by Shell Chemical Co., Ltd., trade name), D
ER330, 331, 332, 334, 335°336
．． 337,660 (trade name manufactured by Tau Chemical Company), Araldite GY250,260,2806071.608
4,6097.6099 (Ciba Power manufactured by Iggy Co., Ltd., product name), EPI-REZ510゜5101 (JONE
Manufactured by DABNEY, product name), Epicron 810,10
There are 00,1010°3010 (manufactured by Dainippon Ink and Chemicals Co., Ltd., trade name) and EP series (manufactured by Jiryuka Co., Ltd., trade name).
さらに平均エポキシ基数３以上の、例えばノボラックエ
ポキシ樹脂を使用することにより熱時（３５０°Ｃ）の
接着強度を更に向上させることができる。 これらのノ
ボラックエポキシ樹脂として分子量５００以上のものが
適している。 このようなノボラックエポキシ樹脂で工
業生産されているものとしては、例えば次のようなもの
がある。 アラルダイトＢＰＮＩ １３’８，１１３９
、ＥＣＮ１２７３．１２８０．１２９９ （チバガイギ
ー社製、商品名）、ＤＥＮ４３１，４３８ ＜ダウケミ
カル社製、商品名）、エピコート１５２．１５４（シェ
ル化学社製、商品名）、ＥＲＲ−Ｏｆ ００、ＥＲＲＢ
−０４４７、ＥＲＬＢ−０４８８＜ユニオンカーバイド
社製、商品名）、ＥＯＣＮシリーズ（日本化薬社製、商
品名）等があり、これらのエポキシ樹脂ｌ脂は、単独又
は２種以上混合して使用することができる。Further, by using a novolac epoxy resin having an average number of epoxy groups of 3 or more, for example, the adhesive strength at high temperatures (350° C.) can be further improved. As these novolak epoxy resins, those having a molecular weight of 500 or more are suitable. Examples of such novolak epoxy resins that are industrially produced include the following. Araldite BPNI 13'8,1139
, ECN1273.1280.1299 (manufactured by Ciba Geigy, trade name), DEN431,438 <manufactured by Dow Chemical Company, trade name), Epicote 152.154 (manufactured by Shell Chemical Company, trade name), ERR-Of 00, ERRB
-0447, ERLB-0488 (manufactured by Union Carbide Co., Ltd., trade name), EOCN series (manufactured by Nippon Kayaku Co., Ltd., trade name), etc. These epoxy resins can be used alone or in combination of two or more. be able to.
ポリパラヒドロキシスチレン樹脂とエポキシ樹脂からな
る変性樹脂は次の溶剤で溶解混合させることか望ましい
、 ここで使用できる溶剤類としては、ジオキサン、ヘ
キサン、ベンゼン、トルエン、ソルベントナフサ、工業
用ガソリン、酢酸セロソルブ、エチルセロソルブ、ブチ
ルセロソルブ、ブチルセロソルブアセテート、ブチルカ
ルピトールアセテート、ジエチレングリコールジエチル
エーテル、ジメチルホルムアミド、ジメチルアセトアミ
ド、Ｎ−メチルピロリドン等が挙げられ、これらは単独
又は２種以上混合して使用される。It is preferable to dissolve and mix the modified resin consisting of polyparahydroxystyrene resin and epoxy resin in the following solvents. Solvents that can be used here include dioxane, hexane, benzene, toluene, solvent naphtha, industrial gasoline, and cellosolve acetate. , ethyl cellosolve, butyl cellosolve, butyl cellosolve acetate, butyl carpitol acetate, diethylene glycol diethyl ether, dimethyl formamide, dimethyl acetamide, N-methyl pyrrolidone, etc., and these may be used alone or in combination of two or more.
本発明に用いる（Ｂ）導電性粉末および微細シリカ系粉
末としては、導電性粉末と微細シリカ粉末とを併用する
ものである。 導電性粉末としては銀粉末、銀メツキ銅
粉末、銅粉末、ニラゲル粉末、カーボン等が使用される
。 また微細シリカ粉末としては、例えばアエロシール
（日本アエロシール社製、商品名）等が挙げられ、粒径
１μｍ以下のものが好ましい。As the conductive powder and fine silica powder (B) used in the present invention, a conductive powder and fine silica powder are used in combination. As the conductive powder, silver powder, silver-plated copper powder, copper powder, nila gel powder, carbon, etc. are used. Further, examples of the fine silica powder include Aeroseal (manufactured by Nippon Aeroseal Co., Ltd., trade name), and those having a particle size of 1 μm or less are preferable.
本発明に用いる（Ｃ）脂肪族炭化水素系溶剤としては、
ペーストの溶剤の一成分として使用するもので、脂肪族
炭化水素系溶剤であればよく、特に制限はない、 これ
らの溶剤として例えば、ガソリン、石油、ベンジン、ミ
ネラルスピリット、ヘキサン、石油ナフサなどが挙げら
れ、これらは単独又は２種以上混合して使用することが
できる。As the aliphatic hydrocarbon solvent (C) used in the present invention,
It is used as a component of the solvent for the paste, and there are no particular restrictions as long as it is an aliphatic hydrocarbon solvent. Examples of these solvents include gasoline, petroleum, benzene, mineral spirits, hexane, and petroleum naphtha. These can be used alone or in a mixture of two or more.
本発明に用いる導電性ペーストは、ポリパラヒドロキシ
スチレン樹脂とエポキシ樹脂からなる変性樹脂、導電性
粉末および機紐シリカ系粉末、脂肪族炭化水素系溶剤を
必須成分とするが、本発明の目的に反しない範囲におい
て、また、必要に応じて消泡剤、その他の添加剤を添加
配合することができる。The conductive paste used in the present invention contains a modified resin consisting of polyparahydroxystyrene resin and epoxy resin, conductive powder, machine cord silica powder, and aliphatic hydrocarbon solvent as essential components. Antifoaming agents and other additives may be added and blended as necessary within a range that does not cause adverse effects.
これらの各成分を常法に従い十分混合した後、更に例え
ば３本ロールにより混練処理し、その後減圧脱泡して酢
酸エステル系溶剤で希釈し、固体電解コンデンサ素子を
ディッピングし陰極層を形成する。 その後、導電性接
着剤で陰極層とリードフレームを接合した後、陽極外部
リードにｔｉｉ体リードを半田付けし、モールド成形法
やデイツプ法により樹脂で外装被覆して固体電解コンデ
ンサを製造することができる。After thoroughly mixing these components according to a conventional method, the mixture is further kneaded using, for example, three rolls, and then defoamed under reduced pressure and diluted with an acetate-based solvent, and the solid electrolytic capacitor element is dipped to form a cathode layer. After that, after bonding the cathode layer and lead frame with a conductive adhesive, the TII body lead is soldered to the anode external lead, and the exterior is coated with resin using a molding method or dip method to manufacture a solid electrolytic capacitor. can.
（作用）
本発明の固体電解コンデンサは、ポリパラヒドロキシス
チレン樹脂とエポキシ樹脂からなる変性樹脂を用いるこ
と、それに特に脂肪族炭化水素系溶剤を併用することに
よって接着性、耐湿後の電気特性を優れたものとするこ
とができた。(Function) The solid electrolytic capacitor of the present invention has excellent adhesive properties and electrical properties after moisture resistance by using a modified resin consisting of polyparahydroxystyrene resin and epoxy resin, and by using an aliphatic hydrocarbon solvent in particular. I was able to make it work.
（実施例）
次に本発明を実施例によって具体的に説明するが、本発
明はこれらの実施例によって限定されるものではない、
以下の実施例および比較例において「部」とは特に説
明のない限り「重量部Ｊを意味する。(Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited by these examples.
In the following Examples and Comparative Examples, "parts" means "parts by weight J" unless otherwise specified.
実施例 １
エポキシ樹脂のエピコート１００１ （シェル化学社製
、商品名＞ ３７．５部と、ポリパラヒドロキシスチレ
ン樹脂のマルカリン力−Ｍ（光害石油化学社製、商品名
）１０部とを、ジエチレングリコールジエチルエーテル
１０３部中で１００℃、１時間溶解反応させて、粘稠な
樹脂を得た。 この樹脂２２部に、触媒として三フッ化
ホウ素のアミン錯体１．０部、添加剤０．０３部、銀粉
末５７部、アエロシール＃２００ （日本アエロシール
社製、商品名）２．０部、ヘキサン５部、および酢酸ブ
チル４５部とを混合して導電性ペーストを製造した。Example 1 37.5 parts of the epoxy resin Epikote 1001 (manufactured by Shell Chemical Co., Ltd., trade name) and 10 parts of the polyparahydroxystyrene resin Marcarin Power-M (manufactured by Koki Petrochemical Co., Ltd., trade name) were mixed with diethylene glycol. A viscous resin was obtained by dissolving and reacting in 103 parts of diethyl ether at 100°C for 1 hour.To 22 parts of this resin, 1.0 part of an amine complex of boron trifluoride as a catalyst and 0.03 part of an additive were added. , 57 parts of silver powder, 2.0 parts of Aeroseal #200 (manufactured by Nippon Aeroseal Co., Ltd., trade name), 5 parts of hexane, and 45 parts of butyl acetate were mixed to produce a conductive paste.
実施例 ２
エポキシ樹脂のエピコート８２８（シェル化学社製、商
品名） １５．８部と、ポリパラヒドロキシスチレン樹
脂のマルカリン力−Ｍ（丸前石油化学社製、商品名）１
０部とを、ブチルセロソルブアセテート５６部中で１０
０℃、１時間溶解反応させて、粘稠な樹脂を得た。 こ
の樹脂２２部に、触媒として三フッ化ホウ素のアミンｉ
Ｍ体１．０部、銀粉末５７部、アエロシール＃２００
＜前出）２．５部、ヘキサン５部、および酢酸ブチル４
５部とを混合して導電性ペーストを製造した。Example 2 15.8 parts of epoxy resin Epikote 828 (manufactured by Shell Chemical Co., Ltd., trade name) and 1 part of polyparahydroxystyrene resin Marcarin Power-M (manufactured by Marumae Petrochemical Co., Ltd., trade name)
0 parts and 10 parts in 56 parts of butyl cellosolve acetate.
A dissolution reaction was carried out at 0° C. for 1 hour to obtain a viscous resin. To 22 parts of this resin, boron trifluoride amine i was added as a catalyst.
M body 1.0 parts, silver powder 57 parts, Aeroseal #200
<previously mentioned) 2.5 parts, hexane 5 parts, and butyl acetate 4 parts
A conductive paste was prepared by mixing 5 parts.
実施例 ３
エポキシ樹脂ＥＯＣＮ１０３Ｓ（日本化薬社製、商品名
）６６部と、ポリパラヒドロキシスチレン樹脂のマルカ
リン力−Ｍ（前出）３４部とを、ブチルカルピトールア
セテート １１７部中で１００℃、１時間溶解反応させ
て、粘稠な樹脂を得た。 この樹脂２２部に、触媒とし
て三フッ化ホウ素のアミン錯体１．０部、銀粉末５７部
、アエロシール＃２００（前出）２．０部、ヘキサン５
部、および酢酸ブチル４５部とを混合して導電性ペース
トを製造した。Example 3 66 parts of epoxy resin EOCN103S (manufactured by Nippon Kayaku Co., Ltd., trade name) and 34 parts of polyparahydroxystyrene resin Marcarin Power-M (mentioned above) were mixed at 100°C in 117 parts of butylcarpitol acetate. A viscous resin was obtained by dissolving and reacting for 1 hour. To 22 parts of this resin, 1.0 part of an amine complex of boron trifluoride as a catalyst, 57 parts of silver powder, 2.0 parts of Aerosil #200 (mentioned above), and 5 parts of hexane.
and 45 parts of butyl acetate to prepare a conductive paste.
比較例
市販のエポキシ樹脂ベースの溶剤型半導体用導電性ペー
ストを入手した。Comparative Example A commercially available epoxy resin-based solvent-based conductive paste for semiconductors was obtained.
実施例１〜３及び比較例で得た導電性ペーストを用いて
、その中に固＃電解コンデンサをディッピング処理して
陰極層を形成し、その後リードフレームと陰極層を接合
し、モールド成形法によって樹脂で外装被覆して、固＃
電解コンデンサを製造した。 こうして得られた固体電
解コンデンサの接着強度、耐湿電流リークの試験を行っ
た。Using the conductive pastes obtained in Examples 1 to 3 and Comparative Examples, a solid electrolytic capacitor was dipped therein to form a cathode layer, and then the lead frame and the cathode layer were bonded and molded. Coated with resin and hardened
Manufactured electrolytic capacitors. The solid electrolytic capacitor thus obtained was tested for adhesive strength and moisture resistance and current leakage.
その結果を第１表に示したが、いずれも本発明が優れて
おり本発明の効果が確認された。The results are shown in Table 1, and the present invention was superior in all cases, confirming the effects of the present invention.
［発明の効果コ
以上の説明及び第１表の結果から明らがなように、本発
明の固体電解コンデンサは、接着性、耐湿後の電気特性
に優れており、樹脂で外装しても電気特性の低下はわず
かなものであった。[Effects of the Invention] As is clear from the above explanation and the results in Table 1, the solid electrolytic capacitor of the present invention has excellent adhesive properties and electrical properties after moisture resistance, and has excellent electrical properties even when exteriorized with resin. The deterioration in properties was slight.
第１図は本発明が関連する固体電解コンデンサの説明用
断面図である。
１・・陽極体、 ２・・・誘電体層、 ３・・・半導体
層、４・・・＃を極層、 ５・・・ｌＩ！極リードフ
レーム、 ６・・・導電性接着剤、 ７・り陽極体リ
ード、 ８・・・陽極外部リード、 ９・・・半田、
１ｏ・・・外装樹脂。
特許比―人 東芝ケミカル株式会社
＊１ ：ｆｆｌメツキを施したリードフレームに２．０
＠Ｘ２．ＯＩｍのシリコンチッグを接着し、２５℃の温
度でテンションゲージを用いて測定しな。
２ 誘電体層FIG. 1 is an explanatory cross-sectional view of a solid electrolytic capacitor to which the present invention relates. 1...Anode body, 2...Dielectric layer, 3...Semiconductor layer, 4...# as pole layer, 5...lI! Pole lead frame, 6... Conductive adhesive, 7. Anode body lead, 8... Anode outer lead, 9... Solder,
1o...Exterior resin. Patent ratio - person Toshiba Chemical Corporation *1: 2.0 on lead frame with ffl plating
@X2. Glue the OIm silicone tip and measure using a tension gauge at a temperature of 25°C. 2 Dielectric layer
Claims (1)
半導体層、陰極層を順次形成し、樹脂を用いて外装する
固体電解コンデンサにおいて、陰極層が （Ａ）ポリパラヒドロキシスチレン樹脂と エポキシ樹脂からなる変性樹脂、 （Ｂ）導電性粉末および微細シリカ系粉末、（Ｃ）脂肪
族炭化水素系溶剤 を必須成分とする導電性ペーストで形成されてなること
を特徴とする固体電解コンデンサ。[Claims] 1. An anode body made of a metal having a valve action, a dielectric layer,
In a solid electrolytic capacitor in which a semiconductor layer and a cathode layer are sequentially formed and then packaged with a resin, the cathode layer is made of (A) a modified resin made of polyparahydroxystyrene resin and an epoxy resin, (B) conductive powder and fine silica. A solid electrolytic capacitor formed of a conductive paste containing powder and (C) an aliphatic hydrocarbon solvent as an essential component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14136690A JPH0437019A (en) | 1990-06-01 | 1990-06-01 | A solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14136690A JPH0437019A (en) | 1990-06-01 | 1990-06-01 | A solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0437019A true JPH0437019A (en) | 1992-02-07 |
Family
ID=15290315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14136690A Pending JPH0437019A (en) | 1990-06-01 | 1990-06-01 | A solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0437019A (en) |
-
1990
- 1990-06-01 JP JP14136690A patent/JPH0437019A/en active Pending
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