JPH04350991A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To obtain a high-accuracy printed wiring board with good efficiency by a method wherein a mask film is aligned, in a short time and with high accuracy, with a board which has been coated with an electrodeposition-type photoresist. CONSTITUTION:The title manufacture is featured in the following manner: holes (h) for alignment use are made in a copper-clad laminated board 1a and in two mask films 2A on the surface and the rear; and the mask films 2A are aligned with and bonded to, by one operation, the surface and the rear of said board 1a coated with a photoresist by using a spacer 4 which bonds and holds the two mask films 2A in advance and by using an alignment stand 5 wherein alignment pins 3 have been erected and installed. The displacement of the alignment of the mask films on the surface and the rear is eliminated, and a high-accuracy printed wiring board can be manufactured in a short time by one alignment operation of the mask films.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing printed wiring boards, and more particularly to a method for aligning and adhering mask films.

0002

2. Description of the Related Art FIG. 2 is an explanatory diagram showing a mask film positioning procedure in a conventional printed wiring board manufacturing process. In FIG. 2, reference numeral 1 denotes a substrate in which alignment holes h are formed in a copper-clad laminate 1a, copper plating and photoresist coating are applied, 2 is a mask film (hereinafter referred to as film), and 3 is a predetermined portion of the substrate 1. This is a positioning pin that is inserted into the positioning hole h for positioning the film at the position.

FIG. 3 is an explanatory diagram showing a conventional method of aligning and bonding a film to a substrate 1 without alignment holes. 1 to 3 are the same as the above conventional example, and 4 is a bonding method for aligning and bonding a film to a substrate 1 without alignment holes. This spacer has dimensions equivalent to the thickness of the substrate 1 on which the side edges of the front and back films to be aligned on both sides are adhered in advance.

Next, the alignment of the film 2 will be explained. First, in FIG. 2, films 2 and 2 are bonded to predetermined positions on both the front and back surfaces of the substrate 1, which has holes drilled in the copper-clad laminate 1a for alignment and coated with copper-plated photoresist.
Drill a hole h for positioning in advance. Then,
The alignment pins 3 are inserted into the holes h of the substrate 1 and the film 2, and the substrate 1 and the film 2 are aligned and bonded.

In addition, in FIG. 3, spacers 4 having approximately the same thickness as the inner layer substrate 1 without alignment holes are mainly used.
Place and adhere the front and back films 2 so that they do not come off. Next, the substrate 1 is inserted between the front and back films 2, 2 which are adhered and held by the spacer 4, the films 2 are aligned, and the films 2, 2 are adhered to the front and back sides of the substrate 1.

[0006]

[Problems to be Solved by the Invention] In the conventional printed wiring board manufacturing method, mask films are aligned using the steps described above. 2 must be aligned individually, and the front and back mask films 2,
There have been disadvantages such as the alignment position of the mask film 2 being easily misaligned, and the mask film 2 having to be aligned twice with respect to one substrate 1, which takes time. In addition, when aligning the mask film 2 using the spacer 4, the mask film only needs to be aligned once, and the front and back mask films 2, 2
However, for substrates with alignment holes, the adhesiveness of photoresists such as electrodeposited photoresists makes delicate alignment extremely difficult. There were problems such as it could only be applied to substrates without holes.

This invention was made in order to solve the problems of the conventional example as described above, and it is possible to prevent the front and back mask films from shifting in position when aligning the mask films, and to adjust the front and back sides with one alignment. An object of the present invention is to provide a method for manufacturing a printed wiring board, which enables alignment of a mask film to a substrate, thereby enabling highly accurate positioning and adhesion of the mask film in a short time.

[0008]

[Means for solving the problem] After applying copper plating to both sides of a copper-clad laminate and then positioning and adhering a mask film on the photoresist coating on both sides of the substrate coated with photoresist to serve as an etching resist. , in a method of manufacturing a printed wiring board in which a circuit pattern is formed by exposure, development, and etching, holes for alignment are provided in the copper-clad laminate and the mask film in advance, and one of each of the two mask films on the front and back sides is formed. Alignment in which alignment pins are installed upright to insert and align the substrate between a spacer having the same thickness as the substrate whose side edges are aligned and adhesively held, and the mask film which is adhesively held to this spacer. The above objective is achieved by aligning and adhering the mask film to the front and back sides of the substrate in one step using a stand.

[0009]

[Function] The method for manufacturing a printed wiring board according to the present invention having the above-described structure includes alignment holes provided in the copper-clad laminate and the mask film, and a spacer for adhering and holding the two mask films on the front and back sides in advance. and an alignment table with alignment pins standing upright, the mask film is bonded to both the front and back sides of the substrate coated with photoresist in one go, without any misalignment, in a short time. This allows highly accurate circuit patterns to be formed extremely efficiently.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. (Structure) FIG. 1 is an explanatory diagram of a mask film positioning procedure in a printed wiring board manufacturing process showing an embodiment of the present invention. Note that the same or equivalent parts as in the conventional example are represented by the same reference numerals.

In FIG. 1, 1A is a substrate in which alignment holes h are drilled in a copper-clad laminate 1a, and copper plating and electrodeposited photoresist coating, which is an example of a photoresist, are applied, and 2A is a substrate for alignment. A mask film (hereinafter referred to as a film) with holes h drilled therein, and 5 a positioning stand on which positioning pins (hereinafter referred to as pins) 3 are installed upright to position the film 2A on the front and back sides of the substrate 1A. be.

(Operation) The manufacturing operation procedure will be explained based on the above configuration.

In FIG. 1, the alignment holes (
Hereinafter, it is called a dowel hole. ) Fit the pin 3 into the positioning table 5, which has a hole h1 drilled at the same position as h, and stand it upright. Next, one side edge of each of the front and back films 2A, 2A with holes h drilled at the same positions as the dowel holes h is placed on the substrate 1 in advance.
The holes h, h of the combination films 2A, 2A aligned on both sides of the spacer 4 having the same thickness as A and adhesively held at the same position are inserted into the pin 3. Next, lift the upper film 2A and insert the pin 3 into the alignment hole h of the substrate 1A as shown in FIG. 1(b). Next, the lifted mask film 2A is lowered onto the substrate 1A, aligned and bonded to the substrate 1A. The substrate 1A with this film 2A aligned is placed between the front and back films 2A and 2A as shown in FIG.
film 2 by taking it out from pin 3 together with
A, 2A are aligned and bonded to the front and back sides of the substrate 1A in one step. A circuit pattern is formed by exposing this, developing, etching, and removing the resist.

As described above, the film 2A can be accurately positioned on the front and back sides of the substrate 1A in one go, and can be bonded onto the substrate 1A very easily in a short period of time.

[0015]

As explained above, according to the present invention, alignment holes are provided in advance in the copper-clad laminate and the mask film, and the spacers and alignment pins that adhesively hold the front and back mask films are placed in an upright position. Since the mask film is aligned in one go on the front and back sides of the substrate coated with photoresist using the installed alignment table, the mask film can be aligned quickly and easily without any misalignment between the front and back sides. It can be carried out.

[0016] Thereby, a highly accurate printed wiring board can be manufactured with high efficiency, and the quality of the printed wiring board can be improved and the cost can be reduced.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of a mask film positioning procedure in a printed wiring board manufacturing process showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a procedure for positioning a mask film in a conventional printed wiring board manufacturing process.

FIG. 3 is a diagram illustrating a procedure for positioning a mask film in another conventional example.

[Explanation of symbols]

1A board 2A Mask film 3 Positioning pin 4 Spacer 5 Positioning table h Positioning hole Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] [Claim 1] Copper plating is applied to both sides of a copper-clad laminate,
Furthermore, in the method of manufacturing a printed wiring board, a method for manufacturing a printed wiring board in which a mask film is aligned and bonded onto the photoresist coating film on both sides of a substrate coated with a photoresist serving as an etching resist, and then a circuit pattern is formed by exposure, development, and etching. A spacer having a thickness equivalent to that of the substrate, which has alignment holes provided in advance in the copper-clad laminate and the mask film, and aligns and adhesively holds one side edge of each of the two mask films on the front and back; The mask film is aligned and bonded to the front and back sides of the substrate in one go using a positioning stand with alignment pins installed upright for inserting and aligning the substrate between the mask films adhered and held by the spacer. A method for manufacturing a printed wiring board, characterized by: