JPH04354348A - Insulating film for inspection of semiconductor element and inspection device and inspection method - Google Patents

Abstract

PURPOSE:To provide an insulating film for inspection of a semiconductor element and an inspecting device and an inspecting method which can solve the theme of a conventional inspecting device wherein a mechanical probe is used, and can perform the inspection of a semiconductor element simply, and can prevent short circuit even in inspection, and can easily perform the matching of impedance, too. CONSTITUTION:A semiconductor element is placed on an inspection circuit 5 and is connected by inserting a metallic projection in this through hole 4, using an insulating film 3 where a through hole 4 in which to insert the metallic projection 2 of the semiconductor element 1, and then it is inspected whether the semiconductor element is good or bad.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating film for testing semiconductor devices, an apparatus for testing semiconductor devices, and a method for testing semiconductor devices.

0002

2. Description of the Related Art In recent years, with the development of electronic equipment, devices and equipment that use many semiconductor devices have become smaller, thinner, and lighter, and as a result, it is necessary to mount semiconductor elements at a high density on a substrate of a certain area. Therefore, a so-called area chip has been developed in which the semiconductor device used does not have electrode pads on the periphery of the device as in conventional devices, but pads are also formed on the inner surface of the device.

Conventionally, needle-type mechanical probes have been used to test semiconductor devices, but they have a lifespan of only 10,000 to 20,000 contacts for high-density semiconductor devices, and The pinching blade and needle can easily become misaligned, bent, or short-circuited, making inspection impossible. In particular, it is almost impossible to arrange needles for the above-mentioned high-density area chips. Furthermore, with mechanical probes, large stress is applied to the contact area of the needle during inspection, so the needle or blade may pierce the metal protrusions on the semiconductor element, damaging the metal protrusions during inspection and producing defective products. Further, since it is difficult to perform impedance matching using the needle itself, a complicated test circuit structure cannot be adopted.

0004

[Problems to be Solved by the Invention] The present invention solves various problems in testing semiconductor devices using the above-mentioned conventional mechanical probe, and makes it possible to relatively easily inspect the electrode section (tested section) of the semiconductor device and the inspection circuit. The purpose of this invention is to provide an inspection system that can be aligned to the target position and eliminate undesirable short circuits and damage during inspection.

[0005]

[Means for Solving the Problems] In order to achieve the above object, the inventors of the present invention have made extensive studies and have developed an insulator with a through hole in a position facing a metal protrusion on an electrode pad of a semiconductor element. Semiconductor elements can be transported by using a film and inserting metal protrusions into the through holes.Moreover, by simply placing this carrier on the wiring pattern on the test circuit board, the test circuit and the metal protrusions can be transferred. The present invention was completed based on the discovery that it is possible to accurately and align the connections.

That is, the present invention provides a semiconductor device for testing semiconductor devices characterized by having a through hole into which a metal protrusion on an electrode pad of a semiconductor device can be inserted, and having a thickness smaller than the height of the metal protrusion. The present invention provides an insulating film, a testing method using the insulating film to transport a semiconductor device onto a test circuit and connecting it to the test circuit, and a circuit for testing the semiconductor device formed on one side of the insulating film. The purpose of the present invention is to provide a testing device including a semiconductor device, and a testing method in which a semiconductor element is placed on the testing device and connected to a testing circuit.

[0007]

EXAMPLES Examples of the present invention will be explained in detail below with reference to the drawings.

FIG. 1 is a cross-sectional view for explaining the process of transporting a semiconductor device and connecting it to a test circuit using the insulating film for testing semiconductor devices of the present invention, and FIG. A cross-sectional view of the state in which a metal protrusion of a semiconductor element is inserted into a hole, placed, and transported. Figure 3 is a cross-sectional view showing a state in which this transport body is aligned with a test circuit and connected by a pressure press. be.

In FIG. 1, the electrode pads (
(not shown) has a metal protrusion 2 made of material such as solder, gold, silver, copper, etc., with a height of about 10 to 200 μm and a diameter (width) of 1
The metal protrusions 2 are formed to have a size of about 0 to 500 μm, and the semiconductor element 1 is connected and fixed to the test circuit (wiring pattern) 5 by the metal protrusions 2 . As shown in FIG. 1, the insulating film 3 for semiconductor device inspection of the present invention
It has a through hole 4 into which the protrusion 2 can be inserted at a position opposite to the metal protrusion 2 that the metal protrusion 2 has. Further, the thickness of the insulating film 3 is smaller than the height of the metal protrusion 2, and therefore, when the metal protrusion 2 is inserted into the through hole 4 and is being transported, as shown in FIG.
As shown in FIG. 2, a metal protrusion 2 slightly protrudes from a through-hole portion on the surface of the insulating film 3 opposite to the surface on which the semiconductor element is placed.

In addition, the insulating film 3 is provided with a well-known alignment mark 9 at a position relative to the through hole 4 in order to accurately align the test circuit to a predetermined position (wiring pattern 5). It is provided by means,
Place it securely while checking with a camera etc. when aligning.
Can be fixed. Furthermore, a through hole 4' for positioning may be provided by drilling or other means, and a window 6 may be provided for marking a semiconductor element 1 determined to be defective by inspection.

In the present invention, the semiconductor element 1 is placed on an insulating film 3 as shown in FIG. can. By making it long like this,
Semiconductor elements can be continuously supplied in a semiconductor device testing process, and testing efficiency can be improved.

The semiconductor element 1 connected to the test circuit 5 is
As shown in FIG. 3, the pressure press 7 securely connects the test circuit. At this time, since the insulating film 3 is interposed between them, the distance between the semiconductor element 1 and the test circuit 5 can be maintained at a constant distance, and the insulating film 3 acts like a wall material between each metal protrusion 2 to ensure reliable Since it is insulated, there will be no short circuit.

The material of the insulating film 3 used in the present invention is not limited as long as it has electrical insulating properties.
For example, thermosetting resins and thermoplastic resins such as polyester resins, epoxy resins, urethane resins, polystyrene resins, polyethylene resins, polyamide resins, polyimide resins, ABS resins, polycarbonate resins, silicone resins, and fluorine resins. It can be used regardless of. Among these materials, polyimide resin is preferably used from the viewpoint of heat resistance and mechanical strength.

Through holes 4 formed in the insulating film 3
is important for inserting the metal protrusion 2 of the semiconductor element 1 into the hole 4, transporting the semiconductor element 1, and connecting and fixing the semiconductor element 1 to the inspection circuit 5, and the hole diameter is 100 to 50% of the diameter of the metal protrusion 2.
0% (approximately 100-500 μm), preferably 120-2
00% (approximately 120 to 200 μm), and the depth of the through hole (film thickness) is 5 to 200% (approximately 5 to 200 μm) of the height of the metal protrusion 2.
00 μm), preferably about 50 to 90% (about 50 to 9
0 μm). Mechanical processing, laser processing, optical processing, chemical etching methods, etc. can be used to form the through hole 4, and half etching or perforation processing using excimer laser irradiation is preferable from the viewpoint of processing accuracy and etching factor (small taper angle). .

FIG. 4 is a sectional view showing another embodiment of the insulating film for testing semiconductor devices according to the present invention.
An adhesive layer 7 for temporary fixing to the test circuit 5 is formed on the surface opposite to the surface on which the semiconductor element 1 is placed. By forming the adhesive layer 7 in this way, it is possible to reliably prevent misalignment when placing the test circuit 5 on the test circuit 5 or connecting it with the pressure press 7.

Further, in the present invention, as shown in FIG. 5, a test circuit 5 is formed in advance on the insulating film 3 by laminating means or patterning means of a two-layer substrate of a metal layer and an insulating film. It is practically preferable to use it as an inspection device. By using the testing apparatus as shown in FIG. 5, testing can be easily performed by simply placing and connecting the semiconductor element 1. In this case, since the test circuit 5 can be processed by normal photo-etching, impedance matching can be easily achieved. Furthermore, an electrical contact layer (not shown, omitted) made of chromium, tungsten, rhodium, or an alloy thereof is provided on the test circuit surface of the test device of the present invention.
It is preferable to form the layer with a thickness of about 0.1 to 100 μm. By providing the electrical contact layer in this manner, the life of the inspection device can be greatly extended, and furthermore, contamination due to oxide film residue generated on the metal protrusions 2 can be prevented.

The testing device of the present invention has the testing circuit 5 formed on one side of the insulating film 3 as described above, but the testing circuit 5 is formed in multiple layers as shown in FIG. By connecting the layers through via holes 8 filled with a conductive material such as metal, various inspection devices can be set up depending on the purpose. The via hole can be formed by the above-mentioned through hole forming means or a known drilling means.

[0018]

[Effects of the Invention] As described above, the present invention uses an insulating film in which through-holes are formed into which metal protrusions on the electrode pads of semiconductor elements can be inserted, and thereby the semiconductor elements are transported and connected to a test circuit. Therefore, it is easy to transport and inspect the semiconductor device, and it is also easy to align the semiconductor device to the connecting portion.

Furthermore, since the semiconductor element is connected to the test circuit through the insulating film, insulation between the semiconductor element and the test circuit and between each electrode pad can be ensured, and short circuits can be prevented. Furthermore, in the case of test equipment with a test circuit, impedance matching is easy, and semiconductor devices with high frequency characteristics can be tested easily. It can also be fully applied to devices.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view for explaining a process of transporting and testing a semiconductor device using the insulating film for semiconductor device testing of the present invention.

FIG. 2 is a cross-sectional view of a state in which a semiconductor element is placed on the insulating film shown in FIG. 1 and transported.

FIG. 3 is a cross-sectional view showing a state in which a semiconductor element is connected to a test circuit.

FIG. 4 is a sectional view showing another example of the insulating film of the present invention.

FIG. 5 is a sectional view showing an embodiment of the inspection device of the present invention.

FIG. 6 is a sectional view showing another embodiment of the inspection device of the present invention.

[Explanation of symbols]

1 Semiconductor element 2 Metal protrusion 3 Insulating film 4 Through hole 5 Test circuit 7 Adhesive layer

Claims (6)

[Claims] 1. An insulating film for testing semiconductor devices, characterized in that a through hole is formed into which a metal protrusion on an electrode pad of a semiconductor element can be inserted, and the film has a thickness smaller than the height of the metal protrusion. 2. The insulating film for testing semiconductor devices according to claim 1, wherein an adhesive layer for temporary fixing to a test circuit is formed on one side of the insulating film for testing semiconductor devices. 3. An inspection device comprising a circuit for inspecting a semiconductor element formed on one side of the insulating film according to claim 1. [Claim 4] Chromium, tungsten,
4. The inspection device according to claim 3, further comprising an electrical contact layer made of rhodium or an alloy thereof. 5. An inspection method comprising the step of inserting a metal protrusion on an electrode pad of a semiconductor element into the through hole of the inspection apparatus according to claim 3 or 4, and connecting the inspection circuit and the metal protrusion. 6. The insulating film for semiconductor device testing according to claim 1 or 2, with the metal projections on the electrode pads of the semiconductor device inserted into the through holes, is transported onto the testing circuit of the semiconductor device, connected, and tested. An inspection method characterized by connecting a circuit and the metal protrusion.