JPH0435560B2 - - Google Patents

Info

Publication number
JPH0435560B2
JPH0435560B2 JP60263888A JP26388885A JPH0435560B2 JP H0435560 B2 JPH0435560 B2 JP H0435560B2 JP 60263888 A JP60263888 A JP 60263888A JP 26388885 A JP26388885 A JP 26388885A JP H0435560 B2 JPH0435560 B2 JP H0435560B2
Authority
JP
Japan
Prior art keywords
plating
carbon fiber
fiber cloth
anode
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60263888A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62127492A (ja
Inventor
Shigeo Hoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP60263888A priority Critical patent/JPS62127492A/ja
Priority to US06/933,167 priority patent/US4713149A/en
Publication of JPS62127492A publication Critical patent/JPS62127492A/ja
Publication of JPH0435560B2 publication Critical patent/JPH0435560B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
JP60263888A 1985-11-26 1985-11-26 カ−ボン繊維を用いる電気めつきの方法 Granted JPS62127492A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60263888A JPS62127492A (ja) 1985-11-26 1985-11-26 カ−ボン繊維を用いる電気めつきの方法
US06/933,167 US4713149A (en) 1985-11-26 1986-11-21 Method and apparatus for electroplating objects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60263888A JPS62127492A (ja) 1985-11-26 1985-11-26 カ−ボン繊維を用いる電気めつきの方法

Publications (2)

Publication Number Publication Date
JPS62127492A JPS62127492A (ja) 1987-06-09
JPH0435560B2 true JPH0435560B2 (https=) 1992-06-11

Family

ID=17395644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60263888A Granted JPS62127492A (ja) 1985-11-26 1985-11-26 カ−ボン繊維を用いる電気めつきの方法

Country Status (2)

Country Link
US (1) US4713149A (https=)
JP (1) JPS62127492A (https=)

Families Citing this family (50)

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US4907733A (en) * 1988-03-28 1990-03-13 General Dynamics, Pomona Division Method for attaching carbon composites to metallic structures and product thereof
US5453174A (en) * 1992-07-16 1995-09-26 Electroplating Technologies Ltd. Method and apparatus for depositing hard chrome coatings by brush plating
US6113769A (en) * 1997-11-21 2000-09-05 International Business Machines Corporation Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal
US6497800B1 (en) * 2000-03-17 2002-12-24 Nutool Inc. Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
US7425250B2 (en) 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
RU2156836C1 (ru) * 1998-12-29 2000-09-27 Научно-исследовательский институт автоматизированных средств производства и контроля Способ электролитического нанесения покрытия на изделия с поверхностью двойной кривизны
KR20010020807A (ko) 1999-05-03 2001-03-15 조셉 제이. 스위니 고정 연마재 제품을 사전-조절하는 방법
RU2175032C2 (ru) * 1999-08-13 2001-10-20 Ким Вячеслав Елисеевич Способ электролитического хромирования
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US6884153B2 (en) * 2000-02-17 2005-04-26 Applied Materials, Inc. Apparatus for electrochemical processing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US6848970B2 (en) 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991526B2 (en) 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US6852208B2 (en) 2000-03-17 2005-02-08 Nutool, Inc. Method and apparatus for full surface electrotreating of a wafer
US7754061B2 (en) 2000-08-10 2010-07-13 Novellus Systems, Inc. Method for controlling conductor deposition on predetermined portions of a wafer
US6921551B2 (en) 2000-08-10 2005-07-26 Asm Nutool, Inc. Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
US6896776B2 (en) 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
KR100418816B1 (ko) * 2001-03-17 2004-02-19 정을연 전자단자의 금도금장치
US6572755B2 (en) 2001-04-11 2003-06-03 Speedfam-Ipec Corporation Method and apparatus for electrochemically depositing a material onto a workpiece surface
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
US20050061674A1 (en) 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7112270B2 (en) 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US7842169B2 (en) * 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
US7186164B2 (en) 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7390744B2 (en) 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US7648622B2 (en) 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
JP2005274265A (ja) * 2004-03-24 2005-10-06 Nippon M K S Kk 流量計
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7655565B2 (en) 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US7490519B2 (en) * 2005-09-30 2009-02-17 General Electric Company System and method for sensing differential pressure
US7422982B2 (en) 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
US8500985B2 (en) 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition
US11629427B2 (en) 2017-11-30 2023-04-18 Mitsubishi Electric Corporation Plating apparatus and plating method
CN109989082B (zh) * 2019-04-30 2021-02-02 仪征市华扬电镀有限公司 一种便于回收镀液的电刷镀装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706650A (en) * 1971-03-26 1972-12-19 Norton Co Contour activating device
JPS4884039A (https=) * 1972-02-14 1973-11-08
JPS55104498A (en) * 1979-02-02 1980-08-09 Inoue Japax Res Inc Electrodeposition processing apparatus

Also Published As

Publication number Publication date
US4713149A (en) 1987-12-15
JPS62127492A (ja) 1987-06-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees