JPH0436246U - - Google Patents
Info
- Publication number
- JPH0436246U JPH0436246U JP1990077541U JP7754190U JPH0436246U JP H0436246 U JPH0436246 U JP H0436246U JP 1990077541 U JP1990077541 U JP 1990077541U JP 7754190 U JP7754190 U JP 7754190U JP H0436246 U JPH0436246 U JP H0436246U
- Authority
- JP
- Japan
- Prior art keywords
- shaped groove
- semiconductor device
- frame
- groove deeper
- frame width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990077541U JPH0436246U (US07579456-20090825-P00002.png) | 1990-07-20 | 1990-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990077541U JPH0436246U (US07579456-20090825-P00002.png) | 1990-07-20 | 1990-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0436246U true JPH0436246U (US07579456-20090825-P00002.png) | 1992-03-26 |
Family
ID=31620026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990077541U Pending JPH0436246U (US07579456-20090825-P00002.png) | 1990-07-20 | 1990-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436246U (US07579456-20090825-P00002.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0573952U (ja) * | 1992-03-13 | 1993-10-08 | 株式会社村田製作所 | ケース型電子部品 |
| JP2011187697A (ja) * | 2010-03-09 | 2011-09-22 | Fuji Electric Co Ltd | 半導体パッケージの組立方法 |
| WO2014010074A1 (ja) * | 2012-07-13 | 2014-01-16 | 三菱電機株式会社 | 半導体装置 |
-
1990
- 1990-07-20 JP JP1990077541U patent/JPH0436246U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0573952U (ja) * | 1992-03-13 | 1993-10-08 | 株式会社村田製作所 | ケース型電子部品 |
| JP2011187697A (ja) * | 2010-03-09 | 2011-09-22 | Fuji Electric Co Ltd | 半導体パッケージの組立方法 |
| WO2014010074A1 (ja) * | 2012-07-13 | 2014-01-16 | 三菱電機株式会社 | 半導体装置 |
| US9363914B2 (en) | 2012-07-13 | 2016-06-07 | Mitubishi Electric Corporation | Semiconductor device |
