JPH0436146Y2 - - Google Patents
Info
- Publication number
- JPH0436146Y2 JPH0436146Y2 JP1985182196U JP18219685U JPH0436146Y2 JP H0436146 Y2 JPH0436146 Y2 JP H0436146Y2 JP 1985182196 U JP1985182196 U JP 1985182196U JP 18219685 U JP18219685 U JP 18219685U JP H0436146 Y2 JPH0436146 Y2 JP H0436146Y2
- Authority
- JP
- Japan
- Prior art keywords
- alignment mark
- circuit pattern
- solder resist
- solder
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 75
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 26
- 239000011889 copper foil Substances 0.000 description 26
- 238000005476 soldering Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000010019 resist printing Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985182196U JPH0436146Y2 (US20020128544A1-20020912-P00008.png) | 1985-11-28 | 1985-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985182196U JPH0436146Y2 (US20020128544A1-20020912-P00008.png) | 1985-11-28 | 1985-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6291477U JPS6291477U (US20020128544A1-20020912-P00008.png) | 1987-06-11 |
| JPH0436146Y2 true JPH0436146Y2 (US20020128544A1-20020912-P00008.png) | 1992-08-26 |
Family
ID=31127767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985182196U Expired JPH0436146Y2 (US20020128544A1-20020912-P00008.png) | 1985-11-28 | 1985-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436146Y2 (US20020128544A1-20020912-P00008.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727807B2 (ja) * | 1988-01-20 | 1995-03-29 | 松下電器産業株式会社 | 電子部品用セラミック基板 |
| JP3354474B2 (ja) * | 1998-02-24 | 2002-12-09 | シャープ株式会社 | フレックスリジット多層配線板の製造方法 |
| JP5868281B2 (ja) * | 2012-07-27 | 2016-02-24 | 京セラサーキットソリューションズ株式会社 | 配線基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527267Y2 (US20020128544A1-20020912-P00008.png) * | 1976-03-02 | 1980-06-30 |
-
1985
- 1985-11-28 JP JP1985182196U patent/JPH0436146Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6291477U (US20020128544A1-20020912-P00008.png) | 1987-06-11 |
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