JPH0435859B2 - - Google Patents

Info

Publication number
JPH0435859B2
JPH0435859B2 JP58065921A JP6592183A JPH0435859B2 JP H0435859 B2 JPH0435859 B2 JP H0435859B2 JP 58065921 A JP58065921 A JP 58065921A JP 6592183 A JP6592183 A JP 6592183A JP H0435859 B2 JPH0435859 B2 JP H0435859B2
Authority
JP
Japan
Prior art keywords
proximity switch
proximity
lead frame
detection coil
switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58065921A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59190717A (ja
Inventor
Takahiro Sakakino
Hiroyuki Yamazaki
Kenji Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP58065921A priority Critical patent/JPS59190717A/ja
Publication of JPS59190717A publication Critical patent/JPS59190717A/ja
Publication of JPH0435859B2 publication Critical patent/JPH0435859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/945—Proximity switches
    • H03K17/95—Proximity switches using a magnetic detector
    • H03K17/9505—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Electronic Switches (AREA)
JP58065921A 1983-04-13 1983-04-13 近接スイツチ Granted JPS59190717A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58065921A JPS59190717A (ja) 1983-04-13 1983-04-13 近接スイツチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58065921A JPS59190717A (ja) 1983-04-13 1983-04-13 近接スイツチ

Publications (2)

Publication Number Publication Date
JPS59190717A JPS59190717A (ja) 1984-10-29
JPH0435859B2 true JPH0435859B2 (OSRAM) 1992-06-12

Family

ID=13300913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58065921A Granted JPS59190717A (ja) 1983-04-13 1983-04-13 近接スイツチ

Country Status (1)

Country Link
JP (1) JPS59190717A (OSRAM)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
DE19639650A1 (de) * 1996-09-26 1998-04-02 Sican Gmbh Integrierte Schaltung mit einem induktiven Bauelement und Verfahren zur Herstellung hierzu
US5909050A (en) * 1997-09-15 1999-06-01 Microchip Technology Incorporated Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
US6351033B1 (en) * 1999-10-06 2002-02-26 Agere Systems Guardian Corp. Multifunction lead frame and integrated circuit package incorporating the same
WO2006085363A1 (ja) * 2005-02-09 2006-08-17 Renesas Technology Corp. 半導体装置及び電子回路
US20060276157A1 (en) * 2005-06-03 2006-12-07 Chen Zhi N Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
JP5749066B2 (ja) * 2011-05-02 2015-07-15 新電元工業株式会社 インダクタ一体型リードフレーム、並びに、電子回路モジュール及びその製造方法
EP3183817B1 (de) * 2014-08-22 2021-05-05 Balluff GmbH Induktiver näherungssensor in integrierter bauweise

Also Published As

Publication number Publication date
JPS59190717A (ja) 1984-10-29

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