JPH0435909B2 - - Google Patents
Info
- Publication number
- JPH0435909B2 JPH0435909B2 JP18295286A JP18295286A JPH0435909B2 JP H0435909 B2 JPH0435909 B2 JP H0435909B2 JP 18295286 A JP18295286 A JP 18295286A JP 18295286 A JP18295286 A JP 18295286A JP H0435909 B2 JPH0435909 B2 JP H0435909B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- melting point
- film
- electrode
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 105
- 238000002844 melting Methods 0.000 claims description 77
- 230000008018 melting Effects 0.000 claims description 70
- 239000002184 metal Substances 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000007788 liquid Substances 0.000 claims description 38
- 238000009835 boiling Methods 0.000 claims description 30
- 229910045601 alloy Inorganic materials 0.000 claims description 25
- 239000000956 alloy Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 24
- 238000012545 processing Methods 0.000 claims description 16
- 238000003672 processing method Methods 0.000 claims description 12
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 235000015112 vegetable and seed oil Nutrition 0.000 claims description 6
- 239000008158 vegetable oil Substances 0.000 claims description 6
- 235000011187 glycerol Nutrition 0.000 claims description 5
- 239000003921 oil Substances 0.000 claims description 4
- 235000019198 oils Nutrition 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000010775 animal oil Substances 0.000 claims description 2
- 239000002480 mineral oil Substances 0.000 claims description 2
- 235000010446 mineral oil Nutrition 0.000 claims description 2
- 229920002545 silicone oil Polymers 0.000 claims description 2
- 229910000743 fusible alloy Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 description 27
- 235000019864 coconut oil Nutrition 0.000 description 20
- 239000003240 coconut oil Substances 0.000 description 20
- 230000004907 flux Effects 0.000 description 18
- 239000000463 material Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000003860 storage Methods 0.000 description 10
- 239000010949 copper Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000005484 gravity Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012768 molten material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000258920 Chilopoda Species 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 235000019482 Palm oil Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002540 palm oil Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 230000035936 sexual power Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Coating With Molten Metal (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61182952A JPS6340281A (ja) | 1986-08-04 | 1986-08-04 | 半導体装置の電極処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61182952A JPS6340281A (ja) | 1986-08-04 | 1986-08-04 | 半導体装置の電極処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6340281A JPS6340281A (ja) | 1988-02-20 |
| JPH0435909B2 true JPH0435909B2 (cs) | 1992-06-12 |
Family
ID=16127218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61182952A Granted JPS6340281A (ja) | 1986-08-04 | 1986-08-04 | 半導体装置の電極処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6340281A (cs) |
-
1986
- 1986-08-04 JP JP61182952A patent/JPS6340281A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6340281A (ja) | 1988-02-20 |
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