JPH043503Y2 - - Google Patents
Info
- Publication number
- JPH043503Y2 JPH043503Y2 JP1985144495U JP14449585U JPH043503Y2 JP H043503 Y2 JPH043503 Y2 JP H043503Y2 JP 1985144495 U JP1985144495 U JP 1985144495U JP 14449585 U JP14449585 U JP 14449585U JP H043503 Y2 JPH043503 Y2 JP H043503Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- printed circuit
- circuit board
- mounting base
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985144495U JPH043503Y2 (US20100154141A1-20100624-C00001.png) | 1985-09-20 | 1985-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985144495U JPH043503Y2 (US20100154141A1-20100624-C00001.png) | 1985-09-20 | 1985-09-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6252942U JPS6252942U (US20100154141A1-20100624-C00001.png) | 1987-04-02 |
| JPH043503Y2 true JPH043503Y2 (US20100154141A1-20100624-C00001.png) | 1992-02-04 |
Family
ID=31055152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985144495U Expired JPH043503Y2 (US20100154141A1-20100624-C00001.png) | 1985-09-20 | 1985-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH043503Y2 (US20100154141A1-20100624-C00001.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818069B1 (US20100154141A1-20100624-C00001.png) * | 1968-09-28 | 1973-06-02 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818069U (US20100154141A1-20100624-C00001.png) * | 1971-07-07 | 1973-03-01 | ||
| JPS5993170U (ja) * | 1982-12-15 | 1984-06-25 | 三洋電機株式会社 | フラツトパツケ−ジ型ｉｃの取付構造 |
-
1985
- 1985-09-20 JP JP1985144495U patent/JPH043503Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818069B1 (US20100154141A1-20100624-C00001.png) * | 1968-09-28 | 1973-06-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6252942U (US20100154141A1-20100624-C00001.png) | 1987-04-02 |
