JPH04355379A - Apparatus for inspecting printed circuit board - Google Patents

Abstract

PURPOSE:To perform the alignment of upper and under surface pattern electrodes with upper and under surface inspection electrodes with high accuracy by moving a lower inspection jig within the plane parallel to a board to be inspected to perform the alignment of upper and under surfaces. CONSTITUTION:A lower position detecting camera 52 detects the positional shift of an under surface pattern electrode 12 to an under surface inspection electrode 31 when a board 10 to be inspected is arranged above a lower inspection jig 30 through a gap in opposed relationship. An upper position detecting camera 53 detects the positional shift of an upper surface pattern electrode 11 to an upper surface inspection electrode 21 when the board 10 is held to the upper surface of the jig 30 in a contact state. A lower inspection jig moving table 54 receives the detection signal from the camera 52 to move the jig 30 so as to correct the positional shift state of the electrode 12 to the electrode 31 and receives the detection signal from the camera to move the jig 30 having the board 10 held thereto so as to correct the positional shift state of the electrode 11 to the electrode 21.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board inspection apparatus, and more particularly to a circuit board inspection apparatus for inspecting the electrical connection state of upper and lower pattern electrodes of a substrate to be inspected.

0002

2. Description of the Related Art Conventionally, for electrical testing of a circuit board having patterned electrodes formed on both upper and lower surfaces, a circuit board testing apparatus as shown in FIG. 6, for example, has been known. This circuit board inspection apparatus includes an upper inspection head 92 that holds an upper inspection electrode 91, a lower inspection head 94 that holds a lower inspection electrode 93, and an upper inspection jig that is brought into contact with the upper surface of the substrate 10 to be inspected. 20, and a lower inspection jig 30 that is brought into contact with the lower surface of the substrate 10 to be inspected. Upper inspection jig 20
is for electrically connecting the upper surface pattern electrode 11 of the substrate to be inspected 10 and the upper inspection electrode 91, and the upper surface inspection electrode 21 corresponding to the upper surface pattern electrode 11 is provided on the lower surface thereof.
is formed. The lower inspection jig 30 is the substrate to be inspected 1
0 electrically connects the lower surface pattern electrode 12 and the lower inspection electrode 93, and a lower surface inspection electrode 31 corresponding to the lower surface pattern electrode 12 is formed on the upper surface thereof. In the figure, reference numeral 13 denotes a through hole that electrically connects the upper pattern electrode 11 and the lower pattern electrode 12.

[0003] In order to electrically test the board to be tested 10 using the circuit board testing device as described above, it is necessary to
It is necessary to perform the alignment of the lower surface pattern electrode 12 with respect to the lower surface inspection electrode 31 with high precision.

On the other hand, in recent years, with the miniaturization of electrical equipment, etc., there has been a trend toward smaller test boards and higher density of patterned electrodes, and in particular, surface mount boards (SMT boards) are becoming widely used. .

[0005]

[Problems to be Solved by the Invention] However, in electrical testing of a small-sized board to be tested having such a high-density pattern of electrodes, the conventional circuit board testing method
There is a problem in that accurate testing cannot be performed because the pattern electrodes cannot be aligned with the testing electrodes with high precision.

The present invention has been made based on the above circumstances, and an object of the present invention is to perform top surface inspection even if the top surface pattern electrodes and bottom surface pattern electrodes of the substrate to be inspected are of high density. A circuit board inspection system that enables highly accurate alignment of the top pattern electrode to the test electrode and bottom pattern electrode to the bottom inspection electrode, and enables highly accurate electrical testing of small test boards. The goal is to provide equipment.

[0007]

[Means for Solving the Problems] The circuit board inspection apparatus of the present invention is a circuit board inspection apparatus that inspects the electrical connection state of the upper surface pattern electrode and the lower surface pattern electrode of the substrate to be inspected. An upper inspection jig in which a top inspection electrode corresponding to the top pattern electrode of the substrate is formed; a lower inspection jig in which a bottom inspection electrode corresponding to the bottom pattern electrode of the substrate to be inspected is formed on the top surface; an alignment mechanism that aligns the lower pattern electrode with respect to the inspection electrode and aligns the upper pattern electrode with respect to the upper inspection electrode, the alignment mechanism comprising a positioning pin and a lower position detection means. and,
It has an upper position detection means and a lower inspection jig moving means, and the positioning pin is provided to be movable between the upper limit level and the lower limit level, and the positioning pin at the upper limit level allows the substrate to be inspected to be moved. are placed above the lower inspection jig to face each other through a gap, and by moving the positioning pins to the lower limit level, the board to be inspected is in a state where its lower surface is in contact with the upper surface of the lower inspection jig. The lower position detection means detects the positional deviation of the lower pattern electrode with respect to the lower inspection electrode when the substrate to be inspected is placed above the lower inspection jig and facing each other with a gap therebetween. , the upper position detection means detects a positional deviation state of the upper pattern electrode with respect to the upper surface inspection electrode when the substrate to be inspected is held in opposition to the upper surface of the lower inspection jig, and detects the positional deviation state of the upper surface pattern electrode with respect to the upper surface inspection electrode, and moves the lower inspection jig. The means receives the detection signal from the lower position detection means and moves the lower inspection jig so as to correct the positional deviation state of the lower surface pattern electrode with respect to the lower surface inspection electrode, and also receives the detection signal from the upper position detection means. In response to this, the lower inspection jig holding the substrate to be inspected is moved so as to correct the misalignment of the upper pattern electrode with respect to the upper inspection electrode.

In the inspection method using the circuit board inspection apparatus of the present invention, an upper inspection jig and a lower inspection jig are brought into contact with the upper and lower surfaces of the substrate to be inspected, and the upper surface pattern electrode and the lower surface pattern of the substrate to be inspected are A circuit board inspection method for inspecting the electrical connection state of electrodes, in which a substrate to be inspected is placed under a lower surface inspection electrode corresponding to a lower surface pattern electrode of the substrate to be inspected on the upper surface in an alignment area. By setting the side inspection jig so as to face it with a gap above the side inspection jig, and moving the lower inspection jig in a plane parallel to the substrate to be inspected, the lower inspection jig corresponds to the lower surface pattern electrode of the substrate to be inspected. Align the lower inspection jig with the lower inspection electrode through the gap, and then move at least one of the lower inspection jig and the substrate to be inspected in the vertical direction to A lower surface alignment step in which the upper surface of the side inspection jig is held in opposition to the upper surface, and then the lower inspection jig holding the substrate to be inspected is moved in a plane parallel to the substrate to be inspected. This includes an upper surface alignment step of aligning the upper surface pattern electrode of the substrate to be inspected with the upper surface inspection electrode formed on the lower surface of the upper inspection jig.

[0009]

[Operation] In the circuit board inspection apparatus according to the present invention, the lower surface pattern electrode is highly aligned with respect to the lower surface inspection electrode by the lower surface alignment step of moving the lower inspection jig in a plane parallel to the substrate to be inspected. Can be done with precision. In addition, the upper surface pattern electrodes are aligned with the upper surface inspection electrodes with high precision through the upper surface alignment process in which the lower inspection jig holding the tested substrate is moved in a plane parallel to the tested substrate. be able to. Since the bottom surface alignment process and the top surface alignment process are performed independently, even if the origin of the top pattern electrode and the origin of the bottom pattern electrode of the board to be inspected are not located on the same vertical line, , each alignment is performed reliably. Therefore, even a small substrate to be inspected having a high density pattern of electrodes can be electrically inspected with high reliability.

Further, in the circuit board inspection apparatus according to the present invention, in response to the detection signal from the lower position detection means, the lower inspection jig is moved in a plane parallel to the board to be inspected, and the upper position is moved. Upon receiving the detection signal from the detection means,
A positioning mechanism including a lower inspection jig moving means that moves the lower inspection jig holding the substrate to be inspected in a plane parallel to the substrate to be inspected allows the lower surface alignment process and the upper surface position to be adjusted. The combining process can be performed independently. Moreover, since the lower surface positioning step and the upper surface positioning step are performed by a common lower inspection jig moving means, the configuration of the entire apparatus can be made compact.

[0011]

【Example】

<Circuit board inspection apparatus> Hereinafter, embodiments of the present invention will be described based on the drawings. FIG. 1 is a sectional view showing an example of a circuit board inspection apparatus of the present invention. In the figure, 92 is an upper test head that holds the upper test electrode 91, and 94 is a lower test head that holds the lower test electrode 93.

Reference numeral 20 denotes an upper inspection jig that electrically connects the upper surface pattern electrode 11 of the substrate 10 to be inspected and the upper inspection electrode 91, and is arranged in the inspection area B in this figure. An upper surface inspection electrode 21 corresponding to the upper surface pattern electrode 11 is formed on the lower surface of the upper inspection jig 20 .

Reference numeral 30 denotes a lower inspection jig that electrically connects the lower pattern electrode 12 of the substrate 10 to be inspected and the lower inspection electrode 93, and is arranged in the alignment area A in this figure. A lower surface inspection electrode 31 corresponding to the lower surface pattern electrode 12 is formed on the upper surface of the lower surface inspection jig 30 . Positioning through holes 35 and 15 are formed in the lower inspection jig 30 and the substrate to be inspected 10, respectively.

As shown in FIG. 7, the upper and lower surfaces of the lower inspection jig 30 have a sandwich structure in which anisotropically conductive elastomer sheets P are placed against each other, and the upper inspection jig 20 also has a sandwich structure. However, in other figures, illustration of this anisotropically conductive elastomer sheet is omitted. This anisotropically conductive elastomer sheet has conductivity only in the thickness direction, and may be a pressure conductive sheet that conducts electricity by applying pressure.

Reference numeral 50 denotes a positioning mechanism for aligning the lower pattern electrode 12 with respect to the lower surface inspection electrode 31, and also aligning the upper surface pattern electrode 11 with respect to the upper surface inspection electrode 21. The positioning mechanism 50 includes positioning pins 51, 51' and a lower position detection camera 5.
2, an upper position detection camera 53, and a lower inspection jig moving table 54, and is arranged in the alignment area A.

The upper inspection jig 20 is placed in an inspection area B having a reference position a certain distance D away from the reference position of the alignment area A. positioning pin 51,
51' is provided at a position within the alignment area A that is a certain distance D away from the reference positions b1 and b2 of the upper inspection jig 20, and at this position, it is vertically moved between the upper limit level H and the lower limit level L. It is movable. Here, the upper limit level H is defined as when the tips of the positioning pins 51 and 51' are inserted into the positioning through holes 35 and 15, respectively, and the substrate 1 to be inspected is
The lower limit level L is a level at which the tips of the positioning pins 51 and 51' do not reach the positioning through hole 35.

The outer diameter of the positioning pins 51, 51' is larger than the inner diameter of the positioning through hole 15 and smaller than the inner diameter of the positioning through hole 35. 51P and 51'P are small diameter tip portions of the positioning pins 51 and 51', respectively, and the outer diameters of the small tip diameter portions 51P and 51'P are smaller than the inner diameter of the positioning through hole 15.

The lower position detection camera 52 detects the misalignment of the lower pattern electrode 12 with respect to the lower inspection electrode 31, and the upper position detection camera 53 detects the misalignment of the upper pattern electrode 11 with respect to the upper inspection electrode 21. This is to detect a positional shift state.

The lower inspection jig moving table 54 has the lower inspection jig 30 placed on its upper surface, receives a detection signal from the lower position detection camera 52 or the upper position detection camera 53, and moves the lower inspection jig 30 to the lower inspection jig 30. The inspection jig 30 is moved by appropriate distances in the X direction, Y direction, and θ direction. Here,"
"X direction" is the direction of separation of the positioning pins 51, 51' from the reference positions b1, b2 of the inspection area B (left and right direction on the page)
The "Y direction" is a direction perpendicular to this direction (the depth direction of the plane of the paper), and the "θ direction" is a rotation direction in a plane parallel to the substrate 10 to be inspected.

M12 is an alignment mark formed on the bottom surface of the substrate 10 to be inspected (hereinafter referred to as "substrate bottom surface mark"), and M11 is an alignment mark formed on the top surface of the substrate 10 to be inspected (hereinafter referred to as "substrate top surface mark"). mark). Since these substrate lower surface marks and substrate upper surface marks are formed on the substrate to be inspected in the same process as the electrodes to be inspected, their positional relationship with the electrodes to be inspected on the same surface is extremely accurate. In addition, the marks on the bottom surface of the substrate and the marks on the top surface of the substrate may be used for patterns other than those specifically formed for that purpose, as long as they are made with the necessary precision and whose position can be easily detected, for example, on a part of the electrode to be inspected. It is possible to use

<Circuit board inspection method> Next, a circuit board inspection method using the circuit board inspection apparatus described above will be described. 2 to 5 are explanatory cross-sectional views showing an alignment mechanism that is a main part of the circuit board inspection apparatus described above.

[0022] Initial setting process: Using a board to be inspected whose good parts or defective parts are known, the positioning pin 51 is set when the board to be inspected is at the upper limit level H.
, 51', the mark on the bottom of the regular board,
The positions of the marks on the top surface of the substrate are stored in a position storage mechanism (not shown).

Lower surface positioning step As shown in FIG. H)
. At this time, the lower inspection jig 30 is inserted into the positioning through hole 3.
The inspection jig is placed on the upper surface of the lower inspection jig moving table 54 with positioning pins 51 and 51' inserted into the jig. on the other hand,
The inner diameter of the positioning through hole 15 of the substrate to be inspected 10 is smaller than the outer diameter of the positioning pins 51, 51', and the small tip diameter portion 51
Since the outer diameter of the substrate 10 is larger than the outer diameter of the positioning pins 51, 51', the small diameter portions 51P, 51' of the positioning pins 51, 51'
' held in P. Therefore, the substrate to be inspected 10 is
The lower surface thereof is set to face above the lower inspection jig 30 with a gap G in between, without coming into contact with the upper surface of the lower inspection jig 30. Through the above operations, the positions of the lower surface pattern electrode 12 and the lower surface inspection electrode 31 are roughly adjusted.

Further, in this state, the positional deviation of the lower pattern electrode 12 with respect to the lower surface inspection electrode 31 is detected by the lower position detection camera 52. Specifically, the position of the substrate lower surface mark M12 is compared with the stored position of the substrate lower surface mark to detect a positional deviation.

Next, in response to the detection signal from the lower position detection camera 52, the lower inspection jig moving table 54 moves within the same plane. Here, since the inner diameter of the positioning through hole 35 is larger than the outer diameter of the positioning pins 51 and 51', the lower inspection jig 30 placed on the upper surface of the lower inspection jig moving table 54 is It moves within the same plane together with the side inspection jig moving table 54. The lower inspection jig moving table 54 moves by an amount that cancels out the positional deviation between the position of the substrate lower surface mark M12 and the memorized position of the substrate lower surface mark,
Stop. Thereby, as shown in FIG. 3, the lower surface pattern electrode 12 and the lower surface inspection electrode 31 are aligned with each other via the gap G.

In this state, the positioning pins 51,
51' to the lower limit level L, as shown in FIG. 4, the lower surface pattern electrode 12 and the lower surface inspection electrode 31
The lower surface of the substrate to be inspected 10 is brought into contact with the upper surface of the lower inspection jig 30 in a state where the two are aligned. The above operations complete the bottom surface alignment process.

Upper surface alignment step After the lower surface alignment step is completed, the upper position detection camera 53 detects the positional deviation state of the upper surface pattern electrode 11 with respect to the upper surface inspection electrode 21. Specifically, the upper position detection camera 53 detects the board top surface mark M11.

Next, as shown in FIG. 5, in response to the detection signal from the upper position detection camera 53, the lower inspection jig moving table 54 moves within the same plane. Thereby, the lower inspection jig 30 holding the substrate to be inspected 10 moves within the same plane together with the lower inspection jig moving table 54. The lower inspection jig moving table 54 moves the substrate to be inspected 1
0 is moved by the predetermined distance D, it stops at the point where the upper surface pattern electrode 11 coincides with the upper surface inspection electrode 21. Through the above operations, the upper surface alignment step is completed, and then the substrate to be inspected 10 is moved by the predetermined distance D together with the lower inspection jig 30 and placed below the upper inspection jig 20.

Inspection step of the substrate to be inspected With the upper and lower surfaces of the substrate to be inspected 10 facing the lower surface of the upper inspection jig 20 and the upper surface of the lower inspection jig 30, respectively, the substrate to be inspected 10 and the upper inspection jig are The tool 20 and the lower inspection jig 30 are pressed by a press device (not shown) to form the upper pattern electrode 11 and the lower pattern electrode 1.
2, the electrical connection state thereof is inspected.

[0030]

According to the present invention, the alignment of the lower surface pattern electrode with respect to the lower surface inspection electrode and the alignment of the upper surface pattern electrode with respect to the upper surface inspection electrode can be performed with high accuracy, for example, about 10 μm, and the A small type with a high density pattern electrode, e.g. 0.25
Even circuit boards having electrodes arranged at a pitch of mm or less can be electrically inspected with high reliability. Moreover, since the lower surface alignment step and the upper surface alignment step are performed by a common lower inspection jig moving means, the overall structure of the apparatus is compact.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an example of a circuit board inspection device of the present invention.

FIG. 2 is an explanatory cross-sectional view showing a part of the positioning mechanism of the circuit board inspection apparatus.

FIG. 3 is an explanatory cross-sectional view showing a part of the positioning mechanism of the circuit board inspection apparatus.

FIG. 4 is an explanatory cross-sectional view showing a part of the positioning mechanism of the circuit board inspection apparatus.

FIG. 5 is an explanatory cross-sectional view showing a part of the positioning mechanism of the circuit board inspection apparatus.

FIG. 6 is an explanatory cross-sectional view of a circuit board inspection apparatus used for electrical inspection of a circuit board on which pattern electrodes are formed on both upper and lower surfaces.

FIG. 7 is an explanatory cross-sectional view of the lower inspection jig.

[Explanation of symbols]

10 Board to be inspected
11 Upper pattern electrode 12 Lower pattern electrode 1
3 Through hole 15 Positioning through hole 20 Upper inspection jig 21
Top surface inspection electrode 30
Lower inspection jig 31 Electrode for lower inspection
35 Positioning through hole 36 Monitoring window
50 Positioning mechanism 51 Positioning pin
51' Positioning pin 51P Small diameter tip
51'P Small tip diameter part 5
2 Lower position detection camera 53
Upper position detection camera 54 Lower inspection jig moving table M11 Board upper surface mark M12 Board lower surface mark 91 Upper inspection electrode
92 Upper inspection head 93 Lower inspection electrode
94 Lower inspection head

Claims (1)

[Claims] 1. A circuit board inspection device for inspecting the electrical connection state of upper surface pattern electrodes and lower surface pattern electrodes of a substrate to be inspected, comprising: an upper surface inspection electrode corresponding to the upper surface pattern electrode of the substrate to be inspected on the lower surface; a lower inspection jig having a lower inspection jig formed thereon, and a lower inspection jig having a lower inspection jig formed on the upper surface thereof corresponding to the lower surface pattern electrode of the substrate to be inspected;
an alignment mechanism that aligns the bottom pattern electrode with respect to the bottom inspection electrode and aligns the top pattern electrode with the top inspection electrode; the alignment mechanism includes a positioning pin and a bottom position detection mechanism; means, an upper position detection means, and a lower inspection jig moving means, the positioning pin is provided movably between an upper limit level and a lower limit level, and the positioning pin at the upper limit level allows The board to be inspected is placed above the lower inspection jig so as to face each other through a gap, and by moving the positioning pin to the lower limit level, the lower surface of the board to be inspected is brought into contact with the upper surface of the lower inspection jig. The lower position detection means detects the positional deviation state of the lower pattern electrode with respect to the lower inspection electrode when the substrate to be inspected is placed above the lower inspection jig with a gap therebetween. The upper position detection means detects the positional deviation state of the upper pattern electrode with respect to the upper surface inspection electrode when the substrate to be inspected is held in contact with the upper surface of the lower inspection jig, and detects the positional deviation state of the upper surface pattern electrode with respect to the upper surface inspection electrode, The jig moving means receives the detection signal from the lower position detection means and moves the lower inspection jig so as to correct the positional deviation state of the lower surface pattern electrode with respect to the lower surface inspection electrode, and also receives the detection signal from the upper position detection means. A circuit board inspection apparatus characterized in that, in response to a detection signal, a lower inspection jig in which a board to be inspected is held is moved so as to correct a positional deviation state of an upper surface pattern electrode with respect to an upper surface inspection electrode.