JPH04364486A - Connecting method of gull lead component to printed circuit board - Google Patents

Abstract

PURPOSE:To conduct inspection on a device-in-use basis under the condition of the electric characteristic being equal to that at the time when a product printed-circuit board is packaged, by connecting temporarily a lead of a gull lead component to an element connecting pad by pressing the lead by a pressing head. CONSTITUTION:After LSI 8 to be inspected is fitted to a pad part of a printed- circuit board 1, a pressing head 6 is lowered by driving a pressure cylinder 24, so as to press a lead 4 of the LSI 8 on a pad 2 of the printed-circuit board 1. While the lead 4 pressed by the head 6 is deformed elastically in the vicinity of the boundary part with the main body of a package by the working of a pressing rubber 5, it absorbs the nonuniformity of the dimension in the direction of the height of the fore end thereof and the degree of flatness of each pad 2 of the printed-circuit board 1 and is connected to the pad 2. Thereafter the operation of the printed-circuit board 1 is checked up on the basis of a test program and the quality of the LSI 8 is evaluated. Then, the LSI 8 is taken out by driving the cylinder 24 upward, and the inspection is ended.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting gull lead components to a printed circuit board.

Generally, in the acceptance inspection of integrated circuit devices such as VLSI, as shown in FIG. 6, an LSI tester 10 is used to evaluate outputs for various inputs. LS due to large scale
Problems such as a decrease in the verification rate of the test program of the I tester 10 and an increase in the test time have been pointed out.

[0003] In addition to this situation, it is difficult to create test programs over time, and it is difficult to secure human resources who can create test programs at the device level. Furthermore, the LSI tester 10 is also becoming more expensive due to faster operating clocks, and in addition, it is necessary to adjust the waveform correction circuit 11 for each contact in order to cancel out the stray capacitance of the socket 12. For testing, it has become necessary to use the same level of technology and investment as the evaluation performed during LSI development, and there is a strong need for a simple LSI testing method.

In FIG. 6, 4 indicates a lead of the LSI 8 to be tested, and 13 indicates a contact of the socket 12.

[0005]

[Prior Art] Under the above circumstances, LSI tester 1
As an alternative to the method of individually testing LSIs using 0, a method as shown in FIG. 7 has been proposed.

In this case, the LSI to be tested 8 is mounted on the final product printed board 1 on which other mounted components 9 other than the LSI 8 to be tested are mounted.
This is a so-called actual machine test in which margins are guaranteed by mounting the board 8 in a socket and varying the voltage/temperature while running a test program for product inspection from the console 14, etc. is configured identically to the final product.

FIGS. 8 and 9 show an example of a socket 12 for mounting an LSI 8 to be tested, and a socket mold having a large number of probe structures 16, 16, . . . is fixed on the printed board 1. The probe structure 16
is constructed by housing a probe 18 in a cylindrical body 17 that is soldered to an element connection pad 2 of a printed circuit board 1, and the probe 18 is urged upward by a spring 19.

With this configuration, the LSI 8 to be tested is set in the socket mold with its leads 4 aligned with the corresponding probes 18, and further, by pressing the upper part of the leads 4 with the lid member 20, the LSI 8 to be tested is placed on the printed board 1. A connection is made with the pattern circuit.

[0009]

However, in the conventional example described above, as the lead pitch P becomes narrower, it becomes difficult to form probe structures 16 that are small enough to be arranged in accordance with the lead pitch P. Yes, and in that case, the strength of the probe 18 decreases, which is impractical, and also causes a problem of stray capacitance.
It was difficult to test actual devices on pin-sized LSIs.

The present invention has been made to solve the above problems, and it is possible to connect the gull lead component 3 to the printed board removably and under the same electrical conditions as the connection state in the actual machine. It is an object of the present invention to provide a method for connecting Gull-lead components to a printed board, and thereby to provide a method for testing Gull-lead components that allows testing of actual equipment under the same electrical characteristics as when mounted on a product printed board. purpose.

[0011]

[Means for Solving the Problems] According to the present invention, the above object is achieved by providing a printed board 1 as shown in FIG. 1 corresponding to an embodiment.
Gal lead component 3 placed on top element connection pad 2
Pressure head 6 with pressure rubber 5 attached to the tip of the lead 4 of
This is achieved by providing a method for connecting a gull lead component to a printed board, in which the leads 4 are temporarily connected to the element connection pads 2 by pressing.

Further, as shown in FIG. 3, it is also possible to protrude from the printed circuit board 1 a guide block 7 for guiding the gal lead component 3 so that each lead 4 corresponds to the element connection pad 2.

Furthermore, using this connection method, as shown in FIG. 2, a printed board 1 is configured with mounted components 9 excluding the LSI to be tested 8, and element connection pads formed on the printed board 1 are configured. 2, the lead 4 of the LSI to be tested 8 is placed on the printed circuit board 1, and the lead 4 is pressed by a pressure head 6 having a pressure rubber 5 attached to the tip to temporarily mount the LSI 8 to be tested on the printed board 1. It is also possible to configure a test method for gull lead components in which a test program is run on the printed board 1 to test the LSI 8 to be tested.

[0014]

[Operation] In the present invention, the gull lead component 3 is
is placed on the element connection pad 2 of the printed board 1, and then connected to the printed board 1 by being pressed above it by the pressure head 6. As a result, the gull lead component 3 is removably mounted on the printed circuit board 1 under the same electrical conditions as when it was bonded to the printed circuit board 1 by soldering or the like, thereby making it possible to perform tests on actual equipment.

Further, a pressure rubber 5 is attached to the pressure head 6, which evenly presses each lead 4 against the element connection pad 2 to improve connection reliability.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIGS. 2 and 3 show an LSI to which the present invention is applied.
This shows an example of configuring an actual test device.
In the figure, A is a test device placed on a support stand 21, and 1 is a printed board installed on this test device A for testing the actual machine.

[0018] On the printed circuit board 1, other mounted components 9 except for the LSI to be inspected 8 (Gull lead component 3) are mounted in a state similar to that of the actual device. In addition, a console 14 or various I/Os are connected to this printed board 1 via a cable (not shown), and a test program necessary for inspecting the product specifications is run to the printed board 1 and its output is confirmed. Being able to do that.

The LSI 8 to be tested in this embodiment is a QF
This is an LSI with P package specifications, and element connection pads 2, 2, etc. corresponding to each lead 4 are arranged in the mounting area of the LSI to be inspected 8 of the printed board 1, and furthermore, in the corner part, as shown in FIG. As shown, a guide block 7 is provided in a protruding manner so that each lead 4 of the LSI to be tested 8 corresponds accurately to the element connection pad 2. In addition, the above element connection pad 2
For example, it is plated with gold to improve its durability.

On the other hand, the test apparatus A has a base member 22 fixed to a support stand 21 and a lower receiving guide 23 fixed integrally to the base member 22. This lower receiving guide 23 is connected to the L to be inspected formed on the printed board 1.
It is formed into a rectangular frame shape in plan view so as to support the element connection pad 2 for SI8 from the back surface. Further, this lower receiving guide 23 is supported on the back side by a support stand 21,
It is made of a material having sufficient rigidity so that the printed board 1 is not easily deformed even when a pressure force is applied by a pressure cylinder 24, which will be described later.

A pressure cylinder 24 is fixed to the base member 22, and a pressure head 6 is fixed to the tip of the shaft 25. This pressure head 6 is a block-shaped member having a rectangular shape in plan view, and the LSI to be tested is located in the center of the head.
A recess 26 for accommodating the package body No. 8 is recessed, and a lead pressing wall 27 is formed around the periphery.

Furthermore, the lead pressing wall 2 of the pressing head 6
At the tip of 7, as shown in FIG.
is attached to the entire circumference, and by driving the pressure cylinder 24, the leads 4 of the LSI under test are pressed from above, and the leads 4 are brought into contact with the element connection pads 2 on the printed board 1 with equal pressure. Being able to do what you want.

Therefore, in this embodiment, first, the LSI 8 to be tested is mounted on the pad portion of the printed circuit board 1, and then the pressure cylinder 24 is driven to lower the pressure head 6.
The leads 4 of the LSI 8 to be tested are pressed against the pads of the printed circuit board 1. Lead 4 pressed by pressure head 6
is elastically deformed in the vicinity of the boundary with the package body, and variations in the dimension of the tip of the lead 4 in the height direction;
It absorbs the flatness between each pad of the printed board 1 and is connected to the pad.

After that, the operation of the printed circuit board 1 is checked by running the test program, and after checking whether the LSI 8 to be tested is good or not,
Drive the pressure cylinder 24 upward again to remove the LSI 8 to be inspected.
is removed and the inspection is completed.

[0025] In the test apparatus A, the L to be tested
The SI8 can be installed manually, with a jig, or with an automated hand.
Furthermore, it is also possible to automatically mount the LSI 8 to be tested by a robot. Further, when using a robot equipped with an image processing device and capable of controlling the mounting posture of the LSI 8 to be inspected, it is not necessary to provide the guide block 7 on the printed board 1.

Furthermore, the pressurizing cylinder 24 can be driven automatically by a control device or by manual operation.

FIGS. 4 and 5 show other embodiments of the present invention. In this embodiment, the same configurations as those in the above-described embodiment are denoted by the same reference numerals in the drawings, and the explanation thereof will be omitted.

The pressurizing cylinder 24 in this embodiment is as follows:
The air chamber is divided by an isolation plate 28 provided on the shaft 25. Compressed air is sent into the auxiliary air chamber 29 on the push-down side to lower the shaft 25, and compressed air is sent to the auxiliary air chamber 30 on the pull-up side. is sent to raise the shaft 25. In FIG. 4, reference numeral 31 indicates a bearing for holding the shaft 25 so that it can move up and down.

Further, a head holding member 32 is fixed to the tip of the shaft 25. This head holding member 3
2 is provided with an appropriate number of vertical holes 33 to receive fixing pins 34 protruding from the ceiling of the pressure head 6. Then, the pressure head 6 attaches the fixing pin 34 to the head holding member 32.
After inserting the shaft 2 into the vertical hole 33 of the head holding member 32, tighten the fixing screw 35 screwed into the head holding member 32.
5, the L to be inspected is different in size and type.
When testing the SI 8, it is replaced with a pressure head 6 formed to correspond to the LSI 8 to be tested.

Furthermore, the base member 22 has a printed board support portion 37 extending forward from below the cylinder holding wall 36. A guide protrusion 38 is provided on the upper surface of the printed board support portion 37 and extends in a direction perpendicular to the cylinder holding wall 36, and a movable table 39 is movably mounted on the guide protrusion 38. Further, a click stopper (not shown) is provided at the end position of the movement stroke of the movable table 39. In addition, 4
0 is a bearing interposed between the guide protrusion 38 and the moving table 39.

Reference numeral 41 designates a lower support guide plate mounted on the movable table 39. A plurality of lower support guides 23, 23, etc. are fixed to the upper surface of the lower support guide plate 41, and printed circuit board positioning pins are provided at the corners. 42 is provided protrudingly. Further, a plurality of guide holes 43 are bored in the lower receiving guide plate 41, and table pins 44 implanted in the movable table 39 are inserted into the guide holes 43 and mounted on the movable table 39. These guide holes 43, 4
3... are formed in plural pairs corresponding to each lower receiving guide 23, select one of the guide holes 43 and insert the table pin 44, and insert one of the lower receiving guides 23 into the pressure head 6. It is designed so that it can be positioned directly below.

Under the above structure, first, the lower guide plate 41 formed for the printed circuit board 1 to be inspected is mounted on the moving table 39, and the pressure head 6 is mounted on the shaft 25. After that, the printed board 1 is mounted on the moving table 39, and the pad part of the printed board 1 is
Put SI8 on it. At this time, as described above, a guide block 7 can be formed on the printed board 1 to guide the mounting position, or a robot for mounting the elements can be used.

After mounting the LSI 8 to be tested on the printed circuit board 1 as described above, the moving table 39 is moved to position the LSI 8 to be tested directly below the pressure head 6, and the pressure head 6 is lowered. The inspection will then be carried out.

In this embodiment, the LSI to be tested 8 is located directly below the pressure head 6 at the stroke end position on the fully pushed side of the movable table 39, and a switch (not shown) is operated at this position. Compressed air is sent to the auxiliary air chamber 29 on the push-down side, and thereafter, a test program is run after an appropriate period of time, and an inspection is automatically performed.

Note that the stroke end position of the moving table 39 on the pull-out side corresponds to the loading and unloading position of the LSI 8 to be tested.

[0036]

[Effects of the Invention] As is clear from the above explanation, according to the present invention, the gull lead parts can be freely removed, and
It can be mounted on a printed board under the same electrical conditions as when soldering or the like.

Furthermore, when this method is applied to configure a test method for gull-lead components, it is possible to conduct actual machine tests even for components with a dense lead pitch, and the inspection efficiency can be greatly improved.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the principle of the present invention, in which (a) is a side view and (b) is a view taken in the direction of arrow B in (a).

FIG. 2 is a diagram showing an embodiment of the present invention.

[Fig. 3] Diagrams showing the pad part, (a) is a plan view, (b)
FIG. 6 is an enlarged view of FIG. 2A viewed in the direction of arrow B, and FIG.

FIG. 4 is a diagram showing another embodiment of the present invention.

FIG. 5 is a side view of FIG. 4;

FIG. 6 is a diagram showing a conventional test method.

FIG. 7 is a diagram showing another test method.

8 is a cross-sectional view taken along line AA in FIG. 7. FIG.

FIG. 9 is a side view of FIG. 8;

[Explanation of symbols]

1 Printed board 2 Element connection pad ３　　　Gallead parts 4 Lead 5 Pressure rubber 6 Pressure head 7 Guide block 8 LSI to be tested 9 Mounted parts

Claims (3)

[Claims] Claim 1: Element connection pad (2) on printed board (1)
) The lead (4) of the gull lead component (3) placed on
is pressed by a pressure head (6) with pressure rubber (5) attached to the tip, and the lead (4) is connected to the element connection pad (2).
How to connect gull lead parts to a printed board for temporary connection. 2. The printed board (1) has each lead (4
, 4...) guide the gull lead component (3) to correspond to the element connection pad (2, 2...).
7) A method for connecting a gull lead component to a printed board according to claim 1, wherein the gull lead component is provided protrudingly. Claim 3: The printed board (1) according to claim 1 or 2.
is configured by mounting components (9) other than the LSI to be tested (8), and the gull leads (4) of the LSI to be tested (8) are mounted on the element connection pads (2) formed on the printed board (1). At the same time, place the lead (4) on the tip of the pressurized rubber (
The LSI to be tested (8) is temporarily mounted on the printed board (1) by pressing it with the pressure head (6) to which the LSI to be tested (5) is pasted, and the test program is run on the printed board (1) to remove the LSI to be tested.
Test method for Gallead parts to perform SI (8) inspection.