JPH04350165A - Method and device for passing-type sputtering - Google Patents

Abstract

PURPOSE:To effectively utilize a target by expanding, contracting and moving plasma by so slight a superimposed magnetic field as not to affect a discharge state by an outer solenoid coil. CONSTITUTION:An inner magnetic pole 17A is annularly arranged with the center line of a rectangular target 5 as its axis. An outer magnetic pole 17B is annularly arranged outside. An intermediate magnetic pole 17C is annularly arranged between the inner and outer magnetic poles 17A and 17B. An outer solenoid coil 18 is set outside the outer magnetic pole 17B. The magnetization directions of the magnetic poles 17A, 17B and 17C are opposed to one another with the center line of the target 5 as the symmetry axis, and the magnetid force of the outer magnetic pole 17B is made relatively weak with respect to that of the inner magnetic pole 17A. The plasma is expanded, contracted and moved by so slight a superimposed magnetic filed as not to affect a discharge state by the outer solenoid coil 18 with a vertical magnetic field component on the upper surface of the target 5 and the gentle gradient by using this magnetic pole structure. A film is formed at a low cost in this way.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention enables plasma to expand and contract in pass-through sputtering using a rectangular target using a small convoluted magnetic field that does not affect the discharge state.
The present invention relates to a pass-through sputtering method and apparatus that enable effective use of targets.

0002

2. Description of the Related Art In recent years, there has been an increasing demand for uniformly forming thin films on large-area substrates using sputtering equipment. In conventional magnetron sputtering equipment, a plasma ring is formed by a leakage magnetic field from a magnetic pole placed on the back surface of the target to the top surface of the target. As a result, the leakage magnetic field on the top surface of the target was unevenly distributed, causing variations in plasma density, and consumption of the target increased significantly in areas of high-density plasma, leading to the end of the target's lifespan. As a result, the utilization rate of targets is poor, and in the case of expensive targets, large production costs are required.

Conventionally, improvements have been made to magnetic circuits that generate plasma rings as uniformly and over a wide range as possible, but at present, sufficient effects have not been achieved. As a countermeasure for the above, for example, JP-A-62-1144
A plasma-controlled magnetron sputtering apparatus described in Japanese Patent No. 12 has been proposed. This combines the magnetic field created by the conventional magnetron magnetic poles with the magnetic fields generated by the inner and outer solenoid coils to expand and contract the plasma generation region with respect to the target center, thereby increasing the target utilization rate. However, with this method, when the plasma expands and contracts, the strength of the magnetic field that confines the plasma also changes, and as a result, the discharge impedance changes as the plasma moves, and the distribution of film quality changes. arise. Furthermore, as the target size increases, a large amount of electric power is required to generate the desired magnetic field by the solenoid coil, but since a large amount of heat is generated from the coil itself, the coil needs to be cooled. However, there is no improvement measure that satisfies the conflicting issues of coil insulation and cooling.
Currently, there is a limit to the power that can be input to the solenoid coil, and it is currently not possible to obtain a convoluted magnetic field that allows sufficient plasma movement.

0004

[Problems to be Solved by the Invention] The present invention has been made in view of the above points, and provides sputtering that enables effective use of targets by expanding and contracting plasma with a small convoluted magnetic field that does not affect the discharge state. The present invention aims to provide methods and apparatus. The problem to be solved by the present invention will be explained using a diagram of a conventional pass-through sputtering apparatus using a rectangular cathode shown in FIG.

FIG. 4 shows the main configuration of the conventional method, and FIG. 5 shows the leakage magnetic field distribution to the upper surface of the target and the erosion pattern of the target. 4 and 5, 1 is a vacuum container, 2 is a substrate heater that heats the substrate to a predetermined temperature, 3 is a substrate, 3A is a transport mechanism for transferring the substrate, and 4 is an opening in the direction of substrate passage. Adjustable shutter, 5 is a rectangular target, 6 is a rectangular cathode, 7A is a rod-shaped central magnetic pole, 7B is an annular outer magnetic pole arranged to surround 7A, 8 is a magnetically connected central magnetic pole 7A and outer peripheral magnetic pole 7B. A magnetic yoke to be coupled, 9A is a schematic diagram of magnetic lines of force for confining plasma, 10A is a schematic diagram of a racetrack-shaped plasma ring confined by magnetic lines of force 9A on the upper surface of the target, 11 is a main discharge that supplies power to the rectangular cathode 6 12A is the horizontal magnetic field component on the upper surface of the target, 13A is the vertical magnetic field component on the upper surface of the target, and 14A is the target erosion pattern consumed by the racetrack plasma ring.

[0006] The substrate 3 is carried into the vacuum chamber 1 via a gate valve (not shown), heated by the substrate heater 2, and then passed over the upper surface of the target at a constant speed by the transport mechanism 3A. At this time, the rectangular target 5 is sputtered by the racetrack-shaped plasma ring 10A generated on the upper surface of the target due to the leakage magnetic field generated by the central magnetic pole 7A and the outer peripheral magnetic pole 7B placed on the back of the target, and a film is formed on the substrate 3 as it passes. be done. The strength of the leakage magnetic field on the top surface of the target causes a distribution in the confined plasma density, which causes target erosion to proceed unevenly. Figure 5 shows the magnetic field distribution on the top surface of the target and the target erosion pattern.
At a position where the vertical magnetic field component 13A crosses substantially zero, target erosion 14A progresses significantly and is consumed into a substantially V-shaped valley. Therefore, when the target 5, which has an extremely low target utilization rate and is expensive, is used, it becomes a serious problem because the production cost is high.

Next, the problem to be solved by the present invention will be explained using a drawing of a plasma-controlled sputtering apparatus shown in FIG. 7, which was considered as an improvement measure for the above. Figure 7 shows the main configuration of the plasma-controlled sputtering equipment.
FIG. 8 shows the relationship of the target erosion pattern by manipulating the leakage magnetic field distribution to the upper surface of the target. Figure 7
, In Fig. 8, the same symbols as Figs. 4 and 5 refer to Fig. 4.
, which shows the same as that in FIG.

In FIGS. 7 and 8, 15A indicates the central magnetic pole 7.
Inner circumferential solenoid coil arranged between A and outer circumferential magnetic pole 7B, 15B is an outer circumferential solenoid coil arranged so as to surround the outer circumferential magnetic pole, 12B is inner circumferential solenoid coil 1
5A and the horizontal magnetic field component on the top surface of the target when the outer solenoid coil 15B is excited in the positive direction (the direction in which the lines of magnetic force go toward the inside of the coil), 13B is the vertical magnetic field component on the top surface of the target in that case, and 9B is the plasma in that case. A schematic diagram of magnetic lines of force for containment, 10B is a schematic diagram of a racetrack-shaped plasma ring confined on the upper surface of the target by magnetic lines of force 9B, 14B is the target erosion pattern in that case, and 12C is the inner circumferential solenoid coil 1
5A and the horizontal magnetic field component on the top surface of the target when the outer solenoid coil 15B is excited in the negative direction (the direction in which the lines of magnetic force go toward the outside of the coil), 13C is the vertical magnetic field component on the top surface of the target in that case, and 9C is the plasma in that case. A schematic diagram of magnetic lines of force for confinement, 10C is a schematic diagram of a racetrack-shaped plasma ring confined by magnetic lines of force 9C on the upper surface of the target, 14C is the target erosion pattern in that case, 16 is a racetrack-shaped plasma ring 10B to 10A to 10C This is the target erosion pattern that can be comprehensively obtained by scaling up and down.

In the device shown in FIG. 7, similarly to the prior art shown in FIG. 4, a substrate 3 is carried into a vacuum container 1 via a gate valve (not shown), heated by a substrate heater 2, and further, The transport mechanism passes over the top surface of the target at a constant speed. At this time, a plasma ring is formed on the top surface of the target by combining the leakage magnetic field generated by the central magnetic pole 7A and the outer magnetic pole 7B placed on the back of the target with the magnetic fields generated by the inner solenoid coil 15A and the outer solenoid coil 15B. 10B~10A~
As shown in 10C, a rectangular target 5 is sputtered while expanding and contracting with respect to the center of the target, and a film is formed on the substrate 3 as it passes. Since the position of the V-shaped valley where target erosion is noticeable can be expanded or contracted with respect to the center of the target, the target can be used more effectively than in the case shown in FIG.

FIG. 8 shows the magnetic field distribution on the upper surface of the target and the target erosion pattern. In order to move the position of the approximately V-shaped valley where target erosion is noticeable, the vertical magnetic field component 13A is increased or decreased from 13B to 13C. It is necessary to do so. However, along with this, the horizontal magnetic field component 12A is also 12B
~12C, which also affects the discharge voltage. As the discharge voltage increases, the energy of the recoil molecules also increases,
This will damage the film and cause uneven distribution of film quality. Furthermore, the vertical magnetic field component 1 on the top surface of the target
In order to increase or decrease 3A from 13B to 13C, it is necessary to generate a large convoluted magnetic field in the inner and outer solenoid coils, but a large current must be applied to the coil, and along with this, a large amount of current is generated from the coil itself. A large amount of heat is generated, and the coil needs to be cooled. Originally, the coil itself has an insulating coating with poor thermal conductivity on the surface of the wire to improve insulation, so the cooling efficiency is extremely poor.In other words, there is no way to satisfy the conflicting issues of insulation and cooling efficiency. However, due to insufficient cooling of the coil, continuous operation was not possible while generating a magnetic field of the size necessary to move the plasma.

[0011]

[Means for Solving the Problems] The present invention has been made in view of the above points, and aims to expand and contract plasma by operating a peripheral solenoid coil with a small convoluted magnetic field that does not affect the discharge state, thereby making the target effective. The purpose of the present invention is to provide a sputtering method and apparatus that can be used. The present invention has an inner circumferential magnetic pole arranged in an annular shape (racetrack shape) with the center line in the longitudinal direction of a rectangular target as an axis of symmetry, and an annular magnetic pole arranged in an annular manner so as to surround the outside of the inner circumferential magnetic pole with the same axis of symmetry. It consists of an outer circumferential magnetic pole, an intermediate magnetic pole arranged annularly between the inner circumferential magnetic pole and the outer circumferential magnetic pole, and an outer circumferential solenoid coil arranged so as to surround the outside of the outer circumferential magnetic pole. Using a magnetic pole structure in which the direction of magnetization of the magnetic pole and the intermediate magnetic pole is arranged so that the target center line faces the axis of symmetry, and the magnetic force of the outer magnetic pole is relatively weaker than the magnetic force of the inner magnetic pole,
By making the vertical magnetic field component on the top surface of the target gentle, it is possible to increase the region where the vertical magnetic field component is approximately zero, and it is possible to move the plasma with a small amount of convoluted magnetic field from the outer solenoid coil. With a realizable solenoid coil cooling structure, the plasma generation area can be expanded or contracted with respect to the center line of the rectangular target without significantly changing the discharge state, dramatically improving target usage efficiency. .

0012

[Operation] By combining the leakage magnetic field generated by the inner circumferential magnetic pole, outer circumferential magnetic pole, and intermediate magnetic pole placed on the back of the target with the magnetic field generated by the outer circumferential solenoid coil, the plasma ring formed on the upper surface of the target is directed toward the target center. The rectangular target is sputtered while expanding and contracting, and a film is formed on the substrate as it passes. Then, the vertical magnetic field component on the upper surface of the target was made to have a gentle slope, so that the region where the vertical magnetic field component was approximately zero was made large.

[0013]

[Embodiment] An embodiment of the present invention will be explained with reference to FIG. FIG. 1 shows the main structure of the present invention, and FIG. 2 shows the relationship between the erosion pattern of the target and the manipulation of the leakage magnetic field distribution on the upper surface of the target. In FIGS. 1 and 2, the same reference numerals as in FIGS. 4 and 5 indicate the same components as in FIGS. 4 and 5.

In FIGS. 1 and 2, 17A is an inner magnetic pole arranged in a ring shape (racetrack shape) with the axis of symmetry about the target center line, and 17B is the same axis of symmetry that surrounds the outside of the inner magnetic pole 17A. The outer magnetic poles are arranged in an annular manner,
17C is an intermediate magnetic pole arranged in an annular manner between the inner circumferential magnetic pole 17A and the outer circumferential magnetic pole 17B with the same axis of symmetry, and 18 is an outer circumferential solenoid coil arranged so as to surround the outer circumferential magnetic pole with the same axis of symmetry. Yes, inner magnetic pole 17A and outer magnetic pole 17
The magnetization directions of B and the intermediate magnetic pole 17C face the target center line with the axis of symmetry. 19A is a horizontal magnetic field component on the top surface of the target when the outer solenoid coil 18 is not excited, 20A is a vertical magnetic field component on the top surface of the target in that case, 21A is a schematic diagram of magnetic lines of force for confining plasma in that case, and 22A is a diagram on the top surface of the target. magnetic field lines 2
A schematic diagram of a racetrack-shaped plasma ring confined by 1A, 23A is the target erosion pattern in that case, and 19B is the upper surface of the target when the outer solenoid coil 18 is excited in the positive direction (the direction in which the lines of magnetic force go toward the inside of the coil). 20B is the vertical magnetic field component on the upper surface of the target in that case, 21B is a schematic diagram of the magnetic lines of force for confining the plasma in that case, 22B is a diagram of the racetrack-shaped plasma ring confined on the upper surface of the target by the magnetic lines of force 21B. In the figure, 23B is the target erosion pattern in that case, 19C is the horizontal magnetic field component on the top surface of the target when the outer solenoid coil 18 is excited in the negative direction (the direction in which the lines of magnetic force are directed to the outside of the coil), and 20C is the target erosion pattern on the top surface in that case. Vertical magnetic field component, 21C is a schematic diagram of the magnetic field lines for confining the plasma in that case, 22C is the magnetic field line 21C on the top surface of the target
23C is a schematic diagram of a racetrack-shaped plasma ring confined by 23C, the target erosion pattern in that case, 24 shows a racetrack-shaped plasma ring 22A to 2
This is a target erosion pattern comprehensively obtained by expanding and contracting from 2B to 22C.

Similar to the prior art, the substrate 3 is carried into the vacuum chamber 1 via the gate valve, heated by the substrate heater 2, and then passed over the target surface at a constant speed by the transfer mechanism. At that time, the leakage magnetic field generated by the inner circumferential magnetic pole 17A, the outer circumferential magnetic pole 17B, and the intermediate magnetic pole 17C arranged on the back of the target is combined with the magnetic field generated by the outer circumferential solenoid coil 18, thereby forming a plasma ring on the upper surface of the target. As shown in 22B to 22C, a rectangular target 5 is sputtered while being expanded and contracted relative to the center of the target, and a film is formed on the substrate 3 as it passes. Since the position of the approximately V-shaped valley where target erosion is noticeable can be expanded or contracted with respect to the center of the target, the target can be used effectively.

FIG. 2 shows the magnetic field distribution on the upper surface of the target and the target erosion pattern. In order to move the position of the approximately V-shaped valley where target erosion is noticeable, the vertical magnetic field component 20A is increased or decreased from 20B to 20C. However, since the vertical magnetic field component at the position crossing the zero point has a gentle slope compared to the plasma-controlled sputtering equipment shown in Figure 8, it is possible to expand and contract the plasma with a small convoluted magnetic field. As a result, the horizontal magnetic field component 19A hardly changes from 19B to 19C, and the plasma movement has almost no influence on the discharge state. Therefore, there is no film quality distribution, and
Since only a small convoluted magnetic field is required, the load on the solenoid coil is small, the desired generated magnetic field can be obtained with a feasible cooling structure, and the target can be used effectively, making it possible to reduce the burden on expensive targets. It is effective for low-cost film formation on large-area substrates when using

Next, an embodiment of the present invention will be explained using the following operating conditions. (Comparative example 1) Target external dimensions are 8 inches x 25 inches, thickness 6 mm, magnetic pole structure is conventional method, center magnetic pole is bar-shaped rare earth magnet with width 18 mm, height 28 mm, length 400 mm, residual magnetic flux density 10000 Gauss, upper surface is arranged so that it becomes the north pole. The outer magnetic pole is a rare earth magnet having a width of 18 mm, a height of 28 mm, and an approximate shape of 600 mm x 200 mm, and has a residual magnetic flux density of 10,000 Gauss, and is arranged so as to surround the outside of the central magnetic pole so that the upper surface becomes the S pole. The relative magnetic permeability of the magnetic yoke that magnetically couples the central magnetic pole and the outer magnetic pole was 2500, and copper was used as the target. Figure 6(A) shows the leakage magnetic field distribution on the top surface of the target.
FIG. 6(B) shows the erosion pattern of the target. The target erosion pattern was approximately a V-shaped valley, and the target utilization rate was as low as 18%.

(Comparative Example 2) In the conventional magnetic pole structure of Comparative Example 1, the wire diameter was 3 mm, the number of turns was 130, the cross-sectional shape was 50 mm x 40 mm, and the external dimension was 5.
An inner circumferential solenoid coil approximately in the shape of a mouth measuring 30 mm x 150 mm is arranged. There is a wire diameter of 3m on the outside of the outer magnetic pole.
An approximately mouth-shaped outer circumferential solenoid coil with a cross-sectional shape of 50 mm x 40 mm and external dimensions of 720 mm x 350 mm is arranged. FIG. 9(A) shows the leakage magnetic field distribution on the upper surface of the target, and FIG. 9(B) shows the erosion pattern of the target. In the figure, the subscript #1 indicates that the excitation current to the inner solenoid coil is +(
(plus) 40 A, and an excitation current of + (plus) 20 A to the outer solenoid coil (positive direction of excitation current: direction in which the lines of magnetic force go toward the inside of the coil). Items with suffix #2 have an excitation current of -(minus) 30A to the inner solenoid coil, and -(minus) 40A to the outer solenoid coil (minus direction of excitation current: towards the outside of the coil). (in the direction in which the lines of magnetic force are heading). Those marked with subscript #3 are
This is the case where no excitation current flows through either the inner or outer solenoid coil.

By manipulating the excitation current to the solenoid coil, the position of the approximately V-shaped valley where the target is markedly eroded can be expanded or contracted with respect to the target center line, thereby improving the target utilization efficiency by 40%. However, in order to move the plasma, a large convoluted magnetic field with a perpendicular magnetic field component of ±300 Gauss is required, and a coil with a realizable cooling structure can only last for one hour of continuous operation. Furthermore, by convolving the magnetic fields from the coils, the horizontal magnetic field component also changed, which affected the discharge state, with the discharge voltage ranging from 350v to 580v. For example, for film types such as transparent conductive films whose film quality is affected by discharge conditions, the film quality will vary as plasma is moved within the film.

(Example) The target dimensions and material used were the same as in the comparative example. The magnetic pole structure of the present invention has an inner circumference magnetic pole with a cross-sectional shape of 29 mm x 40 mm and an external dimension of 400 m.
It is a rare earth magnet having a substantially □ shape of m x 60 mm, has a residual magnetic flux density of 10,000 Gauss, and has north poles facing each other so that the target center line is the axis of symmetry. The cross-sectional shape of the outer magnetic pole is 15 mm x 40 mm, and the external dimensions are 600 mm x 20.
0mm approximately □-shaped rare earth magnet with residual magnetic flux density of 60
00 Gauss has a relatively weak magnetic force compared to the inner circumferential magnetic pole, and the north poles face each other so that the target center line becomes the axis of symmetry. The cross-sectional shape of the intermediate magnetic pole between the inner magnetic pole and the outer magnetic pole is 48 mm x 25 mm, and the external dimension is 500 mm.
It is a rare earth magnet in the shape of approximately □ x 150 mm, has a residual magnetic flux density of 10,000 Gauss, is 35 mm farther from the backing plate than other magnetic poles, and has N poles facing each other so that the target center line becomes the axis of symmetry. Furthermore, on the outside of the outer magnetic pole, the wire diameter is 3 mm, the number of turns is 130, the cross section is 50 mm x 40 mm, and the external dimensions are 720 mm x 35 mm.
A solenoid coil having an approximately square shape with a diameter of 0 mm is arranged.

FIG. 3(A) shows the leakage magnetic field distribution on the upper surface of the target, and FIG. 3(B) shows the erosion pattern of the target. In the diagram, the subscript #1 indicates that the excitation current to the outer solenoid coil is + (plus) 20A (
This is when the excitation current is passed in the positive direction (the direction in which the lines of magnetic force are directed towards the inside of the coil). The subscript #2 indicates the case where an excitation current of - (minus) 20 A (minus direction of excitation current: direction in which the lines of magnetic force are directed toward the outside of the coil) is applied to the outer circumferential solenoid coil. The subscript #3 indicates the case where no excitation current is passed through the outer solenoid coil. By manipulating the excitation current to the outer solenoid coil, the position of the approximately V-shaped valley where the target is markedly eroded can be expanded or contracted with respect to the target center line, thereby improving target utilization efficiency by 45%. In addition, in order to move the plasma, the vertical magnetic field component is ±5
Since only a small convoluted magnetic field of 0 Gauss is required, continuous operation is possible with a coil with a feasible cooling structure. Furthermore, by convolving the magnetic fields from the coils, the horizontal magnetic field component hardly changes, and the discharge state changes only slightly, with the discharge voltage ranging from 350v to 375v.

[0022]

[Effects of the Invention] In the present invention, the plasma can be expanded and contracted by the outer circumferential solenoid coil with a small convoluted magnetic field that does not affect the discharge state. It is possible to scale and move the target, allowing for effective use of the target. In addition, by combining the leakage magnetic field generated by the inner circumferential magnetic pole, outer circumferential magnetic pole, and intermediate magnetic pole placed on the back of the target with the magnetic field generated by the outer circumferential solenoid coil, the plasma ring formed on the upper surface of the target is directed toward the target center. A rectangular target can be sputtered while being expanded or contracted, and the vertical magnetic field component on the upper surface of the target can be made to have a gentle gradient, so that the region where the vertical magnetic field component is approximately zero can be made large. The plasma can be expanded and contracted with a small convoluted magnetic field, and the horizontal magnetic field component hardly changes accordingly, meaning that the plasma movement has almost no effect on the discharge state. Therefore, there is no film quality distribution, and since only a small convoluted magnetic field is required, the load on the solenoid coil is small, and the desired generated magnetic field can be obtained with a feasible cooling structure. Targets can be used more effectively, and even when expensive targets are used, they can be used to form films at low cost on large-area substrates.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of an embodiment of an apparatus for carrying out the method of the invention.

FIG. 2 is a diagram showing the relationship between the manipulation of the leakage magnetic field distribution on the upper surface of the target and the erosion pattern of the target in one embodiment of the present invention.

FIG. 3(A) is a diagram showing a leakage magnetic field distribution state on the upper surface of a target in one embodiment of the present invention.

FIG. 3(B) is a cross-sectional view of a target showing an erosion pattern of the target in one embodiment of the present invention.

FIG. 4 is a longitudinal sectional view showing a first example of a conventional device similar to the present invention.

FIG. 5 is a diagram showing the relationship between the manipulation of the leakage magnetic field distribution to the upper surface of the target and the erosion pattern of the target in the first example.

FIG. 6(A) is a diagram showing the leakage magnetic field distribution state on the upper surface of the target in the first example.

FIG. 6(B) is a cross-sectional view of the target showing the erosion pattern of the target in the first example.

FIG. 7 is a longitudinal sectional view showing a second example of a conventional device similar to the present invention.

FIG. 8 is a diagram showing the relationship between the manipulation of the leakage magnetic field distribution to the upper surface of the target and the erosion pattern of the target in the second example.

FIG. 9(A) is a diagram showing the leakage magnetic field distribution state on the upper surface of the target in the second example.

FIG. 9(B) is a cross-sectional view of the target showing the erosion pattern of the target in the second example.

[Explanation of symbols]

1 Vacuum vessel 2 Substrate heater 3 Substrate 4 Shutter 5 Rectangular target 6 Rectangular cathode 7A Central magnetic pole 7B Outer magnetic pole 8 Magnetic yokes 9A, 9B, 9C Magnetic lines of force 10A, 10B, 10C Racetrack plasma ring 11 High voltage power source for main discharge 12A , 12B, 12C Horizontal magnetic field components on the top surface of the target 13A, 13B, 13C Vertical magnetic field components on the top surface of the target 14A, 14B, 14C Target erosion pattern 1
5A Inner circumferential solenoid coil 15B Outer circumferential solenoid coil 16 Target general erosion pattern 17A Inner circumferential magnetic pole 17B Outer circumferential magnetic pole 17C Intermediate magnetic pole 18 Outer circumferential solenoid coil 19A, 19B, 19C Horizontal magnetic field component on the upper surface of the target 20A, 20B, 20C Vertical magnetic field on the upper surface of the target Components 21A, 21B, 21C Magnetic field lines 22A, 22B, 22C Racetrack-shaped plasma ring

Claims (2)

[Claims] Claim 1: An inner circumferential magnetic pole arranged in an annular manner with the center line in the long axis direction of a rectangular target as an axis of symmetry, and an outer circumference arranged annularly so as to surround the outside of the inner circumferential magnetic pole with the same axis of symmetry. It consists of a magnetic pole, an intermediate magnetic pole arranged in an annular manner between the inner circumferential magnetic pole and the outer circumferential magnetic pole, and an outer circumferential solenoid coil arranged so as to surround the outside of the outer circumferential magnetic pole. The direction of magnetization of the target is arranged so that the center line of the target faces the axis of symmetry, and
By using a magnetic pole structure in which the magnetic force of the outer circumferential magnetic pole is relatively weaker than the magnetic force of the inner circumferential magnetic pole, and by creating a gentle slope of the vertical magnetic field component on the top surface of the target, the outer solenoid coil does not affect the discharge state. A pass-through sputtering method in which plasma is expanded and contracted using a slightly convoluted magnetic field. [Claim 2] An inner circumferential magnetic pole arranged in an annular manner with the center line in the long axis direction of the rectangular target as an axis of symmetry, and an outer circumference arranged annularly so as to surround the outside of the inner circumferential magnetic pole with the same axis of symmetry. It consists of a magnetic pole, an intermediate magnetic pole arranged in an annular manner between the inner circumferential magnetic pole and the outer circumferential magnetic pole, and an outer circumferential solenoid coil arranged so as to surround the outside of the outer circumferential magnetic pole. The direction of magnetization of the target is arranged so that the center line of the target faces the axis of symmetry, and
A pass-through sputtering apparatus characterized by a magnetic pole structure in which the magnetic force of the outer circumferential magnetic pole is relatively weaker than the magnetic force of the inner circumferential magnetic pole, so that the vertical magnetic field component on the upper surface of the target can be made to have a gentle gradient.