JPH0436947A - Electron beam control device - Google Patents

Electron beam control device

Info

Publication number
JPH0436947A
JPH0436947A JP14137390A JP14137390A JPH0436947A JP H0436947 A JPH0436947 A JP H0436947A JP 14137390 A JP14137390 A JP 14137390A JP 14137390 A JP14137390 A JP 14137390A JP H0436947 A JPH0436947 A JP H0436947A
Authority
JP
Japan
Prior art keywords
electron beam
specimen
scanning
dia
current density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14137390A
Other languages
Japanese (ja)
Inventor
Toshiaki Tanaka
俊明 田中
Hisahiro Furuya
寿宏 古屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14137390A priority Critical patent/JPH0436947A/en
Publication of JPH0436947A publication Critical patent/JPH0436947A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To vary the electron flow density on a specimen with the deflection angle of an electron beam by making controllable the current density irradiated on the specimen using the deflection angle of the electron beam. CONSTITUTION:An electron beam generated from an electron gun 1 is converged by a lens system, and a specimen 3 is subjected to X-Y two-dimensional scan by a deflecting coil 2. The electron beam makes circular scan over the specimen 3 by flowing the deflection current sin-waveform to X and cos-waveform to Y in the deflecting coil 2. The deflection angle is varied by changing the deflecting waveform current, and spiral scanning can be made. If within the same period of cycle, the outside dia. scanning speed is greater than the inside dia. scanning speed, so that the current density at the outside dia. drops more than at the inside dia. on the specimen 3. Therefore, this method is not favorable in case the specimen is subjected to surface processing. Now, control of the inside dia. scanning speed V1 and outside dia. scanning speed V2 gives an effect of controlling the current density into a uniform or a desired value, and in this case, it is made practicable by controlling the period of cycle in inside dia. scanning and outside dia. scanning.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子ビーム照射装置に係り、特に電子流密度制
御に好適な電子ビーム制御装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electron beam irradiation device, and more particularly to an electron beam control device suitable for electron flow density control.

〔従来の技術〕[Conventional technology]

従来の装置は、電子ビーム照射装置において、電子ビー
ムの偏向角による試料−4二の電子流密度をコン1〜ロ
ール電子ビーム制御装置は有していない。
In the conventional electron beam irradiation device, the electron beam control device does not have a control device to control the electron flow density of the sample-42 depending on the deflection angle of the electron beam.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

」1記従来技術は電子ビーム照射装置において、電子ビ
ームの偏向角により、試料」〕に照射される電流密度の
コントロール機能は有していないため、渦状走査時等の
試料表面加工精度を上げる必要があった。
1. Conventional technology does not have a function to control the current density irradiated to the sample by adjusting the deflection angle of the electron beam in the electron beam irradiation device, so it is necessary to improve the accuracy of sample surface processing during spiral scanning etc. was there.

本発明の目的は電子ビームの偏向角により、試料上の電
子流密度を変化させる電子ビーム制御装置を附加した電
子ビーム照射装置又は類似装置を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide an electron beam irradiation device or similar device equipped with an electron beam control device that changes the electron flow density on a sample depending on the deflection angle of the electron beam.

〔課題を解決するための手段〕[Means to solve the problem]

」1記目的を達成するために、電子ビームの偏向角によ
り、試料上に照射される電流密度を制御可能にしたもの
である。
In order to achieve the first objective, the current density irradiated onto the sample can be controlled by the deflection angle of the electron beam.

〔作用〕[Effect]

本発明の電子ビーl\制御装置は試料に照射する電子ビ
ームを偏向角により、電子ビームを制御することが出来
るため、試料の表面加二Iニ精度向−にがはかれる。
Since the electron beam control device of the present invention can control the electron beam irradiated onto the sample by changing the deflection angle, it is possible to improve the accuracy of surface machining of the sample.

〔実施例〕〔Example〕

以下、実施例の構成及び動作の説明しする。 The configuration and operation of the embodiment will be explained below.

第1図の構成図は電子銃1より発生した電子ビームをレ
ンズ系で絞り、偏向コイル2により、試料23−ヒをX
、、Y2次元スキャンを行う。偏向コイル2に第2図の
偏向電流sin波形をXに、cos波形をYに流すこと
により、電子ビームは試料3上を円径状に走査する。偏
向波形電流を変化させることにより偏向角が変わり、第
3図のように渦状に走査させることが出来る。
The configuration diagram in FIG.
, , Y2D scan is performed. By passing a deflection current sine waveform in the X direction and cosine waveform in the Y direction as shown in FIG. 2 through the deflection coil 2, the electron beam scans the sample 3 in a circular pattern. By changing the deflection waveform current, the deflection angle is changed, and it is possible to scan in a spiral shape as shown in FIG.

電子ビームが試料3−」二を渦状に走査させると、同−
周期内であると内径走査速度より、久径走査速度の場合
より速いため、試料3」−の内径より外径の方が電流密
度が低下する。したがって試料表面加工する場合この方
法では不都合である。
When the electron beam scans the sample 3-'2 in a spiral, the same
Within the period, the inner diameter scanning speed is faster than the long diameter scanning speed, so the current density is lower at the outer diameter than at the inner diameter of sample 3''. Therefore, this method is inconvenient when processing the surface of a sample.

本発明節]案は第3図より内径走査速度Vl。The present invention section] plan is based on the inner diameter scanning speed Vl from FIG.

外径走査速度v2を制御することにより電d石密度を均
一または希望値にコントロールする効果がある。この場
合は第2図のsjn、 cos波形の内径走査。
By controlling the outer diameter scanning speed v2, there is an effect of controlling the electrolyte density to be uniform or a desired value. In this case, it is the inner diameter scan of the sjn and cos waveforms in Figure 2.

外径走査時の周期を制御することで可能どなる。This becomes possible by controlling the period during outer diameter scanning.

発明の第2案は第4図の如く、電子ビームを内径。The second invention, as shown in Figure 4, uses an electron beam with an inner diameter.

外径走査回数をN1回、N2回と走査させることにより
電流密度をコン1〜ロールする効果がある。
By scanning the outer diameter N1 times and N2 times, there is an effect of controlling the current density from 1 to 1.

この場合は第2図のsjn、 cos波形の内径走査、
外径走査時の周期を同一にして、繰返し回数を制御する
ことで可能となる。
In this case, the inner diameter scan of the sjn and cos waveforms in Fig. 2,
This is possible by making the period during outer diameter scanning the same and controlling the number of repetitions.

発明の第3案は第1図のビームブランキングプレー1−
〇の動作により、電子ビームを第6図の如くスポラ1〜
にして、間隔Ls、、L2を制御することにより、電流
密度をコント効果がある。この場合はsin、 cos
波形の内径走査、外径走査の周期を同一にして、ビーム
ブランキングにより内径走査時。
The third invention is the beam blanking play 1- in Fig. 1.
By the operation of 〇, the electron beam is moved to spora 1~ as shown in Figure 6.
By controlling the intervals Ls, , L2, there is an effect of controlling the current density. In this case sin, cos
When scanning the inner diameter using beam blanking, the waveform's inner diameter scanning and outer diameter scanning cycles are the same.

外径走査時の導通時間第5図の如く制御することで可能
となる。第7図は第1..2.3案を持ちいない時の通
常の試料上の電流密度分布図である。
This becomes possible by controlling the conduction time during outer diameter scanning as shown in FIG. Figure 7 is 1. .. 2.3 It is a current density distribution diagram on a normal sample when there is no plan.

したがって内径走査、外径走査時の電流密度を発明節1
.2.3案により、電流密度を制御することに効果があ
る。
Therefore, the current density during inner diameter scanning and outer diameter scanning is
.. Plan 2.3 is effective in controlling the current density.

〔発明の効果〕〔Effect of the invention〕

本発明は、以上説明したように構成されているので以下
に記載されるような効果を奏する。
Since the present invention is configured as described above, it produces the effects described below.

電子ビームを内径走査速度、外径走査速度を走査するこ
とにより試料上の電流密度を制御することが出来る。ま
た電子ビームを内径走査回数と外径走査回数と制御する
ことにより試料上の電流密度を制御することが出来る。
The current density on the sample can be controlled by scanning the electron beam at an inner diameter scanning speed and an outer diameter scanning speed. Furthermore, the current density on the sample can be controlled by controlling the number of times the electron beam is scanned on the inner diameter and the number of times the electron beam is scanned on the outer diameter.

さらに電子ビー11をブランキングを併用してスポット
間隔L1.L2を制御することにより、試料−七の電流
密度を制御することが出来る。
Further, the electronic bee 11 is used in conjunction with blanking to set the spot interval L1. By controlling L2, the current density of sample-7 can be controlled.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の構成図、第2図は偏向コイルに流す電
流波形図、第3図は試料」二の内径、外径を電子ビーム
走査速度を変化させた場合の図、第4図は試料」二の内
径、外径を電子ビー11の走査を複数回走査した場合の
図、第5図はブランキングプレ−1〜パルス電圧波形図
、第6図は試料」二の内径、外径を電子ビームの走査を
ブランキングを併用してスポラ1〜形状にて走査した場
合の図、第7図は通常渦状走査した場合の平均電流密度
を示す図である。 1・・電子銃、2・・・偏向コイル、3・・試料、4・
・・電流増幅器、5・・sjn波形発生器、6・・・電
流増幅器、7・・CO3波形発生器、8・・CPU、9
・・プランキ′背 磯;− × ・ぜ+)−
Figure 1 is a configuration diagram of the present invention, Figure 2 is a waveform diagram of the current flowing through the deflection coil, Figure 3 is a diagram of the inner and outer diameters of the sample when the electron beam scanning speed is changed, and Figure 4 is a diagram of the current waveform flowing through the deflection coil. Figure 5 is a diagram of the pulse voltage waveform from blanking plate 1 to pulse voltage waveform, and Figure 6 is a diagram showing the inner diameter and outer diameter of sample 2 when the electron beam 11 is scanned multiple times. FIG. 7 is a diagram showing the average current density when the diameter is scanned in spora 1 to shape using electron beam scanning and blanking, and FIG. 7 is a diagram showing the average current density when the diameter is scanned in a normal spiral shape. 1. Electron gun, 2. Deflection coil, 3. Sample, 4.
...Current amplifier, 5...SJN waveform generator, 6...Current amplifier, 7...CO3 waveform generator, 8...CPU, 9
・・Planki'back Iso;− × ・ze+)−

Claims (1)

【特許請求の範囲】 1、電子ビーム照射装置において、試料に照射する電子
ビームを偏向角により電子ビームを制御し、電流密度を
可変することを特徴とする電子ビーム制御装置。 2、請求項第1項において、偏向角により偏向速度を制
御して、試料の電流密度を変化させることを特徴とする
電子ビーム制御装置。 3、請求項第1項において電子ビームを複数回重さねる
ことにより、電流密度を制御することを特徴とする電子
ビーム制御装置。 4、請求項第1項においてビームブランキング機能を附
加させ導通時間を制御することにより電子流密度を制御
させることを特徴とする電子ビーム制御装置。
[Scope of Claims] 1. An electron beam control device in an electron beam irradiation device, characterized in that the electron beam irradiated onto a sample is controlled by a deflection angle to vary the current density. 2. The electron beam control device according to claim 1, wherein the deflection speed is controlled by the deflection angle to change the current density of the sample. 3. The electron beam control device according to claim 1, wherein the current density is controlled by overlapping the electron beams a plurality of times. 4. An electron beam control device according to claim 1, characterized in that the electron flow density is controlled by adding a beam blanking function and controlling conduction time.
JP14137390A 1990-06-01 1990-06-01 Electron beam control device Pending JPH0436947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14137390A JPH0436947A (en) 1990-06-01 1990-06-01 Electron beam control device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14137390A JPH0436947A (en) 1990-06-01 1990-06-01 Electron beam control device

Publications (1)

Publication Number Publication Date
JPH0436947A true JPH0436947A (en) 1992-02-06

Family

ID=15290487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14137390A Pending JPH0436947A (en) 1990-06-01 1990-06-01 Electron beam control device

Country Status (1)

Country Link
JP (1) JPH0436947A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407519B1 (en) 1999-06-07 2002-06-18 Matsushita Electric Industrial Co., Ltd. Cathode-ray tube system capable of providing beam spots of a small diameter
JP2011090844A (en) * 2009-10-21 2011-05-06 Jeol Ltd Sample processing method and sample processing device
CN103295862A (en) * 2013-04-25 2013-09-11 兰州空间技术物理研究所 Electromagnetic deflection device for electron beam trajectory control and application thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407519B1 (en) 1999-06-07 2002-06-18 Matsushita Electric Industrial Co., Ltd. Cathode-ray tube system capable of providing beam spots of a small diameter
JP2011090844A (en) * 2009-10-21 2011-05-06 Jeol Ltd Sample processing method and sample processing device
CN103295862A (en) * 2013-04-25 2013-09-11 兰州空间技术物理研究所 Electromagnetic deflection device for electron beam trajectory control and application thereof

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