JPH0434744U - - Google Patents
Info
- Publication number
- JPH0434744U JPH0434744U JP1990075938U JP7593890U JPH0434744U JP H0434744 U JPH0434744 U JP H0434744U JP 1990075938 U JP1990075938 U JP 1990075938U JP 7593890 U JP7593890 U JP 7593890U JP H0434744 U JPH0434744 U JP H0434744U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead frame
- heat dissipation
- view
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0198—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990075938U JPH0434744U (enExample) | 1990-07-17 | 1990-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990075938U JPH0434744U (enExample) | 1990-07-17 | 1990-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434744U true JPH0434744U (enExample) | 1992-03-23 |
Family
ID=31616957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990075938U Pending JPH0434744U (enExample) | 1990-07-17 | 1990-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434744U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014096432A (ja) * | 2012-11-08 | 2014-05-22 | Mitsubishi Materials Corp | 銅板付きパワーモジュール用基板及び銅板付きパワーモジュール用基板の製造方法 |
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1990
- 1990-07-17 JP JP1990075938U patent/JPH0434744U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014096432A (ja) * | 2012-11-08 | 2014-05-22 | Mitsubishi Materials Corp | 銅板付きパワーモジュール用基板及び銅板付きパワーモジュール用基板の製造方法 |