KR102351472B1 - The blanking method of the device vacuum chuck - Google Patents
The blanking method of the device vacuum chuck Download PDFInfo
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- KR102351472B1 KR102351472B1 KR1020200032318A KR20200032318A KR102351472B1 KR 102351472 B1 KR102351472 B1 KR 102351472B1 KR 1020200032318 A KR1020200032318 A KR 1020200032318A KR 20200032318 A KR20200032318 A KR 20200032318A KR 102351472 B1 KR102351472 B1 KR 102351472B1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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Abstract
본 발명은 범프(bump)의 크기가 작고 피치가 좁은 BGA(Ball Grid Array) 또는 TSOP(Thin Small Outline Package)와 같은 디바이스를 생산한 다음 핸들러(handler)에서 성능 테스트를 실시할 수 있도록 디바이스를 진공압에 의해 흡착하는 디바이스 진공척의 블랭킹방법에 관한 것으로, 진공척에 형성된 복수 개의 진공홀을 1개의 진공펌프에 의해 한꺼번에 셕션할 수 있게 구성하여 1롯트(lot)(약 4000 ∼ 8000개 정도)의 테스트가 끝나거나, 리테스트를 실시할 때마다 진공 척에 형성된 진공홀보다 디바이스가 적게 남더라도 진공척에 디바이스를 셕션할 수 있도록 한 것이다.
이를 위해, 본 발명은 진공척(10)에 디바이스(20)가 안착되는 복수 개의 진공홀(11)을 형성함과 함께 상기 각 진공홀(11)이 흡입홀(12)과 연통되도록 하여 1개의 진공펌프(30)의 구동으로 각 진공홀(11)에 흡입력이 작용되도록 구성하고, 상기 진공척(10)의 상부에는 디바이스(20)를 감싸도록 진공홀(11)과 동일 개수의 개구부(41)를 갖는 지그 플레이트(40)를 구비하여 진공척(10)에 형성된 각 진공홀(11)에 테스트할 디바이스(20)를 로딩한 상태에서 상기 개구부(41)가 디바이스(20)를 감싼 상태에서 진공척(10)을 X - Y - θ방향으로 미세 이동시켜 디바이스(20)가 지그 플레이트(40)에 형성된 개구부(41)의 2변에 의해 얼라인(align)되도록 하며, 상기 진공홀(11)보다 작은 개수의 디바이스(20)가 진공홀(11)에 안착될 경우, 나머지 진공홀(11)을 블랭킹 디바이스(51)로 폐쇄하여 진공펌프(30)의 구동으로 진공홀(11)에 안착된 디바이스(20)가 진공압에 의해 흡착되도록 하는 것을 특징으로 한다.The present invention manufactures a device such as a BGA (Ball Grid Array) or TSOP (Thin Small Outline Package) with a small bump and a narrow pitch, and then develops the device so that a performance test can be performed in a handler. It relates to a blanking method of a device vacuum chuck that is sucked by pneumatic pressure, and a plurality of vacuum holes formed in the vacuum chuck are configured to be opened at once by a single vacuum pump, and 1 lot (about 4000 to 8000 pieces) of This allows the device to be plugged into the vacuum chuck even if there are fewer devices than the vacuum holes formed in the vacuum chuck each time a test is completed or a retest is performed.
To this end, the present invention forms a plurality of vacuum holes 11 in which the device 20 is seated in the vacuum chuck 10 and allows each vacuum hole 11 to communicate with the suction hole 12 to form one A suction force is applied to each vacuum hole 11 by driving the vacuum pump 30 , and the same number of openings 41 as the vacuum hole 11 so as to surround the device 20 on the upper portion of the vacuum chuck 10 . ) in a state in which the device 20 to be tested is loaded into each vacuum hole 11 formed in the vacuum chuck 10 by providing a jig plate 40 having a The vacuum chuck 10 is moved in the X - Y - θ direction so that the device 20 is aligned by the two sides of the opening 41 formed in the jig plate 40 , and the vacuum hole 11 ), when a smaller number of devices 20 are seated in the vacuum hole 11 , the remaining vacuum holes 11 are closed with a blanking device 51 to be seated in the vacuum hole 11 by driving the vacuum pump 30 . It is characterized in that the device 20 is adsorbed by vacuum pressure.
Description
본 발명은 범프(bump)의 크기가 작고 피치가 좁은 BGA(Ball Grid Array) 또는 TSOP(Thin Small Outline Package)와 같은 디바이스를 생산한 다음 핸들러(handler)에서 성능 테스트를 실시할 수 있도록 디바이스를 진공압에 의해 흡착하는 디바이스 진공척에 관한 것으로써, 좀 더 구체적으로는 진공척에 형성된 복수 개의 진공홀을 1개의 진공펌프에 의해 한꺼번에 셕션할 수 있게 구성하여 1롯트(lot)(약 4000 ∼ 8000개 정도)의 테스트가 끝나거나, 리테스트를 실시할 때마다 진공 척에 형성된 진공홀보다 디바이스가 적게 남더라도 진공척에 디바이스를 셕션할 수 있도록 하는 디바이스 진공척의 블랭킹방법에 관한 것이다.The present invention manufactures a device such as a BGA (Ball Grid Array) or TSOP (Thin Small Outline Package) with a small bump and a narrow pitch, and then develops the device so that a performance test can be performed in a handler. It relates to a device vacuum chuck that is adsorbed by pneumatic pressure, and more specifically, a plurality of vacuum holes formed in the vacuum chuck are configured to be opened at once by a single vacuum pump, so that 1 lot (about 4000 to 8000) It relates to a blanking method of a device vacuum chuck that enables the device to be seced to the vacuum chuck even if there are fewer devices than the vacuum holes formed in the vacuum chuck each time the test of the test is finished or a retest is performed.
일반적으로, IC와 같은 반도체 디바이스는 그 제조공정 중에 전기적 특성을 검사하여 그 불량 여부를 검사하고 있으며 상기 반도체 디바이스의 전기적 특성 검사는 반도체 디바이스의 볼 단자와 인쇄회로기판(PCB)을 포함하는 테스트 보드의 접점을 전기적으로 연결하여 설정된 시간동안 테스트를 실시하여 양품은 출하하고 불량품은 리테스트를 실시하거나, 폐기 처분하고 있다.In general, semiconductor devices such as ICs are inspected for defects by inspecting electrical characteristics during a manufacturing process, and the inspection of electrical characteristics of the semiconductor device includes a test board including a ball terminal of the semiconductor device and a printed circuit board (PCB). Electrically connect the contact points of the product and conduct a test for a set period of time. Good products are shipped, and defective products are retested or disposed of.
종래에는 테스트할 디바이스를 캐리어에 삽입한 상태에서 테스터측으로 개별 이송시켜 디바이스의 전기적인 특성을 테스트하게 된다.Conventionally, in a state in which the device to be tested is inserted into the carrier, the device is individually transferred to the tester to test the electrical characteristics of the device.
즉, 디바이스의 전기적인 테스트는 캐리어에 탑재된 디바이스의 볼 단자와 소켓 어셈블리에 지지된 프루브 핀의 전기적 접촉으로 수행하는데, 이때 매우 작은 크기의 볼 단자와 프루브 핀은 좁은 피치로 배치되어 있기 때문에 테스트 시에 매우 고정밀도의 얼라인이 요구되지만, 볼 단자와 프루브 핀의 정렬은 캐리어의 얼라인공과 소켓가이드의 얼라인 핀의 상호 정렬을 통해 이루어진다.That is, the electrical test of the device is performed by electrical contact between the ball terminal of the device mounted on the carrier and the probe pin supported on the socket assembly. Although very high-precision alignment is required, the alignment of the ball terminal and the probe pin is achieved through the mutual alignment of the alignment hole of the carrier and the alignment pin of the socket guide.
상기한 문제점을 감안하여 출원인에 의해 새로운 타입의 진공척을 개발하여 진공척의 진공홀에 테스트할 디바이스를 로딩한 다음 얼라인(align)을 실시하고 있다.In consideration of the above problems, a new type of vacuum chuck has been developed by the applicant, and a device to be tested is loaded into the vacuum hole of the vacuum chuck and then aligned.
상기 진공척에 형성된 복수 개의 진공홀마다 진공펌프 및 밸브(도시는 생략함)를 설치하여 상기 진공홀에 디바이스를 올려놓을 때마다 디바이스를 셕션한 다음 디바이스의 위치를 얼라인하도록 하고 있다.A vacuum pump and a valve (not shown) are installed in each of the plurality of vacuum holes formed in the vacuum chuck, so that whenever a device is placed in the vacuum hole, the device is turned on and then the position of the device is aligned.
(선행기술문헌)(Prior art literature)
(특허문헌 0001) 대한민국 공개특허 10-2006-0010605(2006.02.02.공개)(Patent Document 0001) Republic of Korea Patent Publication 10-2006-0010605 (published on Feb. 2, 2006)
(특허문헌 0002) 대한민국 등록실용신안공보 20-0448311(2010.03.25.등록)(Patent Document 0002) Republic of Korea Utility Model Publication No. 20-0448311 (Registered on March 25, 2010)
그러나 이러한 종래의 진공척은 진공척에 형성된 진공홀마다 진공펌프 및 밸브를 설치하여 진공홀에 디바이스가 안착될 때마다 진공펌프를 개별 구동하여 셕션함에 따라 진공유닛의 설치에 따른 공간점유율이 커지게 됨은 물론이고 부품 수가 많아 생산원가가 증가되는 문제점이 발생되었다.However, such a conventional vacuum chuck installs a vacuum pump and a valve in each vacuum hole formed in the vacuum chuck, and each time a device is seated in the vacuum hole, the vacuum pump is individually driven to make a section, thereby increasing the space occupancy according to the installation of the vacuum unit. In addition, there was a problem in that the production cost increased due to the large number of parts.
본 발명은 종래의 이와 같은 문제점을 해결하기 위해 안출한 것으로써, 진공척에 형성된 복수 개의 진공홀에 진공압이 동시에 걸리도록 진공척의 구조를 개선하여 진공척에 형성된 진공홀에 디바이스가 전부 얹혀지지 않더라도 나머지 진공홀을 블랭킹 디바이스로 폐쇄하여 1개의 진공펌프로 디바이스를 셕션할 수 있도록 하는 데 그 목적이 있다.The present invention has been devised to solve the above problems in the prior art, and the structure of the vacuum chuck is improved so that vacuum pressure is applied to a plurality of vacuum holes formed in the vacuum chuck at the same time, so that all devices are not placed on the vacuum holes formed in the vacuum chuck. Even if not, the purpose is to close the remaining vacuum holes with a blanking device so that the device can be turned on with one vacuum pump.
본 발명의 다른 목적은 진공척의 상부에 디바이스를 감싸도록 진공홀과 동일 개수의 개구부가 형성된 지그 플레이트를 구비하여 진공척에 형성된 진공홀에 디바이스를 로딩하면 상기 개구부가 디바이스를 감싸 디바이스를 얼라인하도록 하는 데 있다.Another object of the present invention is to provide a jig plate having the same number of openings as the vacuum hole to surround the device on the upper part of the vacuum chuck, and to align the device when the device is loaded into the vacuum hole formed in the vacuum chuck so that the opening surrounds the device. is to do
상기 목적을 달성하기 위한 본 발명의 형태에 따르면, 진공척에 디바이스가 안착되는 복수 개의 진공홀을 형성함과 함께 상기 각 진공홀이 흡입홀과 연통되도록 하여 1개의 진공펌프의 구동으로 각 진공홀에 흡입력이 작용되도록 구성하고, 상기 진공척의 상부에는 디바이스를 감싸도록 진공홀과 동일 개수의 개구부를 갖는 지그 플레이트를 구비하여 진공척에 형성된 각 진공홀에 테스트할 디바이스를 로딩한 상태에서 상기 개구부가 디바이스를 감싼 상태에서 진공척을 X - Y - θ방향으로 미세 이동시켜 디바이스가 지그 플레이트에 형성된 개구부의 2변에 의해 얼라인(align)되도록 하며, 상기 진공홀보다 작은 개수의 디바이스가 진공홀에 안착될 경우, 나머지 진공홀을 블랭킹 디바이스로 폐쇄하여 진공펌프의 구동으로 진공홀에 안착된 디바이스가 진공압에 의해 흡착되도록 하는 것을 특징으로 하는 디바이스 진공척의 블랭킹방법이 제공된다.According to the aspect of the present invention for achieving the above object, a plurality of vacuum holes in which the device is seated are formed on the vacuum chuck, and each vacuum hole is communicated with the suction hole, so that each vacuum hole is driven by one vacuum pump. A suction force is applied to the vacuum chuck, and a jig plate having the same number of openings as a vacuum hole is provided on the upper portion of the vacuum chuck to surround the device, and the opening is formed in a state in which the device to be tested is loaded in each vacuum hole formed in the vacuum chuck. While the device is wrapped, the vacuum chuck is moved in the X-Y-θ direction so that the device is aligned by the two sides of the opening formed in the jig plate, and the number of devices smaller than the vacuum hole is placed in the vacuum hole. Provided is a blanking method for a device vacuum chuck, characterized in that the remaining vacuum holes are closed with a blanking device when seated, so that the device seated in the vacuum hole is adsorbed by vacuum pressure by driving a vacuum pump.
본 발명은 종래에 비하여 1개의 진공펌프를 이용하여 진공척에 형성된 진공홀의 개수보다 적은 디바이스가 안착되더라도 나머지 진공홀을 블랭킹 디바이스로 폐쇄하여 디바이스를 진공압으로 흡착할 수 있게 되므로 진공척의 구조가 간단해져 생산원가를 절감할 수 있게 됨은 물론 진공척의 콤팩트화가 가능하다.In the present invention, compared to the prior art, even if fewer devices than the number of vacuum holes formed in the vacuum chuck are seated using one vacuum pump, the remaining vacuum holes are closed with a blanking device so that the devices can be adsorbed by vacuum pressure, so the structure of the vacuum chuck is simple. This makes it possible to reduce the production cost and also to make the vacuum chuck compact.
또한, 복수 개의 진공홀에 디바이스가 로딩될 때마다 진공펌프의 구동을 제어할 필요가 없으므로 소프트웨어의 구성을 단순화할 수 있는 효과도 기대할 수 있다.In addition, since there is no need to control the operation of the vacuum pump whenever a device is loaded into a plurality of vacuum holes, the effect of simplifying the software configuration can be expected.
도 1은 본 발명의 잔공척을 나타낸 종단면도
도 2a 및 도 2b는 본 발명을 설명하기 위한 평면도
도 3a는 본 발명에서 지그 플레이트의 개구부에 디바이스가 투입되어 진공척에 안착된 상태의 평면도
도 3b는 본 발명에서 진공척이 X - Y - θ방향을 따라 미세 이동하여 지그 플레이트에 형성된 개구부에 의해 디바이스의 얼라인이 완료된 상태도1 is a longitudinal cross-sectional view showing a small hole chuck of the present invention;
2A and 2B are plan views for explaining the present invention;
Figure 3a is a plan view of a state in which the device is inserted into the opening of the jig plate and seated on the vacuum chuck in the present invention;
3b is a state diagram in which the alignment of the device is completed by the opening formed in the jig plate as the vacuum chuck moves finely along the X-Y-θ direction in the present invention;
이하, 첨부한 도면을 참고로 하여 본 발명의 실시 예에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시 예에 한정되지 않는다. 도면들은 개략적이고 축적에 맞게 도시되지 않았다는 것을 일러둔다. 도면에 있는 부분들의 상대적인 치수 및 비율은 도면에서의 명확성 및 편의를 위해 그 크기에 있어 과장되거나 감소되어 도시되었으며 임의의 치수는 단지 예시적인 것이지 한정적인 것은 아니다. 그리고 둘 이상의 도면에 나타나는 동일한 구조물, 요소 또는 부품에는 동일한 참조 부호가 유사한 특징을 나타내기 위해 사용된다.Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art can easily implement them. The present invention may be implemented in several different forms and is not limited to the embodiments described herein. It is noted that the drawings are schematic and not drawn to scale. Relative dimensions and proportions of parts in the drawings are shown exaggerated or reduced in size for clarity and convenience in the drawings, and any dimensions are illustrative only and not limiting. In addition, the same reference numerals are used to indicate like features to the same structure, element, or part appearing in two or more drawings.
도 1은 본 발명의 잔공척을 나타낸 종단면도이고 도 2a 및 도 2b는 본 발명을 설명하기 위한 평면도로써, 본 발명은 진공척(10)에 디바이스(20)가 안착되는 복수 개의 진공홀(11)이 형성되어 있는데, 상기 복수 개의 진공홀(11)은 흡입홀(12)과 연통되어 있으며 상기 흡입홀(12)의 입구에는 진공펌프(30) 및 밸브(31)가 차례로 설치되어 있어 상기 밸브(31)가 개방된 상태에서 진공펌프(30)가 구동하면 복수 개의 진공홀(11)에 진공압이 동시에 걸리게 된다.1 is a longitudinal cross-sectional view showing a small hole chuck of the present invention, and FIGS. 2A and 2B are plan views for explaining the present invention. The present invention is a plurality of
상기 진공척(10)의 상부에 디바이스(20)를 감싸도록 진공홀(11)과 동일 개수의 개구부(41)를 갖는 지그 플레이트(40)가 구비되어 있어 진공척(10)에 형성된 진공홀(11)에 테스트할 디바이스(20)를 로딩하면 상기 개구부(41)가 디바이스(20)를 감싼 상태에서 진공척(10)이 X - Y - θ방향으로 미세 이동함에 따라 디바이스(20)가 지그 플레이트(40)에 형성된 개구부(41)의 2변에 의해 얼라인(align)된다.A
상기 진공척(10)의 일 측에 블랭킹 디바이스(51)가 얹혀져 대기하는 버퍼(50)가 구비되어 있어 진공척(10)에 형성된 빈 진공홀(11)을 버퍼(50)에 위치된 블랭킹 디바이스(51)로 폐쇄하도록 되어 있다.A blanking device positioned in the
본 발명의 작용에 대하여 설명하면 다음과 같다.The operation of the present invention will be described as follows.
먼저, 로딩부에서 테스트할 디바이스(20)를 픽커(picker) 등의 흡착수단이 흡착하여 지그 플레이트(40)의 개구부(41)를 통해 진공척(10)의 진공홀(11)에 전부 로딩하고 나면 흡입홀(12)의 입구에 설치된 밸브(31)가 개방된 상태에서 진공펌프(30)가 구동하게 되므로 디바이스(20)가 미세 이동 가능한 압력으로 셕션된다.First, the
상기 지그 플레이트(40)에 형성된 개구부(41)를 통해 진공척(10)의 진공홀(11)에 셕션된 디바이스(20)는 도 3a와 같이 얼라인되지 않은 비툴어진 상태이다.The
상기 지그 플레이트(40)의 개구부(41)가 진공척(10)의 진공홀(11)에 셕션된 디바이스(20)를 감싼상태에서 진공척(10)이 위치조절수단(도시는 생략함)에 의해 X - Y - θ방향으로 미세 이동시킴에 따라 디바이스(20)가 지그 플레이트(40)에 형성된 개구부(41)의 2변에 의해 안내되어 도 3b와 같이 얼라인이 이루어지게 된다.In a state in which the
이때, 위치조절수단은 MISUMI사(모델명 : AA-300-3S)에서 생산하는 공지의 기성품임을 밝힌다.At this time, it is revealed that the position adjusting means is a well-known ready-made product produced by MISUMI (model name: AA-300-3S).
그러나 1롯트의 디바이스(20)를 진공척(10)에 셕션한 다음 얼라인하여 테스트부에서 테스트를 실시함에 따라 최종적으로 도 2a와 같이 진공홀(11)보다 작은 개수의 디바이스(20)가 진공홀(11)에 안착될 경우, 진공펌프(30)가 구동할 때 디바이스(20)가 없는 진공홀(11)을 통해 공기가 흡입되므로 진공홀(11)에 로딩된 디바이스(20)를 셕션할 수 없게 된다.However, as the
따라서 이러한 경우에는 픽커가 진공척(10)의 일 측에 위치하는 버퍼(50)에서 블랭킹 디바이스(51)를 흡착하여 디바이스(20)가 없는 진공홀(11)을 폐쇄함에 따라 진공펌프(30)가 구동하면 진공홀(11)에 안착된 디바이스(20)가 진공압에 의해 흡착되므로 지그 플레이트(40)의 개구부(41)에 의해 디바이스(20)의 얼라인작업을 실시할 수 있게 되는 것이다.Therefore, in this case, as the picker adsorbs the
상기한 바와 같은 작업은 1롯트의 디바이스(20)를 진공척(10)에 셕션한 다음 얼라인하여 테스트부에서 테스트를 실시한 다음 발생되는 불량품을 리테스트할 때에도 동일하게 이루어짐은 이해 가능한 것이다.It is understandable that the above operation is performed in the same way when a defective product is retested after the
이상 첨부된 도면을 참조하여 본 발명의 실시 예를 설명하였지만, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 기술적 사상이나 필수적 특징을 변경하지 않고 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다.Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those of ordinary skill in the art to which the present invention pertains will understand that the present invention may be implemented in other specific forms without changing the technical spirit or essential features. will be.
그러므로 이상에서 기술한 실시 예는 모든 면에서 예시적인 것이며 한정적인 것이 아닌 것으로서 이해되어야 하고, 상기 상세한 설명에서 기술된 본 발명의 범위는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 등가 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention described in the above detailed description is indicated by the following claims, meaning and All changes or modifications derived from the scope and its equivalents should be construed as being included in the scope of the present invention.
10 : 진공척 11 : 진공홀
12 : 흡입홀 20 : 디바이스
30 : 진공펌프 40 : 지그 플레이트
41 : 개구부 50 : 버퍼
51 : 블랭킹 디바이스10: vacuum chuck 11: vacuum hole
12: suction hole 20: device
30: vacuum pump 40: jig plate
41: opening 50: buffer
51: blanking device
Claims (2)
A plurality of vacuum holes 11 in which the device 20 is seated are formed in the vacuum chuck 10 and each vacuum hole 11 is communicated with the suction hole 12 so that the A jig plate ( 40) and in a state in which the device 20 to be tested is loaded into each vacuum hole 11 formed in the vacuum chuck 10, and the vacuum chuck 10 is inserted in a state in which the opening 41 surrounds the device 20. The device 20 is aligned by the two sides of the opening 41 formed in the jig plate 40 by micro-moving in the X-Y-θ direction, and the number of devices smaller than the vacuum hole 11 is When the 20 is seated in the vacuum hole 11, the remaining vacuum hole 11 is closed with a blanking device 51 so that the device 20 seated in the vacuum hole 11 by driving the vacuum pump 30 is A blanking method for a device vacuum chuck, characterized in that it is adsorbed by vacuum pressure.
상기 진공척(10)의 일 측에 블랭킹 디바이스(51)가 얹혀져 대기하는 버퍼(50)를 구비하여 진공척(10)에 형성된 빈 진공홀(11)을 버퍼(50)에 위치된 블랭킹 디바이스(51)로 폐쇄하는 것을 특징으로 하는 디바이스 진공척의 블랭킹방법.The method according to claim 1,
A blanking device (51) placed on one side of the vacuum chuck (10) is provided with a waiting buffer (50), and the empty vacuum hole (11) formed in the vacuum chuck (10) is formed in the buffer (50) by a blanking device ( 51), a blanking method of a device vacuum chuck, characterized in that it is closed.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR200497336Y1 (en) | 2023-02-22 | 2023-10-11 | 김상봉 | Vacuum valve and vacuum chuck equipped with vacuum valve |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002207062A (en) * | 2001-01-09 | 2002-07-26 | Advantest Corp | Method for obtaining electrical characteristic correlation of socket in electronic part-testing apparatus, handler, method for controlling handler and electronic part-testing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002207062A (en) * | 2001-01-09 | 2002-07-26 | Advantest Corp | Method for obtaining electrical characteristic correlation of socket in electronic part-testing apparatus, handler, method for controlling handler and electronic part-testing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200497336Y1 (en) | 2023-02-22 | 2023-10-11 | 김상봉 | Vacuum valve and vacuum chuck equipped with vacuum valve |
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