JPH0434934Y2 - - Google Patents
Info
- Publication number
- JPH0434934Y2 JPH0434934Y2 JP15449886U JP15449886U JPH0434934Y2 JP H0434934 Y2 JPH0434934 Y2 JP H0434934Y2 JP 15449886 U JP15449886 U JP 15449886U JP 15449886 U JP15449886 U JP 15449886U JP H0434934 Y2 JPH0434934 Y2 JP H0434934Y2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- supply device
- holding arm
- collar
- paste supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Basic Packing Technique (AREA)
- Coating Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15449886U JPH0434934Y2 (en, 2012) | 1986-10-08 | 1986-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15449886U JPH0434934Y2 (en, 2012) | 1986-10-08 | 1986-10-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6362271U JPS6362271U (en, 2012) | 1988-04-25 |
| JPH0434934Y2 true JPH0434934Y2 (en, 2012) | 1992-08-19 |
Family
ID=31074341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15449886U Expired JPH0434934Y2 (en, 2012) | 1986-10-08 | 1986-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434934Y2 (en, 2012) |
-
1986
- 1986-10-08 JP JP15449886U patent/JPH0434934Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6362271U (en, 2012) | 1988-04-25 |
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