JP2910952B2 - Pass-through sputtering method and apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pass-through sputtering method and apparatus, and relates to a position of a substantially V-shaped valley where target erosion is remarkable with a slight superimposed magnetic field that does not affect the discharge voltage, that is, a vertical magnetic field on the target upper surface. The present invention relates to a film forming apparatus characterized by a cathode structure in which a position at which a component crosses a substantially zero point is enlarged / reduced with respect to the center of a target to enable the target to be effectively used.

[0002]

2. Description of the Related Art In recent years, there has been an increasing demand for uniformly forming a thin film on a large-area substrate using a sputtering apparatus. In a conventional magnetron sputtering apparatus, a plasma ring is formed by a magnetic field leaking from a magnetic pole disposed on the rear surface of the target to the upper surface of the target. However, since the leakage magnetic field (strength for confining the plasma) on the top surface of the target is unevenly distributed, the density of the plasma density varies, and the consumption of the target is remarkably increased in the region where the plasma density is high, thus leading to the life of the target. . For this reason, there is a problem that the utilization rate of the target is low, and in the case of an expensive target, the production cost is increased.

[0003] Conventionally, magnetic circuits for generating a plasma ring as uniformly as possible over a wide range have been improved, but at present, sufficient effects have not been obtained. As a countermeasure, a plasma controlled magnetron sputtering apparatus disclosed in Japanese Patent Application Laid-Open No. Sho 62-114412 was invented. This is because the magnetic field generated by the inner and outer solenoid coils is superimposed on the magnetic field formed by the conventional magnetron magnetic pole to expand and contract the region with high plasma density with respect to the center of the target. However, when expanding and contracting the plasma, the strength of the magnetic field confining the plasma also changes, and as a result, the discharge voltage changes with the movement of the plasma, which affects the deposition conditions. Was. Also, when the target size becomes large, it is necessary to apply a large amount of electric power in order to generate a desired magnetic field with the solenoid coil. However, a large amount of heat was generated from the coil itself, which caused a problem of elucidating an efficient cooling structure. However, there is no improvement that satisfies the contradictory issues of coil insulation and cooling, which limits the power that can be applied to the solenoid coil, and the current situation is that a superimposed magnetic field that allows sufficient plasma movement has not been obtained. is there.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has an object to expand and contract a region having a high plasma density with respect to the center of a target with a slight superimposed magnetic field that does not affect the discharge voltage. It is an object of the present invention to provide a sputtering method and an apparatus which enable effective use of a sputtering method. The problem of the target utilization rate that the present invention intends to solve will be described with reference to the drawings of the conventional sputtering system using a rectangular cathode shown in FIGS. FIG. 4 shows a main structure of the conventional system, and FIG. 5 shows a leakage magnetic field distribution on the upper surface of the target and an erosion pattern of the target. 4 and 5, reference numeral 1 denotes a vacuum vessel, 2 denotes a substrate heater which preheats the substrate to a predetermined temperature, 3 denotes a pass-through substrate on a roller 3A, and 4 denotes an opening adjustable in a substrate passing direction. Shutter, 5 a rectangular target, 6 a rectangular cathode, 7A a rod-shaped central magnetic pole, 7
B is an annular outer magnetic pole arranged so as to surround the central magnetic pole 7A, 8 is a magnetic yoke plate for magnetically coupling the central magnetic pole 7A and the outer magnetic pole 7B, 9A is a schematic diagram of magnetic force lines for containing plasma, 10A. Is a schematic diagram of a racetrack-shaped plasma ring enclosed by magnetic field lines 9A on the upper surface of a rectangular target 5, 11 is a main discharge high-voltage power supply for supplying power to the rectangular cathode 6, 12A is a horizontal magnetic field component on the upper surface of the target 5, 13A is A vertical magnetic field component 14A on the upper surface of the target 5 is a target erosion pattern consumed by the racetrack-shaped plasma ring 10A.

The substrate 3 is carried into the vacuum vessel 1 through a gate valve (not shown), heated by the substrate heater 2, and further passes over the upper surface of the target 5 at a constant speed by the transfer mechanism. At this time, the rectangular target 5 is sputtered by the racetrack-shaped plasma ring 10A generated on the upper surface of the target 5 due to the leakage magnetic field generated by the central magnetic pole 7A and the outer peripheral magnetic pole 7B arranged on the rear surface of the target 5 and formed on the passing substrate 3. Filmed. However, the intensity of the leakage magnetic field on the upper surface of the target has a distribution, and the density of the contained plasma is varied, so that the target erosion has progressed unevenly. FIG. 5 shows the magnetic field distribution on the upper surface of the target and the target erosion pattern. At a position where the vertical magnetic field component 13A crosses substantially zero, the erosion 14A of the target 5 remarkably progresses and is consumed in a substantially V-shaped valley. . For this reason, when the target 5 has a very low utilization rate and uses an expensive target 5, the production cost is increased, which is a serious problem.

Further, the problems of the discharge voltage fluctuation and the coil cooling which the present invention intends to solve will be described with reference to the drawings of the plasma controlled sputtering apparatus proposed as the above-mentioned improvement measures shown in FIGS. FIG. 6 shows a main configuration of a plasma control type sputtering apparatus, and FIG. 7 shows a relationship between operation of a leakage magnetic field distribution on a target upper surface and a target erosion pattern. 6 and 7, the same reference numerals as those in FIGS. 4 and 5 are the same as those described in FIGS. 4 and 5, and the description thereof will be omitted. 15A is an inner solenoid coil arranged between the center magnetic pole 7A and the outer magnetic pole 7B, 15B is an outer solenoid coil arranged so as to surround the outer magnetic pole, 12B is an inner solenoid coil 15A and an outer solenoid coil 1
Horizontal magnetic field component on the upper surface of the target when 5B is excited in the plus direction (the direction in which the magnetic field lines go inside the coil);
13B is a vertical magnetic field component on the target upper surface in that case, 9
B is a schematic diagram of magnetic field lines for containing plasma in that case, 10B is a schematic diagram of a racetrack-shaped plasma ring sealed on the target upper surface by magnetic field lines 9B, 14B is a target erosion pattern in that case, 12
C is a horizontal magnetic field component on the upper surface of the target when the inner circumferential solenoid coil 15A and the outer circumferential solenoid coil 15B are excited in the minus direction (a direction in which the lines of magnetic force are directed outside the coil), 13C is a vertical magnetic field component on the upper surface of the target in that case, 9C Is a schematic diagram of magnetic field lines for containing plasma in that case, 10C is a schematic diagram of a racetrack-like plasma ring sealed by magnetic field lines 9C on the upper surface of the target, 14C is a target erosion pattern in that case,
16 is a race track-like plasma ring of 10B to 10
This is a target erosion pattern that is comprehensively obtained by scaling up and down from A to 10C.

[0007] As in the prior art, the substrate 3 is carried into the vacuum vessel 1 through a gate valve (not shown), heated by the substrate heater 2, and passed over the upper surface of the target at a constant speed by the transfer mechanism. At this time, a plasma ring formed on the target upper surface is formed by superimposing a magnetic field generated by the inner solenoid coil 15A and the outer solenoid coil 15B on a leakage magnetic field generated by the center magnetic pole 7A and the outer magnetic pole 7B arranged on the back surface of the target.
As shown in FIGS. 10A to 10C, the rectangular target 5 is sputtered by moving the plasma in a combination of the position of the plasma and the stay time with respect to the center of the target, and the rectangular target 5 is sputtered. Since the position of the V-shaped valley where the target erosion is remarkable, that is, the position where the vertical magnetic field component on the upper surface of the target crosses the substantially zero point, can be expanded and contracted with respect to the target center, the target 5
Can be used effectively.

FIG. 7 shows the magnetic field distribution on the target upper surface and the target erosion pattern. In order to move the position of the substantially V-shaped valley where the target erosion is remarkable, that is, the position where the vertical magnetic field component crosses the substantially zero point. Vertical magnetic field component 13
A needs to be increased or decreased to 13B to 13C. But,
Accordingly, the horizontal magnetic field component 12A also changes to 12B to 12C and affects the discharge voltage. For this reason, the film forming conditions have changed, and the film quality has been distributed. Further, in order to increase or decrease the vertical magnetic field component 13A on the target upper surface to 13B to 13C, it is necessary to generate a large superimposed magnetic field by the inner and outer peripheral solenoid coils. However, applying a large amount of power to the coil generates a large amount of heat from the coil itself, and efficient coil cooling is essential for continuous operation. Originally, the coil itself has an insulating coating with poor thermal conductivity on the surface of the wire to improve insulation, so the cooling efficiency is extremely poor, that is, a method that satisfies the conflicting issues of insulation and cooling efficiency However, due to insufficient cooling of the coil, it was not possible to continuously generate a magnetic field of a magnitude necessary for moving the plasma.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has been made in consideration of the above-mentioned problems. It is an object of the present invention to provide a sputtering method and an apparatus in which a position where a component crosses a substantially zero point is scaled and moved so that a target can be effectively used. According to the present invention, a center magnetic pole and a peripheral magnetic pole arranged so as to surround the outside of the center magnetic pole are magnetically coupled to each other by a magnetic yoke plate. An inner auxiliary magnetic pole magnetically coupled to the magnetic yoke plate; and an outer magnetic pole disposed outside the inner magnetic auxiliary pole and near the inner magnetic pole to surround the central magnetic pole. And an outer auxiliary magnetic pole magnetically coupled to the magnetic yoke plate and / or an inner or outer auxiliary magnetic pole for adjusting the magnetization strength of the inner and outer auxiliary magnetic poles. By using the magnetic pole structure composed of the installed solenoid coils, the vertical magnetic field component on the top surface of the target is made to have a gentle gradient, so that the solenoid coils arranged around the auxiliary magnetic poles The sputtering is performed by moving the position of the substantially V-shaped valley where the target erosion is remarkable, that is, the position where the vertical magnetic field component crosses the substantially zero point, with a slight superimposed magnetic field amount. With a cooling structure, without greatly changing the discharge voltage,
The plasma dense region can be expanded and contracted with respect to the center line of the rectangular target, and the use efficiency of the target can be greatly improved.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention shown in FIGS. 1 to 3 will be described. 1 to 3, the same reference numerals as those in FIGS. 4 to 7 are the same as those described in FIGS. 4 to 7, and thus description thereof will be omitted. FIG. 1 shows the main configuration of the present invention, and FIG. 2 shows the relationship between the operation of the leakage magnetic field distribution on the target upper surface and the target erosion pattern. 1 and 2
In the figure, 17A is an inner peripheral auxiliary magnetic pole arranged annularly (race track shape) near the outside of the central magnetic pole and magnetically coupled to the magnetic yoke plate, and 17B is near the inner side of the outer magnetic pole and outside of the inner peripheral auxiliary magnetic pole. Annular (race track shape)
And an outer peripheral auxiliary magnetic pole 18 magnetically coupled to the magnetic yoke plate. Reference numeral 18 denotes an outer peripheral auxiliary magnetic pole coil installed around the outer peripheral auxiliary magnetic pole. 19A is a horizontal magnetic field component on the upper surface of the target when the outer peripheral auxiliary pole coil 18 is not excited, 20A is a vertical magnetic field component on the upper surface of the target in that case, 21A is a schematic diagram of magnetic lines of force for containing plasma in that case, 22A is a target. Magnetic field lines 2 on top
Schematic diagram of a racetrack-shaped plasma ring enclosed by 1A, 23A is a target erosion pattern in that case, 19B is a target when the coil 18 for the outer peripheral auxiliary magnetic pole is excited in the plus direction (the direction of the magnetic field lines toward the inside of the coil). The horizontal magnetic field component on the upper surface, 20B is the vertical magnetic field component on the target upper surface in that case, 21B is a schematic diagram of the magnetic field lines for containing the plasma in that case, 22B is the race track-like plasma ring sealed on the target upper surface by the magnetic field lines 21B. A schematic diagram, 23B is a target erosion pattern in that case, 19C is a horizontal magnetic field component on the upper surface of the target when the outer peripheral auxiliary pole coil 18 is excited in a minus direction (a direction in which the lines of magnetic force are directed outside the coil), and 20C is a case in that case. The vertical magnetic field component on the upper surface of the target, 21C is Schematic diagram of the magnetic field lines for containing the plasma in the case of, 22C are field lines 2 to the target top
1C is a schematic view of a racetrack-like plasma ring enclosed by 1C, 23C is a target erosion pattern in that case, 24 is a racetrack-like plasma ring, 22.
It is the target erosion pattern obtained comprehensively by moving it to A to 22B to 22C.

As in the prior art, the substrate 3 is carried into the vacuum vessel 1 through a gate valve (not shown), is heated by the substrate heater 2, and passes over the upper surface of the target at a constant speed by the transfer mechanism. At this time, the magnetic field generated by the outer auxiliary magnetic pole coil 18 is superimposed on the leakage magnetic field generated by the central magnetic pole 7A, the outer magnetic pole 7B, the inner auxiliary magnetic pole 17A, and the outer auxiliary magnetic pole 17B arranged on the rear surface of the target. The plasma ring formed as described above is enlarged and reduced with respect to the center of the target like 22A to 22B to 22C according to the combination of the position of the plasma and the dwell time to sputter the rectangular target 5 and form a film on the substrate 3 passing therethrough. . Since the position of the substantially V-shaped valley where the target erosion is noticeable can be enlarged and reduced with respect to the center of the target, the target can be effectively used.

FIG. 2 shows the magnetic field distribution on the target upper surface and the target erosion pattern. The position of the substantially V-shaped valley where the target erosion is remarkable, that is, the position where the vertical magnetic field component crosses the zero point in a substantially zero state is moved. For this purpose, it is necessary to increase or decrease the vertical magnetic field component 20A to 20B to 20C. However, the vertical magnetic field component at a position crossing the zero point in a substantially zero state is:
Since the gradient is gentler than that in the case of the plasma controlled sputtering apparatus shown in FIG. 7, the position where the vertical magnetic field component crosses the substantially zero point can be expanded and contracted with a slight superimposed magnetic field. Component 19A is 19B
-19C, which is almost the same, and there is almost no influence on the discharge voltage due to the plasma movement. Further, since operation can be performed with a slight superimposed magnetic field, the load on the solenoid coil can be reduced, and a desired generated magnetic field can be obtained with a feasible cooling structure. Further, since the target can be effectively used, the method is effective as a low-cost film formation on a large-area substrate when an expensive target is used.

FIG. 3 shows a second embodiment of the present invention, which is almost the same as the structure shown in FIG. However, the difference is that the inner peripheral auxiliary magnetic pole 17A is magnetized in the opposite direction to the central magnetic pole 7A, and the outer peripheral auxiliary magnetic pole 17B is magnetized in the opposite direction to the outer magnetic pole 7B. In the one shown in FIG.
Almost the same effects as those described with reference to FIG. 2 were obtained.

Although not described in the embodiments of the present invention, the effect of the present invention can be obtained by operating the coil for the inner peripheral auxiliary magnetic pole or the combination operation of the coils for the inner and outer auxiliary magnetic poles. In addition, the structure that can adjust the difference in the distance and relative height between the center magnetic pole and the inner peripheral auxiliary pole, or the difference in the distance and relative height between the outer magnetic pole and the outer peripheral auxiliary pole can be adjusted. Can be finely adjusted. Although the present invention has been described with reference to a rectangular cathode, similar effects can be expected with a circular cathode.

Next, examples and comparative examples of the present invention will be described. (Comparative Example 1) The external dimensions of the target 5 are 8 inches × 25 inches, the thickness is 6 mm, and the magnetic pole structure is the conventional method as shown in FIGS. 4 and 5. The central magnetic pole 7A is 18 mm wide, 28 mm high and long. 4
100mm rod-shaped rare earth magnet with residual magnetic flux density of 10,000G
auss, the upper surface is arranged as an N pole. The outer magnetic pole 7B has a width of 18 mm, a height of 28 mm and 600 mm × 2.
A rare earth magnet with a substantially square shape of 00 mm and a residual magnetic flux density of 1
0000 Gauss, central magnetic pole 7 so that upper surface is S pole
It is arranged so as to surround the outside of A. The magnetic yoke plate 8 for magnetically coupling the center magnetic pole 7A and the outer magnetic pole 7B has a relative magnetic permeability of 2500 and the target 5 is made of copper. FIG. 10A shows the leakage magnetic field distribution on the upper surface of the target.
FIG. 10B shows an erosion pattern of the target 5. The erosion pattern of the target 5 was a substantially V-shaped valley, and the target utilization was a low value of 18%.

(Comparative Example 2) In the conventional magnetic pole structure of Comparative Example 1, as shown in FIGS. 6 and 7, between the central magnetic pole 7A and the outer peripheral magnetic pole 7B, with a wire diameter of 3 mm and 130 turns. Cross section shape 50mm × 40m
An approximately □ -shaped inner peripheral solenoid coil 15A having an outer dimension of 530 mm × 150 mm is disposed. Outside the outer magnetic pole 7B, the wire diameter is 3 mm, the number of turns is 130, the cross-sectional shape is 50 mm × 40 mm, and the outer size is 720 mm × 350 mm.
A substantially square shaped outer peripheral solenoid coil 15B is disposed. FIGS. 11 and 12 (A) show the leakage magnetic field distribution on the target upper surface, and FIG. 12 (B) shows the erosion pattern of the target 5. Those shown in FIG. 11 (A) and those shown in FIG. 12 (B) with a subscript # 1 are:
The excitation current to the inner solenoid coil 15A is + 40A,
Exciting current to outer solenoid coil 15B is + 20A
(Positive direction of exciting current: direction in which lines of magnetic force are directed toward the inside of the coil). In FIG. 11 (B) and FIG. 12 (B), the subscript # 2 indicates that the excitation current to the inner solenoid coil 15A is -30A and the excitation current to the outer solenoid coil 15B is This is a case in which a current of −40 A (a negative direction of the exciting current: a direction in which the lines of magnetic force are directed to the outside of the coil) flows. FIG.
12A and in FIG. 12B, the subscript # 3 is used for the inner and outer solenoid coils 15.
Both A and 15B are those in which no exciting current is passed.
By manipulating the exciting current to the solenoid coils 15A and 15B, the position of the substantially V-shaped valley where the erosion of the target 5 is remarkable can be expanded and contracted with respect to the target center line, so that the target utilization rate can be improved to 40%. However, in order to move the plasma, a large superimposed magnetic field of ± 500 Gauss is required in the vertical magnetic field component, and the coil having the cooling structure that can be realized has only one hour of continuous operation. Further, by convolving the magnetic field generated by the coil, the horizontal magnetic field component also changed, which affected the discharge voltage as in the range of 350 V to 580 V. For example, with respect to a film type such as a transparent conductive film that affects the film quality by a discharge voltage, the distribution of the film quality is caused by moving the plasma.

Example 1 In the conventional magnetic pole structure of Comparative Example 1, a width 2 disposed so as to surround the central magnetic pole 7A 4 mm outside the central magnetic pole 7A.
Inner circumference auxiliary magnetic pole 17 made of a magnetic material having a relative magnetic permeability of 2,500 mm
A is magnetically coupled to the magnetic yoke plate 8. A peripheral auxiliary magnetic pole 17B made of a magnetic material having a relative permeability of 2500 and having a width of 2 mm, which is disposed so as to surround the central magnetic pole 7A, is magnetically coupled to the magnetic yoke plate 8 4 mm inside the peripheral magnetic pole 7B. Around the auxiliary magnetic pole 17B, a coil 18 for an outer peripheral auxiliary magnetic pole having a wire diameter of 3 mm, one step and 12 turns is arranged. 8 and 9A show the leakage magnetic field distribution on the upper surface of the target, and FIG. 9B shows the erosion pattern of the target 5. 8 (A) and FIG. 9 (B), the subscript # 1 indicates that the exciting current to the outer peripheral magnetic pole coil 18 is +
This is a case in which a current of 20 A (a positive direction of the exciting current: a direction in which the magnetic force lines are directed inside the coil) flows. 8B and in FIG. 9B, the subscript # 2 indicates that the excitation current to the outer peripheral auxiliary pole coil 18 is -20 A (the negative direction of the excitation current: This is the case where the magnetic flux flows toward the outside of the coil. FIG.
9A and in FIG. 9B, the subscript #
The reference numeral 3 indicates a case where no exciting current is applied to the outer peripheral auxiliary pole coil 18. Solenoid coil 1
By manipulating the exciting current to 8, the position of the substantially V-shaped valley where the erosion of the target 5 is remarkable can be enlarged and reduced with respect to the center of the target, so that the utilization efficiency of the target 5 can be improved to 45%. In addition, since a small convoluted magnetic field of ± 100 Gauss with a vertical magnetic field component is required to move the plasma, continuous operation is possible with a coil having a cooling structure that can be realized. Furthermore, by convolving the magnetic field generated by the coil, the horizontal magnetic field component hardly changes, and the change in the discharge voltage is small, for example, 350 v to 360 v.

(Embodiment 2) In the conventional magnetic pole structure of Comparative Example 1, the outer dimensions are 4 mm × 8 m outside the central magnetic pole 7 A.
m, the residual magnetic flux density is 10,000 Gauss, the upper surface is magnetized to the S pole, and is arranged so as to surround the central magnetic pole 7A.
Inner circumference auxiliary magnetic pole 17A magnetically coupled to magnetic yoke plate 8 by magnetic yoke 8A having relative magnetic permeability of 2500
Are arranged, and the outer dimensions are 4 mm × 8 inside the outer magnetic pole 7B.
mm, residual magnetic flux density of 10,000 Gauss, the upper surface is magnetized to the N pole, and the center magnetic pole 7A and the inner peripheral auxiliary magnetic pole 1
An outer peripheral auxiliary magnetic pole 17B is disposed so as to surround 7A and is magnetically coupled to the magnetic yoke plate 8 by a magnetic yoke 8B having a relative magnetic permeability of 2500. Further, the circumference of the outer peripheral auxiliary magnetic pole 17B is one step with a wire diameter of 3 mm,
An outer peripheral magnetic pole coil 18 having 12 turns is arranged. Also in this case, almost the same operation and effect as those of the first embodiment were obtained, and the target use efficiency was improved to 45%.
In addition, in order to move the plasma, a vertical magnetic field component of ± 10
Since only a small converging magnetic field of 0 Gauss was required, continuous operation was possible with a coil having a feasible cooling structure. Further, the superposition of the magnetic field generated by the coil hardly changes the horizontal magnetic field component, and the change in the discharge voltage is small, for example, from 350 V to 360 V.

[0019]

As is apparent from the above description, according to the present invention, since the method and apparatus described in the claims are used, the utilization efficiency of the target is improved, and the vertical magnetic field component is reduced. Continuous operation is possible with a coil having a cooling structure that can be realized because only a small convoluted magnetic field is required. In addition, the horizontal magnetic field component hardly changes, and the change in the discharge voltage is slight, so that efficient sputtering can be performed easily and reliably.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing one embodiment of a method and an apparatus of the present invention, showing a main configuration.

FIG. 2 is a diagram showing the relationship between the operation of the distribution of the leakage magnetic field on the upper surface of the target and the target erosion pattern in FIG.

FIG. 3 is an explanatory view showing another embodiment of an apparatus for performing the method of the present invention.

FIG. 4 is an explanatory diagram showing an example of a conventional method and apparatus, and is a diagram showing a main configuration.

5 is a diagram showing a leakage magnetic field distribution on the upper surface of the target and an erosion pattern of the target in FIG.

FIG. 6 is an explanatory diagram showing an example of a partially improved conventional method and apparatus, showing a main configuration.

7 is a diagram showing the operation of the leakage magnetic field distribution on the upper surface of the target and the target erosion pattern in FIG.

FIGS. 8A and 8B are graphs showing a case where the present invention is implemented.
It is a figure which shows the Example of the magnetic field distribution of a get upper surface.

FIG. 9A is a view showing another embodiment of the magnetic field distribution on the upper surface of the target when the present invention is implemented, and FIG. 9B is an embodiment of the erosion pattern when the present invention is implemented. FIG.

10A is a diagram showing an example of a magnetic field distribution on the target upper surface in the conventional method shown in FIGS. 4 and 5, and FIG.
FIG. 4 is a view showing an example of an erosion pattern when the above-mentioned conventional method is performed.

FIGS. 11A and 11B are diagrams showing one example of a magnetic field distribution on the upper surface of a target in an improved type of the conventional method shown in FIGS. 6 and 7. FIG.

12A is a diagram showing another example of the magnetic field distribution on the upper surface of the target in the improved type of the conventional method shown in FIGS. 6 and 7, and FIG. 12B is a diagram in the improved type of the conventional method. It is a figure which shows an example of an erosion pattern.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Vacuum container 2 Substrate heating heater 3 Substrate 4 Shutter 5 Rectangular target 6 Rectangular cathode 7A Central magnetic pole 7B Outer magnetic pole 8 Magnetic yoke plate 9A, 9B, 9C Magnetic field lines 10A, 10B, 10C Straced plasma ring 11 Main discharge high voltage power supply 12A, 12B, 12C Horizontal magnetic field component on target upper surface 13A, 13B, 13C Vertical magnetic field component on target upper surface 14A, 14B, 14C Target erosion pattern 15A Inner circumference solenoid coil 15B Outer circumference solenoid coil 16 Total erosion pattern of target 17A Inner circumference auxiliary magnetic pole 17B Outer circumference auxiliary magnetic pole 18 Outer circumference auxiliary magnetic pole coil 19A, 19B, 19C Horizontal magnetic field component on target upper surface 20A, 20B, 20C Vertical magnetic field component on target upper surface 21A, 21B, 21C Magnetic field lines 22A 22B, 22C Les - Struck-shaped plasma rings 23A, 23B, 23C data - target erosion pattern - down 24 data - overall erosion of the target pattern - down

Claims (2)

(57) [Claims] In a pass-through sputtering method using a rectangular target, a central magnetic pole and an outer peripheral magnetic pole arranged so as to surround the outside of the central magnetic pole are magnetically coupled to a magnetron magnetic pole for a rectangular target by a magnetic yoke plate. An inner peripheral auxiliary magnetic pole disposed so as to surround the central magnetic pole near the outer side of the central magnetic pole and magnetically coupled to the magnetic yoke plate; and an outer magnetic pole outside the inner peripheral auxiliary magnetic pole and outside the inner peripheral auxiliary magnetic pole. An outer peripheral auxiliary magnetic pole that is disposed in the vicinity of the inner side of the central magnetic pole so as to surround the central magnetic pole and is magnetically coupled to the magnetic yoke plate; and an inner and outer peripheral for adjusting the magnetization strength of the inner peripheral auxiliary magnetic pole and the outer peripheral auxiliary magnetic pole. Slow the vertical magnetic field component on the top surface of the target by using a magnetic pole structure composed of a solenoid coil installed around one or both of the auxiliary magnetic poles. With a small gradient, the position of the substantially V-shaped valley where the target erosion is remarkable, that is, the vertical magnetic field component on the top surface of the target is substantially reduced with a small superimposed magnetic field amount that does not affect the discharge voltage by the solenoid coil disposed around the auxiliary magnetic pole. A pass-type sputtering method in which a position crossing a zero point is enlarged / reduced with respect to a target center to perform sputtering. 2. A magnetron magnet for a rectangular target in which a central magnetic pole and an outer peripheral magnetic pole arranged so as to surround the outside of the central magnetic pole are magnetically coupled by a magnetic yoke plate in a pass-through sputtering apparatus using a rectangular target. An inner peripheral auxiliary magnetic pole disposed so as to surround the central magnetic pole near the outer side of the central magnetic pole and magnetically coupled to the magnetic yoke plate; and an outer magnetic pole outside the inner peripheral auxiliary magnetic pole and outside the inner peripheral auxiliary magnetic pole. An outer peripheral auxiliary magnetic pole which is disposed in the vicinity of the inner side and surrounds the central magnetic pole and is magnetically coupled to the magnetic yoke plate; and an inner and outer peripheral for adjusting the magnetization strength of the inner and outer auxiliary magnetic poles. A pass-through sputtering apparatus having a magnetic pole structure constituted by solenoid coils installed around both or either of the auxiliary magnetic poles.