JPH0437016A - A solid electrolytic capacitor - Google Patents
A solid electrolytic capacitorInfo
- Publication number
- JPH0437016A JPH0437016A JP14136390A JP14136390A JPH0437016A JP H0437016 A JPH0437016 A JP H0437016A JP 14136390 A JP14136390 A JP 14136390A JP 14136390 A JP14136390 A JP 14136390A JP H0437016 A JPH0437016 A JP H0437016A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electrolytic capacitor
- solid electrolytic
- layer
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 24
- 239000007787 solid Substances 0.000 title claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000002904 solvent Substances 0.000 claims abstract description 12
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 abstract description 6
- 235000019439 ethyl acetate Nutrition 0.000 abstract 1
- 230000002101 lytic effect Effects 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 description 6
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 5
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 5
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 5
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910015900 BF3 Inorganic materials 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- -1 boron trifluoride amine Chemical class 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229940113088 dimethylacetamide Drugs 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N para-hydroxystyrene Natural products OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
〈産業上の利用分野）
本発明は、外装に樹脂を用いた、電気特性の優れた固体
電解コンデンサに関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] <Industrial Application Fields> The present invention relates to a solid electrolytic capacitor with excellent electrical characteristics, which uses a resin for the exterior.
（従来の技術）
本発明が関連する固体電解コンデンサは、第１図に示し
たようにタンタル、アルミニウム、ニオブ等の弁作用を
有する金属からなる陽極体１を化成処理し、誘電体層２
を形成した後、さらにその表面に半導体層３、陰極層４
を形成するとともに陰極層４を外部リードフレーム５に
導電性接着剤６を用いて接着固定し、ｉ極層１に通じて
いる陽極体リード７を陽極外部リード８に半田９で接合
させ、さらにその外周面を外装樹脂１０により外装して
構成されている。(Prior Art) As shown in FIG. 1, a solid electrolytic capacitor to which the present invention relates has an anode body 1 made of a valve metal such as tantalum, aluminum, niobium, etc. subjected to a chemical conversion treatment, and a dielectric layer 2
After forming, a semiconductor layer 3 and a cathode layer 4 are further formed on the surface.
At the same time, the cathode layer 4 is adhesively fixed to the external lead frame 5 using a conductive adhesive 6, the anode body lead 7 communicating with the i-electrode layer 1 is joined to the anode external lead 8 with solder 9, and The outer peripheral surface thereof is covered with a covering resin 10.
（発明か解決しようとする課Ｍ）
しかし、従来、陰極層は通常の導電性ペーストを使用し
て形成され、＃に極層の導電性ペーストの性能により固
体電解コンデンサの耐湿後の電気特性か劣化する欠点か
あった。(Invention or Problem M) However, conventionally, the cathode layer is formed using a normal conductive paste, and the electrical properties of the solid electrolytic capacitor after moisture resistance are affected by the performance of the conductive paste of the electrode layer. There was a drawback that it deteriorated.
本発明は、上記の欠点を解消するためになされたもので
、耐湿後の電気特性に優れた固体電解コンデンサを捉供
しようとするしのである。The present invention has been made to eliminate the above-mentioned drawbacks, and is intended to provide a solid electrolytic capacitor that has excellent electrical characteristics after being resistant to moisture.
［発明の構成］
（課題を解決するための手段）
本発明者らは、上記の目的を達成しようと鋭意研究を重
ねた結果、後述する組成の導電性ペーストを用いること
によって接着性に優れた陰極層が形成され、耐湿後の電
気特性が劣化しにくい固体電解コンデンサが得られるこ
とを見いだし、本発明を完成したものである。[Structure of the Invention] (Means for Solving the Problems) As a result of intensive research aimed at achieving the above object, the present inventors have developed a method with excellent adhesive properties by using a conductive paste having the composition described below. The present invention was completed based on the discovery that a solid electrolytic capacitor in which a cathode layer is formed and whose electrical characteristics do not easily deteriorate after moisture resistance can be obtained.
すなわち、本発明は、
弁作用を有する金属からなる陽極体に、誘電体層、半導
体層、陰極層を順次形成し、ｍ脂を用いて外装する固体
電解コンデンサにおいて、陰極層が（Ａ）ポリパラヒド
ロキシスチレン樹脂とエポキシ樹脂からなる変性！！ｌ
Ｉ脂、
（Ｂ）導電性粉末および微細シリカ系粉末、（Ｃ）＃酸
エステル系溶剤
を必須成分とする導電性ペーストで形成されてなること
を特徴とする固体電解コンデンサである。That is, the present invention provides a solid electrolytic capacitor in which a dielectric layer, a semiconductor layer, and a cathode layer are sequentially formed on an anode body made of a metal having a valve action, and the cathode layer is coated with (A) polyester. Modified consisting of parahydroxystyrene resin and epoxy resin! ! l
This solid electrolytic capacitor is characterized in that it is formed of a conductive paste whose essential components are (B) conductive powder and fine silica powder, and (C) #acid ester solvent.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明に用いる＜Ａ）ポリパラヒドロキシスチレン樹脂
とエポキシ樹脂からなる変性樹脂としては、ポリパラヒ
ドロキシスチレン樹脂とエポキシ樹脂を単に溶解混合し
てもよいし、必要であれば加熱反応により相互に部分的
に結合させたものでもよく、これらの成分樹脂の共通の
溶剤に溶解することにより作業粘度を改善することがで
きる。<A) Modified resin consisting of polyparahydroxystyrene resin and epoxy resin used in the present invention may be obtained by simply dissolving and mixing the polyparahydroxystyrene resin and the epoxy resin, or if necessary, mutually partially forming the polyparahydroxystyrene resin and the epoxy resin by heating reaction. The working viscosity can be improved by dissolving these component resins in a common solvent.
また、反応に必要であれば硬化触媒を使用することもで
きる。Moreover, a curing catalyst can also be used if necessary for the reaction.
ここで使用するポリパラヒドロキシスチレン樹脂は次式
で示される樹脂である
（但し、式中ｎは２５〜９０の整数を表す）このような
樹脂として、例えばマルカリン力−Ｍ（光害石油化学社
製、商品名）等かあり、その分子量が３０００〜８００
０で水酸基当量が約１２０のものである。 また、変性
樹脂に用いるエポキシ樹脂としては、工業生産されてお
り、かつ本発明に効果的に使用し得るものとして、次の
ようなビスフェノール謬のジエボキシドかある。 エピ
コート８２７，８２８，８３４，１００１，１００２゜
１００７．１００９ ＜シェル化学社製、商品名）、Ｄ
ＥＲ３３０，３３１，３３２，３３４，３３５３３６，
３３７，６６０＜ダウケミカル社製、商品名）、アラル
ダイトＧＹ２５０，２６０゜２８０．６０７１，６０８
４，６０９７゜６０９９ （チバガイギー社製、商品名
）、ＥＰＩ−ＲＥＺ５１０，５１０１（ＪＯＮＥ Ｄ
ＡＢＮＥＹ社製、商品名）、エビクロン８１ｏ。The polyparahydroxystyrene resin used here is a resin represented by the following formula (in the formula, n represents an integer of 25 to 90). (product name), etc., and its molecular weight is 3000 to 800.
0 and the hydroxyl equivalent is about 120. Further, as the epoxy resin used for the modified resin, there are the following bisphenol dieboxides, which are industrially produced and can be effectively used in the present invention. Epicote 827, 828, 834, 1001, 1002゜1007.1009 <Shell Chemical Co., Ltd., trade name), D
ER330, 331, 332, 334, 335336,
337,660<manufactured by Dow Chemical Company, trade name), Araldite GY250,260°280.6071,608
4,6097゜6099 (manufactured by Ciba Geigy, product name), EPI-REZ510,5101 (JONE D
Manufactured by ABNEY, product name), Ebikuron 81o.
１０００．１０１０．３０１０ （大日本インキ化学工
業社製、商品名）、ＥＰシリーズ（地雷化社製、商品名
）がある、 さらに平均エポキシ基数３以上の、例えば
ノボラックエポキシｍ脂を使用することにより熱時（３
５０℃）の接着強度を更に向上させることができる。
これらのノボラックエポキシ樹脂として分子量５００以
上のものが適している。 このようなノボラックエポキ
シ樹脂で工業生産されているものとしては、例えば次の
ようなものかある６ アラルダイトＥＰＮＩ １３８゜
１１３９、ＥＣＮ１２７３，１２８０．１２９９（チバ
ガイギー社製、商品名）、ＤＥＮ４３１゜４３８（ダウ
ケミカル社製、商品名）、エピコート１５２．１５４
（シェル化学社製、商品名）、ＥＲＲ，−０１００、Ｅ
ＲＲＢ−０４４７、ＥＲＬＢ−０４８８＜ユニオンカー
バイド社製、商品名）、ＥＯＣＮシリース（日本化薬社
製、商品名）等があり、これらのエポキシ樹脂は、単独
又は２種以上混合して使用することができる。1000.1010.3010 (manufactured by Dainippon Ink & Chemicals Co., Ltd., trade name) and EP series (manufactured by Jinmineka Co., Ltd., trade name). Furthermore, by using an average number of epoxy groups of 3 or more, for example, novolac epoxy M resin. During heat (3
50° C.) can be further improved.
As these novolak epoxy resins, those having a molecular weight of 500 or more are suitable. Examples of industrially produced novolak epoxy resins include the following: 6 Araldite EPNI 138°1139, ECN1273, 1280.1299 (manufactured by Ciba Geigy, trade name), and DEN431°438 (product name). Manufactured by Chemical Co., Ltd., product name), Epicoat 152.154
(manufactured by Shell Chemical Co., Ltd., trade name), ERR, -0100, E
There are RRB-0447, ERLB-0488 <manufactured by Union Carbide Co., Ltd., trade name), EOCN series (manufactured by Nippon Kayaku Co., Ltd., trade name), etc., and these epoxy resins can be used alone or in combination of two or more types. I can do it.
ポリパラしトロキシスチレン樹脂とエポキシ樹脂からな
る変性樹脂は次の溶剤で溶解混合させることが望ましい
、 ここで使用できる溶剤類としては、ジオキサン、ヘ
キサン、ベンゼン、トルエン、ソルベントナフサ、工業
用カッリン、酢酸セロソルブ、エチルセロソルブ、ブチ
ルセロソルブ、ブチルセロソルブアセテート、ブチルカ
ルピトールアセテート、ジエチレングリコールジエチル
エーテル、ジメチルホルムアミド、ジメチルアセトアミ
ド、Ｎ−メチルピロリドン等が挙げられ、これらは単独
又は２種以上混合して使用される。It is preferable to dissolve and mix the modified resin consisting of polyparalyzed troxystyrene resin and epoxy resin in the following solvents. Solvents that can be used here include dioxane, hexane, benzene, toluene, solvent naphtha, industrial kaline, and acetic acid. Examples include cellosolve, ethyl cellosolve, butyl cellosolve, butyl cellosolve acetate, butyl carpitol acetate, diethylene glycol diethyl ether, dimethyl formamide, dimethyl acetamide, N-methyl pyrrolidone, and the like, and these may be used alone or in combination of two or more.
本発明に用いる（Ｂ）導電性粉末および微細シリカ系粉
末としては、導電性粉末と微細シリカ粉末とを併用する
ものである。 導電性粉末としては銀粉末、銀メツキ銅
粉末、銅粉末、ニッケル粉末、カーボン等が使用される
。 また微細シリカ粉末としては、例えばアエロシール
（日本アエロシール社製、商品名）等が挙げられ、粒径
１μｍ以下のものが好ましい。As the conductive powder and fine silica powder (B) used in the present invention, a conductive powder and fine silica powder are used in combination. As the conductive powder, silver powder, silver-plated copper powder, copper powder, nickel powder, carbon, etc. are used. Further, examples of the fine silica powder include Aeroseal (manufactured by Nippon Aeroseal Co., Ltd., trade name), and those having a particle size of 1 μm or less are preferable.
本発明に用いる（Ｃ）＃酸エステル系溶剤としては、例
えば酢酸メチル、酢酸エチル、酢酸ブチル、酢酸イソプ
ロピル、酢酸イソアミル等が挙げられ、これらは単独又
は２種以上混合して使用することができる。 酢酸エス
テル系溶剤は導電性ペーストの溶剤の一成分として使用
される。Examples of the (C) # acid ester solvent used in the present invention include methyl acetate, ethyl acetate, butyl acetate, isopropyl acetate, isoamyl acetate, etc., and these can be used alone or in a mixture of two or more. . The acetate-based solvent is used as a component of the solvent of the conductive paste.
本発明に用いる導電性ペーストは、ポリバラヒドロキシ
スチレン樹脂とエポキシ樹脂からなる変性樹脂、導電性
粉末および微結シリカ系粉末、酢酸エステル系溶剤を必
須成分とするか、本発明の目的に反しない範囲において
、また必要に応じて、消泡側、その他の添加剤を添加配
合することができる。The conductive paste used in the present invention contains a modified resin consisting of polyvara hydroxystyrene resin and epoxy resin, a conductive powder, a finely divided silica powder, and an acetate solvent as essential components, or does not contradict the purpose of the present invention. Anti-foaming agents and other additives may be added within the range and as necessary.
これらの各成分を常法に従い十分混合した後、さらに例
えば３本ロールにより混線処理し、その後減圧脱泡して
酢酸エステル系溶剤で希釈し、固体電解コンデンサ素子
をディッピングし陰極層を形成する。 その後、導電性
接着剤で陰極層とリードフレームを接合した後、陽極体
リードを半田付けし、モールド成形法やデイツプ法によ
り樹脂で外装被覆して固体電解コンデンサを製造するこ
とができる。After thoroughly mixing these components in accordance with a conventional method, the mixture is further subjected to a cross-wire treatment using, for example, three rolls, and then degassed under reduced pressure and diluted with an acetate-based solvent, and the solid electrolytic capacitor element is dipped to form a cathode layer. Thereafter, after bonding the cathode layer and lead frame with a conductive adhesive, the anode body lead is soldered, and the exterior is coated with resin by a molding method or a dip method to manufacture a solid electrolytic capacitor.
（作用）
本発明の固体電解コンデンサは、ポリバラヒドロキシス
チレン樹脂とエポキシ樹脂からなる変性樹脂を用いるこ
とによって、接着性の優れた陰極層が形成でき、また耐
湿後の電気特性を優れたものとすることができた。(Function) The solid electrolytic capacitor of the present invention can form a cathode layer with excellent adhesiveness by using a modified resin consisting of polyvara hydroxystyrene resin and epoxy resin, and also has excellent electrical properties after moisture resistance. We were able to.
（実施例）
次に本発明を実施例によって説明するか、本発明はこれ
らの実施例によって限定されるものではない。 以下の
実施例および比較例において「部」とは特に説明のない
限り「重１部」を意味する。(Examples) Next, the present invention will be explained by examples, but the present invention is not limited by these examples. In the following Examples and Comparative Examples, "part" means "1 part by weight" unless otherwise specified.
実施例 １
エポキシ樹脂のエピコート１００１（シェル化学社製、
商品名） ３７．５部、ポリバラヒドロキシスチレン樹
脂のマルカリン力−Ｍ（光害石油化学社製、商品名）１
０部をジエチレングリコールジエチルエーテル１０３部
中で１００℃、１時間溶解反応させて、粘稠な樹脂を得
た。 この樹脂２２部に触媒として三フッ化ホウ素のア
ミン錯体１．０部、添加剤０．０３部、銀粉末５７部、
アエロシール＃２００（日本アエロシール社製、商品名
）２．０部、および酢酸ブチル５０部を混合して導電性
ペーストを製造した。Example 1 Epoxy resin Epicoat 1001 (manufactured by Shell Chemical Co., Ltd.)
Product name) 37.5 parts, Marcarinic power of polyvara hydroxystyrene resin-M (manufactured by Kokoku Petrochemical Co., Ltd., product name) 1
0 part was dissolved and reacted in 103 parts of diethylene glycol diethyl ether at 100°C for 1 hour to obtain a viscous resin. To 22 parts of this resin, 1.0 part of boron trifluoride amine complex as a catalyst, 0.03 part of additive, 57 parts of silver powder,
A conductive paste was prepared by mixing 2.0 parts of Aeroseal #200 (manufactured by Nippon Aeroseal Co., Ltd., trade name) and 50 parts of butyl acetate.
実施例 ２
エポキシ樹脂のエピコート８２８（シェル化学社製、商
品名） １５．８部、ポリバラヒドロキシスチレン樹脂
のマルカリン力−Ｍ（丸前石油化学社製、商品名）１０
部を、ブチルセロソルブアセテート５６部中で１００℃
、１時間溶解反応させて、粘稠な樹脂を得た。 この樹
脂２２部に、触媒として三フッ化ホウ素のアミン錯体１
．０部、銀粉末５７部、アエロシール＃２００ （前出
）２．５部、および酢酸ブチル５０部を混合して導電性
ペーストを製造した。Example 2 Epoxy resin Epikote 828 (manufactured by Shell Chemical Co., Ltd., trade name) 15.8 parts, polyvara hydroxystyrene resin Marcarin Power-M (manufactured by Marumae Petrochemical Co., Ltd., trade name) 10
parts in 56 parts of butyl cellosolve acetate at 100°C.
A viscous resin was obtained by dissolving and reacting for 1 hour. To 22 parts of this resin, 1 part of an amine complex of boron trifluoride was added as a catalyst.
．． 0 parts, 57 parts of silver powder, 2.5 parts of Aeroseal #200 (mentioned above), and 50 parts of butyl acetate to prepare a conductive paste.
実施例 ３
エポキシ樹脂ＥＯＣＮ１０３Ｓ（日本化薬社製、商品名
）６６部、ポリバラヒドロキシスチレン樹脂のマルカリ
ン力−Ｍ（前出）３４部をブチルカルピトールアセテー
ト １１７部中で１００°Ｃ１１時間溶解反応させて、
粘稠な樹脂を得た。 この樹脂２２部に、触媒として三
フッ化ホウ素のアミン錯体１．０部、銀粉末５７部、ア
エロシール＃２００ （前出）２．０部、および酢酸ブ
チル５０部を混合して導電性ペーストを製造した。Example 3 66 parts of epoxy resin EOCN103S (manufactured by Nippon Kayaku Co., Ltd., trade name) and 34 parts of polyvara hydroxystyrene resin Marcarin Power-M (described above) were dissolved and reacted in 117 parts of butyl carpitol acetate at 100°C for 11 hours. Let me,
A viscous resin was obtained. 22 parts of this resin are mixed with 1.0 part of an amine complex of boron trifluoride as a catalyst, 57 parts of silver powder, 2.0 parts of Aeroseal #200 (mentioned above), and 50 parts of butyl acetate to form a conductive paste. was manufactured.
比較例
市販のエポキシ樹脂ベースの溶剤型半導体用導電性ペー
ストを入手した。 実施例１〜３及び比較例で得た導電
性ペーストを用いて、その中に固体電解コンデンサをデ
ィッピング処理して陰極層を形成し、その後リードフレ
ームと陰極層を接合し、モールド成形法によって樹脂で
外装被覆して、固体電解コンデンサを製造した。 こう
して得られた固体電解コンデンサの接着強度、耐湿電流
リークの試験を行った。 その結果を第１表に示したが
、いずれも本発明が優れており本発明の効果が確認され
た。Comparative Example A commercially available epoxy resin-based solvent-based conductive paste for semiconductors was obtained. Using the conductive pastes obtained in Examples 1 to 3 and Comparative Examples, a solid electrolytic capacitor was dipped into the conductive paste to form a cathode layer, the lead frame and the cathode layer were then bonded, and a resin was molded using a molding method. A solid electrolytic capacitor was manufactured by covering the exterior with a solid electrolytic capacitor. The solid electrolytic capacitor thus obtained was tested for adhesive strength and moisture resistance and current leakage. The results are shown in Table 1, and the present invention was superior in all cases, confirming the effects of the present invention.
第１表
（単位）
「発明の効果］
以上の説明及び第１表から明らかなように、本発明の固
体電解コンデンサは、接着性、耐湿後の電気特性に優れ
ており、樹脂で外装したものであっても、電気特性の低
下はわずかなものであった。Table 1 (Units) "Effects of the Invention" As is clear from the above explanation and Table 1, the solid electrolytic capacitor of the present invention has excellent adhesive properties and electrical properties after moisture resistance, and the solid electrolytic capacitor coated with resin Even so, the deterioration in electrical properties was slight.
第１図は本発明が関連する固体電解コンデンサの説明用
断面図である。
１・・・陽極体、 ２・・・誘電体層、 ３・・・半導
体層、４・・・＃ｉ極層、 ５・・・陰極リードフレ
ーム、 ６・・・導電性接着剤、 ７・・・陽極体リー
ド、 ８・・・陽極外部リード、 ９・・・半田、 １
０・・・外装樹脂。
パ９ゝ
し、２５℃の温度でテンションゲージを用いて測定した
。FIG. 1 is an explanatory cross-sectional view of a solid electrolytic capacitor to which the present invention relates. DESCRIPTION OF SYMBOLS 1... Anode body, 2... Dielectric layer, 3... Semiconductor layer, 4... #i electrode layer, 5... Cathode lead frame, 6... Conductive adhesive, 7. ...Anode body lead, 8...Anode external lead, 9...Solder, 1
0...Exterior resin. The temperature was measured using a tension gauge at a temperature of 25°C.
Claims (1)
半導体層、陰極層を順次形成し、樹脂を用いて外装する
固体電解コンデンサにおいて、陰極層が （Ａ）ポリパラヒドロキシスチレン樹脂とエポキシ樹脂
からなる変性樹脂、 （Ｂ）導電性粉末および微細シリカ系粉末、（Ｃ）酢酸
エステル系溶剤 を必須成分とする導電性ペーストで形成されてなること
を特徴とする固体電解コンデンサ。[Claims] 1. An anode body made of a metal having a valve action, a dielectric layer,
In a solid electrolytic capacitor in which a semiconductor layer and a cathode layer are sequentially formed and then packaged with a resin, the cathode layer is made of (A) a modified resin made of polyparahydroxystyrene resin and an epoxy resin, (B) conductive powder and fine silica. A solid electrolytic capacitor formed of a conductive paste containing powder and (C) an acetate-based solvent as an essential component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14136390A JPH0437016A (en) | 1990-06-01 | 1990-06-01 | A solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14136390A JPH0437016A (en) | 1990-06-01 | 1990-06-01 | A solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0437016A true JPH0437016A (en) | 1992-02-07 |
Family
ID=15290241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14136390A Pending JPH0437016A (en) | 1990-06-01 | 1990-06-01 | A solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0437016A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7487615B2 (en) | 2004-02-04 | 2009-02-10 | Honda Motor Co., Ltd. | Run channel structure |
-
1990
- 1990-06-01 JP JP14136390A patent/JPH0437016A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7487615B2 (en) | 2004-02-04 | 2009-02-10 | Honda Motor Co., Ltd. | Run channel structure |
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