JP2005082636A - Electrically conductive coating and solid electrolytic capacitor - Google Patents

Electrically conductive coating and solid electrolytic capacitor Download PDF

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JP2005082636A
JP2005082636A JP2003313420A JP2003313420A JP2005082636A JP 2005082636 A JP2005082636 A JP 2005082636A JP 2003313420 A JP2003313420 A JP 2003313420A JP 2003313420 A JP2003313420 A JP 2003313420A JP 2005082636 A JP2005082636 A JP 2005082636A
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electrically conductive
solid electrolytic
conductive filler
coating
electrolytic capacitor
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Shinichiro Sano
慎一朗 佐野
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Kyocera Chemical Corp
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Kyocera Chemical Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrically conductive coating for solid electrolytic capacitors, excellent in leveling tendency and electrical conductivity and high in coating film strength, and to provide a solid electrolytic capacitor whose cathode is formed using this coating. <P>SOLUTION: The electrically conductive coating essentially comprises (A) an electrically conductive filler, (B) an alicyclic epoxy resin, (C) an organic solvent or monomer and (D) sulfonium salts of the respective general formulas(1) and (2)( in the formula(1), X is CH<SB>3</SB>, H, a halogen atom or NO<SB>2</SB>; and M is Sb, As or P; in the formula(2), R<SP>1</SP>and R<SP>2</SP>are each an alkyl, halogen atom or H; R<SP>3</SP>is an ether or ester group; and A<SP>-</SP>is SbF<SB>6</SB><SP>-</SP>, AsF<SB>6</SB><SP>-</SP>, PF<SB>6</SB><SP>-</SP>or CH<SB>3</SB>SO<SB>4</SB><SP>-</SP>). In this coating, the amount of the electrically conductive filler(A) is 60-85 wt.% in terms of the weight ratio[ the electrically conductive filler/(resin solids+electrically conductive filler) ] and the amount of the sulfonium salts(D) is 0.1-10 pt(s). wt. based on 100 pts. wt. of the alicyclic epoxy resin(B). The solid electrolytic capacitor whose cathode layer is formed using this coating is also provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、固体電解コンデンサの陰極を形成するための導電性塗料およびその塗料を用いて形成した固体電解コンデンサに関する。   The present invention relates to a conductive paint for forming a cathode of a solid electrolytic capacitor and a solid electrolytic capacitor formed using the paint.

本発明が関連する固体電解コンデンサは、従来より、タンタル、アルミニウム、ニオブなどの弁作用を有する金属からなる陽極体を化成処理し、その表面に誘電体層を形成した後、さらにその表面に半導体層、カーボン層、陰極層を順次形成するとともに、陰極層を陰極リードフレームに導電性接着剤を用いて接着固定し、陽極体に通じている陽極体リードを陽極リードフレームに溶接により接続し、さらにその外周面を外装樹脂により外装して構成されている。     The solid electrolytic capacitor to which the present invention relates is conventionally a chemical conversion treatment of an anode body made of a metal having a valve action such as tantalum, aluminum, niobium, etc., a dielectric layer is formed on the surface, and a semiconductor is further formed on the surface Forming a layer, a carbon layer, and a cathode layer sequentially, and bonding and fixing the cathode layer to the cathode lead frame using a conductive adhesive, and connecting the anode body lead leading to the anode body to the anode lead frame by welding; Furthermore, the outer peripheral surface is constituted by an exterior resin.

しかし、従来の陰極層は、通常の銀系導電性塗料を主体とした導電性ペーストによって形成されており、レベリング性が低いために陰極層の面部分が厚く角部分が薄くなるという欠点があった。即ち、固体電解コンデンサが全体的に丸まった形になり、外周面を外装樹脂により外装した際、外装樹脂層は直方体に成形されるため、外装樹脂層の厚みにも大きなバラツキが生じるのである。外装樹脂層の厚みのバラツキは、固体電解コンデンサにに熱負荷がかかった際、外装樹脂層の体積変化を不均一にし、コンデンサ内部の各層にストレスを与える原因となり、コンデンサの故障につながると考えられる。さらに、外装樹脂層の厚さは、極端に薄い部分ががあってはならないので、陰極層の最も厚い部分を基準に形成しなければならず、陰極層の厚さの不均一さが、コンデンサそのものの大きさを小さくすることの妨げとなっていた。   However, the conventional cathode layer is formed of a conductive paste mainly composed of a normal silver-based conductive paint, and has a drawback that the surface portion of the cathode layer is thick and the corner portion is thin because of its low leveling property. It was. That is, when the solid electrolytic capacitor is entirely rounded and the outer peripheral surface is covered with the exterior resin, the exterior resin layer is formed into a rectangular parallelepiped, resulting in a large variation in the thickness of the exterior resin layer. The variation in the thickness of the outer resin layer is considered to cause unevenness in volume change of the outer resin layer when the solid electrolytic capacitor is subjected to a thermal load, causing stress on each layer inside the capacitor, leading to capacitor failure. It is done. Furthermore, since the thickness of the exterior resin layer should not have an extremely thin portion, it must be formed with reference to the thickest portion of the cathode layer. It was an obstacle to reducing the size of itself.

これまで、この陰極層の厚さのバラツキを解決するために、ポリイミド樹脂、ポリアミドイミド樹脂を用いた導電性塗料を使用する方法が検討されてきた。しかし、これらの樹脂を用いた導電性塗料により形成した陰極層は、厚みは均一だが非常に脆い。陰極層が脆いと、陰極リードフレームを接着した後、コンデンサの製造工程で陰極リードフレームが剥がれることがある。   Until now, in order to solve the variation in thickness of the cathode layer, a method of using a conductive paint using a polyimide resin or a polyamideimide resin has been studied. However, a cathode layer formed of a conductive paint using these resins is uniform in thickness but very fragile. If the cathode layer is brittle, the cathode lead frame may be peeled off in the capacitor manufacturing process after the cathode lead frame is bonded.

以上のように、塗膜が均一で強固になる導電性塗料の開発は困難であった。さらに、近年、電子機器が大量のデジタル情報を高クロック周波数で処理するようになるにつれて、固体電解コンデンサには高周波インピーダンス化の要求が強くなり、それに用いる導電性塗料には、安定した高い導電性と電気的な接合信頼性の向上が求められるようになった。   As described above, it has been difficult to develop a conductive paint that makes the coating film uniform and strong. Furthermore, in recent years, as electronic devices have processed a large amount of digital information at a high clock frequency, there has been a strong demand for high frequency impedance for solid electrolytic capacitors, and the conductive paint used therefor has a stable and high conductivity. Improvement of electrical joint reliability has been demanded.

本発明の目的は、上記の欠点を解消するためになされたものであり、コンデンサ陰極層形成時に均一な塗膜を形成するレベリング性を有し、かつ、硬化後の塗膜が強固で、陰極リードフレーム接着時の接着信頼性が高く、さらに高い導電性を有する導電性塗料を提供すること、さらにその導電性塗料を用いて、信頼性の高い固体電解コンデンサを提供することにある。   An object of the present invention is to solve the above-mentioned drawbacks, and has a leveling property for forming a uniform coating film at the time of forming a capacitor cathode layer, and has a strong coating film after curing. An object of the present invention is to provide a conductive paint having high adhesion reliability at the time of bonding a lead frame and having higher conductivity, and further to provide a solid electrolytic capacitor having high reliability using the conductive paint.

本発明者は、上記の目的を達成しようと鋭意研究を重ねた結果、後述する組成物を用いることによって、レベリング性に優れ塗膜の強度が高く、電気的接合信頼性の優れた、固体電解コンデンサ陰極形成用導電性塗料が得られることを見いだし、本発明を完成したものである。   As a result of earnest research to achieve the above-mentioned object, the present inventor has achieved solid level electrolysis with excellent leveling properties, high coating strength, and excellent electrical bonding reliability by using the composition described later. It has been found that a conductive paint for forming a capacitor cathode can be obtained, and the present invention has been completed.

即ち、本発明は、
弁作用を有する金属からなる陽極体に、誘電体層、半導体性電解質層、カーボン層、陰極層を順次形成し、陰極層と陰極フレーム(端子)を導電性接着剤で接続して、樹脂を用いて外装する固体電解コンデンサにおける陰極形成用導電性塗料であり、(A)導電性充填剤、(B)脂環式エポキシ樹脂、(C)有機溶剤またはモノマー、(D)下記一般式化1に示すスルホニウム塩および

Figure 2005082636

を必須成分とし且つ、(A)導電性充填剤を(導電性充填剤/(樹脂の固形分+導電性充填剤))の比率で60〜85重量%、(D)スルホニウム塩を(B)脂環式エポキシ樹脂100重量部に対し0.1〜10重量部含有することを特徴とする導電性塗料であり、またその導電性塗料を用いて陰極層が形成されてなることを特徴とする固体電解コンデンサである。 That is, the present invention
A dielectric layer, a semiconducting electrolyte layer, a carbon layer, and a cathode layer are sequentially formed on an anode body made of a metal having a valve action, and the cathode layer and the cathode frame (terminal) are connected with a conductive adhesive, and the resin is It is a conductive paint for forming a cathode in a solid electrolytic capacitor to be used and is (A) a conductive filler, (B) an alicyclic epoxy resin, (C) an organic solvent or monomer, (D) the following general formula 1 Sulfonium salts and
Figure 2005082636

And (A) a conductive filler in a ratio of (conductive filler / (resin solid content + conductive filler)) of 60 to 85% by weight, (D) a sulfonium salt (B) It is a conductive paint characterized by containing 0.1 to 10 parts by weight with respect to 100 parts by weight of an alicyclic epoxy resin, and a cathode layer is formed using the conductive paint. It is a solid electrolytic capacitor.

本発明に用いる導電性塗料は、レベリング性、導電性に優れ、接着強度が高い。この導電性塗料を固体電解コンデンサの陰極形成に使用することにより電気的、物理的な接合信頼性の向上が望める。   The conductive paint used in the present invention is excellent in leveling and conductivity, and has high adhesive strength. By using this conductive paint for forming the cathode of the solid electrolytic capacitor, it is possible to improve the electrical and physical bonding reliability.

以下、本発明を詳細に説明する。   Hereinafter, the present invention will be described in detail.

本発明に用いる(A)導電性充填剤としては、例えば、銀粉末、銀コート銅粉のような表面に銀層を有する粉末、銅粉末、ニッケル粉末等が挙げられ、これらは単独又は2種以上混合して使用することができる。ここで、この導電性充填剤は少なくとも銀粉、銀コート銅粉のような表面に銀層を有する導電性充填剤を含むことが必要である。導電性充填剤の粒子形状は、特に制限はないが、平均粒径は20μm以下のもので、好ましくは平均粒径が5〜15μmのものを使用する。平均粒径が20μmを超えると塗料中での分散が悪くなり、塗料を塗布する際の作業性に問題が生じる。   Examples of the conductive filler (A) used in the present invention include silver powder, silver-coated copper powder having a silver layer on the surface, copper powder, nickel powder, and the like. They can be used in combination. Here, the conductive filler needs to contain at least a conductive filler having a silver layer on the surface, such as silver powder and silver-coated copper powder. The particle shape of the conductive filler is not particularly limited, but the average particle diameter is 20 μm or less, and preferably the average particle diameter is 5 to 15 μm. When the average particle size exceeds 20 μm, dispersion in the paint is deteriorated, resulting in a problem in workability when the paint is applied.

導電性充填剤の配合量は、導電性充填剤が[導電性充填剤/(樹脂の固形分+導電性充填剤)]の比率で60〜85重量%の範囲であることが望ましい。配合割合がこの範囲外であると、導電性が低く、電気的な接合信頼性が得られない。 本発明に用いる(B)脂環式エポキシ樹脂としては、例えば、シクロヘキセンオキシド基,トリシクロデセンオキシド基,あるいはシクロペンテンオキシド基等を有する化合物を挙げることができる。   The blending amount of the conductive filler is desirably in the range of 60 to 85% by weight in terms of the ratio of [conductive filler / (solid content of resin + conductive filler)] of the conductive filler. When the blending ratio is out of this range, the electrical conductivity is low, and electrical connection reliability cannot be obtained. Examples of the (B) alicyclic epoxy resin used in the present invention include compounds having a cyclohexene oxide group, a tricyclodecene oxide group, a cyclopentene oxide group, or the like.

本発明に用いる(C)有機溶剤またはモノマーとしては、本発明である導電性塗料を希釈するものであり、塗布作業粘度を調整、改善することができる。溶剤としては、具体的に例えば、ジオキサン、ヘキサン、トルエン、メチルセロソルブ、シクロヘキサノン、シクロペンタノン、ブチルセロソルブ、ブチルセロソルブアセテート、ブチルカルビトールアセテート、ジエチレングリコールジエチルエーテル、N−メチルピロリドン、ジメチルホルムアミド、ジメチルアセトアミド等が挙げられ、これらは単独又は2種以上混合して使用することができる。また、モノマーとしては、N−ブチルグリシジルエーテル、アリルグリシジルエーテル、2−エチルヘキシルグリシジルエーテル、スチレンオキサイド、フェニルグリシジルエーテル、クレジルグリシジルエーテル、p−sec−ブチルフェニルグリシジルエーテル、グリシジルメタクリレート、t−ブチルフェニルグリシジルエーテル、ジグリシジルエーテル、(ポリ)エチレングリコールジグリシジルエーテル、(ポリ)プロピレングリコールジグリシジルエーテル、ブタンジオールジグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、1,6−ヘキサンジオールジグリシジルエーテル等が挙げられ、これらは単独又は2種以上を混合して使用することができる。また、溶剤とモノマーを混合して使用することもできる。溶剤を使用する場合は、硬化温度や硬化時間ならびに塗布作業条件に合わせ、適当な沸点の溶剤を選ぶ必要がある。   The (C) organic solvent or monomer used in the present invention is for diluting the conductive paint according to the present invention, and can adjust and improve the coating work viscosity. Specific examples of the solvent include dioxane, hexane, toluene, methyl cellosolve, cyclohexanone, cyclopentanone, butyl cellosolve, butyl cellosolve acetate, butyl carbitol acetate, diethylene glycol diethyl ether, N-methylpyrrolidone, dimethylformamide, dimethylacetamide and the like. These may be used alone or in combination of two or more. As monomers, N-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, cresyl glycidyl ether, p-sec-butylphenyl glycidyl ether, glycidyl methacrylate, t-butylphenyl Glycidyl ether, diglycidyl ether, (poly) ethylene glycol diglycidyl ether, (poly) propylene glycol diglycidyl ether, butanediol diglycidyl ether, trimethylolpropane triglycidyl ether, 1,6-hexanediol diglycidyl ether, etc. These can be used alone or in admixture of two or more. Moreover, a solvent and a monomer can be mixed and used. When a solvent is used, it is necessary to select a solvent having an appropriate boiling point in accordance with the curing temperature, curing time, and application work conditions.

本発明に用いる(D)スルホニウム塩としては、加熱によりカチオンあるいはルイス酸を生成し、カチオノイド重合(陽イオン重合)によってエポキシ基同士を開環結合させる。スルホニウム塩の配合割合は、脂環式エポキシ樹脂100重量部に対して0.1〜10重量部とすることが望ましい。スルホニウム塩が脂環式エポキシ樹脂100重量部に対して0.1重量部未満の場合には、硬化が進行せず、強固な塗膜を形成することができない。また、スルホニウム塩が脂環式エポキシ樹脂100重量部に対して10重量部を超えた場合には導電性塗料の硬化により精製した塗膜中にルイス酸が残留するため、高湿条件下におけるコンデンサの電気的特性が劣化したり、金属薄版やアルミ等からなる陰極リードフレームを腐食する傾向がある。   As the (D) sulfonium salt used in the present invention, a cation or a Lewis acid is generated by heating, and the epoxy groups are ring-opened by cation polymerization (cation polymerization). The blending ratio of the sulfonium salt is desirably 0.1 to 10 parts by weight with respect to 100 parts by weight of the alicyclic epoxy resin. When the sulfonium salt is less than 0.1 part by weight relative to 100 parts by weight of the alicyclic epoxy resin, curing does not proceed and a strong coating film cannot be formed. In addition, when the sulfonium salt exceeds 10 parts by weight with respect to 100 parts by weight of the alicyclic epoxy resin, Lewis acid remains in the coating film purified by curing of the conductive paint. There is a tendency for the electrical characteristics of the metal to deteriorate or to corrode the cathode lead frame made of a thin metal plate or aluminum.

本発明にかかる導電性塗料は、上述した(A)導電性充填剤、(B)脂環式エポキシ樹脂、(C)有機溶剤またはモノマーおよび(D)スルホニウム塩を常法に従い、十分に混合した後、さらにディスパース、ニーダ、三本ロールミル等により混練処理を行い、その後減圧脱泡することにより容易に得ることができる。また、本発明にかかる導電性塗料を硬化するにあたっては、通常高温槽により100℃〜200℃で5min〜45minの間加熱することにより容易に実施される。   In the conductive paint according to the present invention, the above-mentioned (A) conductive filler, (B) alicyclic epoxy resin, (C) organic solvent or monomer, and (D) sulfonium salt were sufficiently mixed according to a conventional method. Thereafter, it can be easily obtained by further kneading with a disperser, a kneader, a three-roll mill or the like and then degassing under reduced pressure. Moreover, when hardening the electroconductive coating material concerning this invention, it is easily implemented by heating for 5 minutes-45 minutes by 100 degreeC-200 degreeC normally with a high temperature tank.

次に、本発明を実施例によって具体的に説明するが、本発明はこれらの実施例によって限定されるものではない。以下の実施例および比較例において「部」とは特に説明のない限り「重量部」を意味する。   EXAMPLES Next, although an Example demonstrates this invention concretely, this invention is not limited by these Examples. In the following examples and comparative examples, “parts” means “parts by weight” unless otherwise specified.

脂環式エポキシ樹脂セロキサイド2021P(ダイセル化学工業社製、商品名)110部、有機溶剤としてシクロヘキサノン370部、スルホニウム塩としてサンエイドSI−80L(三新化学工業社製、商品名)2部および銀粉末640部を十分に混合した後、さらにディスパースにより混練処理を行い、減圧脱泡して導電性塗料を製造した。   110 parts of alicyclic epoxy resin ceroxide 2021P (trade name, manufactured by Daicel Chemical Industries, Ltd.), 370 parts of cyclohexanone as an organic solvent, 2 parts of Sun-Aid SI-80L (trade name, manufactured by Sanshin Chemical Industry Co., Ltd.) as a sulfonium salt, and silver powder After thoroughly mixing 640 parts, the mixture was further kneaded with disperse and degassed under reduced pressure to produce a conductive paint.

脂環式エポキシ樹脂セロキサイド2083(ダイセル化学工業社製、商品名)110部、有機溶剤としてシクロペンタノン370部、スルホニウム塩としてサンエイドSI−60L(三新化学工業社製、商品名)1部および銀粉末640部を十分に混合した後、さらにディスパースにより混練処理を行い、減圧脱泡して導電性塗料を製造した。   110 parts of alicyclic epoxy resin ceroxide 2083 (trade name, manufactured by Daicel Chemical Industries, Ltd.), 370 parts of cyclopentanone as an organic solvent, 1 part of Sun-Aid SI-60L (trade name, manufactured by Sanshin Chemical Industries, Ltd.) as a sulfonium salt, and After thoroughly mixing 640 parts of silver powder, the mixture was further kneaded with a disperse and degassed under reduced pressure to produce a conductive paint.

比較例1Comparative Example 1

エポキシ樹脂のエピコート1004(ジャパンエポキシレジン株式会社製、商品名)24部、フェノール樹脂のマルカリンカーM6部、有機溶剤としてブチルセロソルブアセテート120部、銀粉末170部を加熱フラスコ中で溶解混合した後、さらにディスパースにより混練処理を行い、減圧脱泡して導電性塗料を製造した。   Epoxy resin Epicoat 1004 (Japan Epoxy Resin Co., Ltd., trade name) 24 parts, phenol resin Marcalinker M6 parts, organic solvent 120 parts butyl cellosolve acetate and silver powder 170 parts in a heated flask, A kneading process was performed with a disperse, and degassed under reduced pressure to produce a conductive paint.

比較例2Comparative Example 2

ポリアミドイミド樹脂のHR−13NX(東洋紡績株式会社製、商品名)100部、N−メチルピロリドン150部、銀粉末180部を十分に混合した後、さらにディスパースにより混練処理を行い、減圧脱泡して導電性塗料を製造した。 実施例1〜2および比較例1〜2で得た導電性塗料を以下に示す方法により各種性能を評価した。   After thoroughly mixing 100 parts of polyamideimide resin HR-13NX (trade name, manufactured by Toyobo Co., Ltd.), 150 parts of N-methylpyrrolidone and 180 parts of silver powder, the mixture is further kneaded with a disperse and degassed under reduced pressure. Thus, a conductive paint was produced. Various performances of the conductive paints obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were evaluated by the following methods.

・膜厚:5mm角の立方体に導電性塗料をディップ塗布した。硬化後、断面を電子顕微鏡で観察し、面部と角部の膜厚を測定した。 Film thickness: A conductive paint was dip coated on a 5 mm square cube. After curing, the cross section was observed with an electron microscope, and the film thickness at the face and corners was measured.

・体積抵抗率:スライドガラス上に塗料を幅4mm、厚さ10μmに塗布し、硬化後体積抵抗率を測定した。 Volume resistivity: A paint was applied on a slide glass to a width of 4 mm and a thickness of 10 μm, and the volume resistivity was measured after curing.

・接着強度:銀メッキの施してある銅フレームに導電性塗料を塗布し、2mm角のシリコンチップをマウントして、硬化後剪断方向の強度を測定した。 Adhesive strength: A conductive paint was applied to a silver-plated copper frame, a 2 mm square silicon chip was mounted, and the strength in the shear direction was measured after curing.

以上の評価結果を表1に示したが、いずれも本発明が優れており、本発明の効果が認られた。

Figure 2005082636
Figure 2005082636
*1:測定周波数は1.0kHz、
*2:測定信号レベルは1.0V、
表1、2から明らかなように比較例1では、バインダー樹脂として従来のエポキシ−フェノール硬化系を用いているため、塗膜の厚さに大きなバラツキがある。比較例2では、バインダー樹脂としてポリアミドイミド樹脂を用いているため、体積抵抗率が高く、接着強度が低い。これに対し、本発明の導電性塗料は、レベリング性、導電性に優れており、塗膜強度が高い。この導電性塗料を固体電解コンデンサの陰極形成に使用することにより、電気的、物理的な接合信頼性の向上が望める。 The above evaluation results are shown in Table 1. The present invention is excellent in all cases, and the effect of the present invention was confirmed.
Figure 2005082636
Figure 2005082636
* 1: Measurement frequency is 1.0 kHz.
* 2: Measurement signal level is 1.0V.
As is clear from Tables 1 and 2, in Comparative Example 1, since the conventional epoxy-phenol curing system is used as the binder resin, the thickness of the coating film varies greatly. In Comparative Example 2, since a polyamideimide resin is used as the binder resin, the volume resistivity is high and the adhesive strength is low. On the other hand, the conductive paint of the present invention is excellent in leveling properties and conductivity, and has high coating strength. By using this conductive paint for forming the cathode of the solid electrolytic capacitor, it is possible to improve the electrical and physical bonding reliability.

Claims (2)

(A)導電性充填剤、(B)脂環式エポキシ樹脂、(C)有機溶剤またはモノマーおよび(D)下記一般式化1に示すスルホニウム塩
Figure 2005082636

を必須成分とし且つ、(A)導電性充填剤を(導電性充填剤/(樹脂の固形分+導電性充填剤))の比率で60〜85重量%、(D)スルホニウム塩を(B)脂環式エポキシ樹脂100重量部に対し0.1〜10重量部含有することを特徴とする導電性塗料。
(A) a conductive filler, (B) an alicyclic epoxy resin, (C) an organic solvent or monomer, and (D) a sulfonium salt represented by the following general formula 1
Figure 2005082636

And (A) conductive filler in a ratio of (conductive filler / (resin solid content + conductive filler)) of 60 to 85% by weight, (D) sulfonium salt (B) A conductive paint containing 0.1 to 10 parts by weight with respect to 100 parts by weight of an alicyclic epoxy resin.
請求項1記載の導電性塗料を用いて陰極層又は導電性接着剤層あるいはその両方に形成されてなることを特徴とする固体電解コンデンサ。 A solid electrolytic capacitor formed by using the conductive paint according to claim 1 on a cathode layer, a conductive adhesive layer, or both.
JP2003313420A 2003-09-05 2003-09-05 Electrically conductive coating and solid electrolytic capacitor Pending JP2005082636A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339182A (en) * 2005-05-31 2006-12-14 Nichicon Corp Solid electrolytic capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339182A (en) * 2005-05-31 2006-12-14 Nichicon Corp Solid electrolytic capacitor

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