JPH04348055A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPH04348055A
JPH04348055A JP3038533A JP3853391A JPH04348055A JP H04348055 A JPH04348055 A JP H04348055A JP 3038533 A JP3038533 A JP 3038533A JP 3853391 A JP3853391 A JP 3853391A JP H04348055 A JPH04348055 A JP H04348055A
Authority
JP
Japan
Prior art keywords
semiconductor
dense
solder bonding
manufacture
enhance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3038533A
Other languages
Japanese (ja)
Inventor
Seiji Miyamoto
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3038533A priority Critical patent/JPH04348055A/en
Publication of JPH04348055A publication Critical patent/JPH04348055A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73253Bump and layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

PURPOSE: To enhance the reliability of a semiconductor device of microchip carrier structure and to enhance the reliability of the manufacturing method of the semiconductor device.
CONSTITUTION: A crystal texture at the outside of a cavity 14 rather than at the inside of the cavity 14 of a solder bonding material 12 which bonds a cap 11 to a base substrate 5 is made dense. The manufacturing method of a semiconductor device is provided with a process to make the solder bonding material 12 dense. Leak passes 13 which are formed in the solder bonding material 12 are cut at a part 12A in which the crystal texture has been made dense. As a result, the leak passes are shut off.
COPYRIGHT: (C)1992,JPO&Japio
JP3038533A 1991-03-05 1991-03-05 Semiconductor device and its manufacture Pending JPH04348055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3038533A JPH04348055A (en) 1991-03-05 1991-03-05 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3038533A JPH04348055A (en) 1991-03-05 1991-03-05 Semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
JPH04348055A true JPH04348055A (en) 1992-12-03

Family

ID=12527919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3038533A Pending JPH04348055A (en) 1991-03-05 1991-03-05 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPH04348055A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199507A (en) * 2009-02-27 2010-09-09 Fujitsu Ltd Packaged device and producing method of packaged device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199507A (en) * 2009-02-27 2010-09-09 Fujitsu Ltd Packaged device and producing method of packaged device

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