JPH0545043B2 - - Google Patents
Info
- Publication number
- JPH0545043B2 JPH0545043B2 JP61174219A JP17421986A JPH0545043B2 JP H0545043 B2 JPH0545043 B2 JP H0545043B2 JP 61174219 A JP61174219 A JP 61174219A JP 17421986 A JP17421986 A JP 17421986A JP H0545043 B2 JPH0545043 B2 JP H0545043B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- chip parts
- melting point
- electrode
- cylindrical container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61174219A JPS6329906A (ja) | 1986-07-24 | 1986-07-24 | チツプ部品の電極処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61174219A JPS6329906A (ja) | 1986-07-24 | 1986-07-24 | チツプ部品の電極処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6329906A JPS6329906A (ja) | 1988-02-08 |
| JPH0545043B2 true JPH0545043B2 (cs) | 1993-07-08 |
Family
ID=15974807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61174219A Granted JPS6329906A (ja) | 1986-07-24 | 1986-07-24 | チツプ部品の電極処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6329906A (cs) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5419073A (en) * | 1977-07-13 | 1979-02-13 | Hitachi Ltd | Remote control apparatus |
-
1986
- 1986-07-24 JP JP61174219A patent/JPS6329906A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6329906A (ja) | 1988-02-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2481511B1 (en) | Gold removal from electronic components | |
| US20060065431A1 (en) | Self-reflowing printed circuit board and application methods | |
| EP0097796B1 (en) | Process and apparatus for unsoldering solder bonded semiconductor devices | |
| US4334646A (en) | Method of solder reflow assembly | |
| EP2978287B1 (en) | Soldering device and method | |
| EP0325660B1 (en) | Method of heat treatment of low melting -point metal | |
| JPH0545043B2 (cs) | ||
| US20240196540A1 (en) | High aspect ratio vias filled with liquid metal fill | |
| JPH0545044B2 (cs) | ||
| JPS6348804A (ja) | チツプ部品の電極処理装置 | |
| JP2511889B2 (ja) | チツプ部品の電極処理方法 | |
| JPH01186603A (ja) | チップ部品の電極処理装置 | |
| JPH0435909B2 (cs) | ||
| JPS63318105A (ja) | チップ部品の電極処理装置 | |
| JPH02265219A (ja) | チップ部品の電極処理装置 | |
| JPH01212405A (ja) | チップ部品の電極処理装置 | |
| JPH02265220A (ja) | チップ部品の電極処理装置 | |
| JPS5817626A (ja) | 低温度ダイ取り付け方法 | |
| JPH04270181A (ja) | 超伝導体繊維を銅チャンネルにはんだ付けする方法 | |
| KR0173041B1 (ko) | 미세한 금속볼 제조 방법 | |
| JPH09205002A (ja) | チップ型電子部品の製造方法 | |
| JP2737341B2 (ja) | 迎えはんだ付け方法 | |
| JPH0217614A (ja) | チップ部品の電極処理方法 | |
| JPH03225923A (ja) | バンプの形成方法 | |
| JPH01115103A (ja) | チップ部品の電極処理方法 |